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SPTS' Sigma fxP PVD solution selected for imec’s 3D system integration program
SPTS Technologies, an Orbotech company, has been named by imec as a new supplier of physical vapor deposition (PVD) solutions for under bump metallization (UBM) and redistribution layer (RDL) processes for next generation fan-out packaging technologies.
Imec has selected SPTS’s Sigma fxP PVD solution as the new process tool of record (PTOR) for low temperature PVD for development of novel fan-out technologies such as flexible micro-bumps for chip scale packaging. “To meet the technical requirements of future micro- and nano-electronics, novel 3D integrated circuit (IC) architectures need to be developed to meet scaling challenges without compromising cost, performance, and power budgets,” stated Kevin Crofton, President of SPTS Technologies and Corporate Vice President at Orbotech. ”Imec works closely with leading semiconductor companies to develop innovative wafer-level packaging architectures that will meet the performance requirements of next generation devices such as application processors that drive virtual reality applications or enable high performance computing for artificial intelligence." Mr Crofton added,” SPTS specializes in UBM/RDL PVD for Flip Chip and fan-out applications, and our low temperature PVD capabilities will support the development of a range of new interconnect technologies at imec, including flexi bumps, to address the scaling and packaging needs of future generations of nano-electronics.”
EUV photoresist company Inpria raises $31 million in funding Inpria, a pioneer in high-resolution metal oxide photoresists for extreme ultraviolet lithography (EUV), has secured USD 31 million in Series C funding from a broad syndicate including two of the biggest names within the semiconductor manufacturing space.
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Global DRAM revenue holds steady in 4Q19 The DRAM inventory finally returned to a relatively normal level for most OEMs in 4Q19 after nearly three consecutive quarters of adjustments, says the DRAMeXchange research division of TrendForce.
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A new production unit for mirror segments for ELT Safran's new production unit at the company's Saint-Benoît facility near Poitiers in central France will make the primary mirror segments for Europe's Extremely Large Telescope (ELT).
A more sustainable approach to semiconductor manufacturing Reuse; that is the key to driving environmental sustainability in global semiconductor manufacturing, says Steven Zhou, CEO of Moov Technologies.Load more news