© Meyer Burger Electronics Production | July 07, 2017
Meyer Burger gets CHF 12 million
REC Group has awarded Meyer Burger a contract for the delivery and installation of the latest generation DW 288 Series 3 diamond wire cutting platform for multi-crystalline silicon block slicing.
The contract value of around CHF 12 million (EUR 11 million) includes the delivery, installation and commissioning as well as service support and on-site training for the DW 288 Series 3 diamond wire cutting platform. Delivery of the equipment will start in the third quarter 2017. Steve O’Neil, CEO of REC Group comments: “As an industry leader for high-power multi-crystalline solar panels for many years, our success is also based on cutting-edge and cost effective manufacturing technology. Choosing Meyer Burger and their outstanding diamond wire cutting technology enables us to continue to provide high-quality solar panels with a strong reliability at a competitive price.” Hans Brändle, CEO of Meyer Burger Technology Ltd: “This important order confirms our excellent long-term relationship with REC and once more demonstrates that Meyer Burger’s DW 288 Series 3 diamond wire cutting technology remains the industry-leading solution for the cost-effective production of solar wafers. The product is highly attractive to customers in both the mono-crystalline as well as the multi-crystalline wafer markets.”
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