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© Meyer Burger Electronics Production | July 07, 2017

Meyer Burger gets CHF 12 million

REC Group has awarded Meyer Burger a contract for the delivery and installation of the latest generation DW 288 Series 3 diamond wire cutting platform for multi-crystalline silicon block slicing.
The con¬≠tract value of around CHF 12 mil¬≠lion (EUR 11 million) in¬≠cludes the de¬≠liv¬≠ery, in¬≠stal¬≠la¬≠tion and com¬≠mis¬≠sion¬≠ing as well as ser¬≠vice sup¬≠port and on-site train¬≠ing for the DW 288 Se¬≠ries 3 di¬≠a¬≠mond wire cut¬≠ting plat¬≠form. De¬≠liv¬≠ery of the equip¬≠ment will start in the third quar¬≠ter 2017. Steve O‚ÄôNeil, CEO of REC Group com¬≠ments: ‚ÄúAs an in¬≠dus¬≠try leader for high-power multi-crys¬≠talline solar pan¬≠els for many years, our suc¬≠cess is also based on cut¬≠ting-edge and cost ef¬≠fec¬≠tive man¬≠u¬≠fac¬≠tur¬≠ing tech¬≠nol¬≠ogy. Choos¬≠ing Meyer Burger and their out¬≠stand¬≠ing di¬≠a¬≠mond wire cut¬≠ting tech¬≠nol¬≠ogy en¬≠ables us to con¬≠tinue to pro¬≠vide high-qual¬≠ity solar pan¬≠els with a strong re¬≠li¬≠a¬≠bil¬≠ity at a com¬≠pet¬≠i¬≠tive price.‚ÄĚ Hans Br√§ndle, CEO of Meyer Burger Tech¬≠nol¬≠ogy Ltd: ‚ÄúThis im¬≠por¬≠tant order con¬≠firms our ex¬≠cel¬≠lent long-term re¬≠la¬≠tion¬≠ship with REC and once more demon¬≠strates that Meyer Burger‚Äôs DW 288 Se¬≠ries 3 di¬≠a¬≠mond wire cut¬≠ting tech¬≠nol¬≠ogy re¬≠mains the in¬≠dus¬≠try-lead¬≠ing so¬≠lu¬≠tion for the cost-ef¬≠fec¬≠tive pro¬≠duc¬≠tion of solar wafers. The prod¬≠uct is highly at¬≠trac¬≠tive to cus¬≠tomers in both the mono-crys¬≠talline as well as the multi-crys¬≠talline wafer mar¬≠kets.‚ÄĚ
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February 15 2019 9:57 am V12.1.1-2