Ad
Ad
Ad
Ad
Ad
Ad
SMT & Inspection | June 02, 2006

Kester to launch new die attach

During the SMT/Hybrid/Packaging show this week Kester released its new die attach.

Kester InnovaBond is a, thermally and electrically conductive die attach and thermal interface material that provides an exceptional combination of high thermal performance, high reliability, and great process flexibility. InnovaBond can be used for attaching power die to leadframes, ceramic or organic substrates.
Ad
Ad
Ad
Ad
Load more news
October 23 2019 1:52 pm V14.6.1-2