© alphaspirit dreamstime.com PCB | June 20, 2016
UTAC, Sarda and AT&S collaborate to improve Data Center energy efficiency
Sarda’s Heterogeneous Integrated Power Stage (HIPS) Employs UTAC’s 3D SiP using the Embedded Component Packaging (ECP) Technology from AT&S for Granular Power Delivery.
“UTAC’s 3D SiP enables Sarda to integrate GaAs switches, silicon driver and passive components in a compact, low-profile package that minimizes parasitics for efficient, high speed operation,” said Bob Conner, CEO and co-founder of Sarda. “UTAC’s collaboration with AT&S (please refer to press release) also provides a full turnkey supply chain assembly and test flow with much needed alignment of roadmaps as well as design rules for 3D SiP solutions with embedded chip in substrate technology.” “System manufacturers are moving from use of discrete components to highly integrated power management solutions to improve power density and energy efficiency. UTAC is very excited in working closely with Sarda and AT&S to demonstrate the benefits of using 3D SiP to reduce footprint and improve electrical and thermal performance,” said Lee Smith, UTAC Vice President of Advanced Package Product Line. “Our collaboration with UTAC maximizes the benefits of utilizing AT&S’ ECP technology for the Sarda HIPS Solution”, stated Michael Lang, CEO of Advanced Packaging at AT&S. “The major ECP advantages compared to standard IC packaging and PCB assembly include a significant form factor reduction, higher reliability, improved thermal management and a fast and easy system integration with high efficiency.”