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Electronics Production |
SUSS MicroTec delivers enhanced coater/developer-system
SUSS MicroTec has recently delivered a newly developed coater/developer tool to an Asian packaging foundry (OSAT).
The system is based on SUSS MicroTec’s ACS300-technology. The ACS300 tool is a modular cluster system designed for clean, reliable and high throughput photolithography applications.
The tool was especially developed to process wafers for Fan-Out Wafer-Level Packaging applications. With this coater/developer system artificially created wafers, which can be larger than 300 mm, can be processed. On embedding chips on an artificial wafer, a certain space has to be ensured between the individual dice, for instance to allow for Fan-Out redistribution layers (RDL).
"We have developed new solutions and processes for cost efficient and high throughput applications for Fan-Out Wafer-Level Packaging,” says Frank P. Averdung, President and CEO of SUSS MicroTec. “Our tailor-made solutions allow customers to move beyond standard processes and applications to drive the technological development in the semiconductor industry further.”