Ad
Ad
Ad
Ad
Ad
Ad
© edhar-yralaits-dreamstime.com Electronics Production | May 15, 2014

SUSS MicroTec delivers enhanced coater/developer-system

SUSS MicroTec has recently delivered a newly developed coater/developer tool to an Asian packaging foundry (OSAT).

The system is based on SUSS MicroTec’s ACS300-technology. The ACS300 tool is a modular cluster system designed for clean, reliable and high throughput photolithography applications. The tool was especially developed to process wafers for Fan-Out Wafer-Level Packaging applications. With this coater/developer system artificially created wafers, which can be larger than 300 mm, can be processed. On embedding chips on an artificial wafer, a certain space has to be ensured between the individual dice, for instance to allow for Fan-Out redistribution layers (RDL). "We have developed new solutions and processes for cost efficient and high throughput applications for Fan-Out Wafer-Level Packaging,” says Frank P. Averdung, President and CEO of SUSS MicroTec. “Our tailor-made solutions allow customers to move beyond standard processes and applications to drive the technological development in the semiconductor industry further.”
Ad
Ad
Ad
Ad
Load more news
October 11 2019 3:09 pm V14.5.0-2