Electronics Production | March 22, 2006

Nepcon to host Lead-Free experience

For 2006, Nepcon will host the 4th installment of the Lead-Free Experience.
A purpose built feature area designed by the SMART Group, the Lead-Free Experience provides an ideal opportunity for engineers to have hands-on experience with all aspects of lead-free materials and production equipment.

Discover the current process experience on:

*soldering inspection
*component requirements
*printed board design
*printed board specification
*product reliability

You can even see and use production equipment using lead-free alternative alloys featuring surface mount and through hole terminations. You will be able to witness many of the issues raised by what is the most significant change in our industry in years.

You can also bring along board designs and have all your questions answered on process issues as part of this unique Lead-Free Experience.


Please note the following: Critical comments are allowed and even encouraged. Discussions are welcome. Verbal abuse, insults and racist / homophobic remarks are not. Such comments will be removed.
Further details can be found here.
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