© Hesse Mechatronics Electronics Production | November 01, 2013

Wedge Wire Bonding Capabilities at productronica

Hesse GmbH, specialist in wedge wire bonding technology for power, automotive, medical, aerospace, RF, microwave, opto, military and consumer electronics, will demonstrate a full range of wedge wire bonding capabilities at Productronica.

{{functions.webify.editors-note}} This press release was published as part of the evertiq productronica coverage.
Hesse GmbH Munich, November 12 – 15th, 2013 Hall B2, Booth 255 New Munich Trade fair
Hesse Mechatronics will demonstrate:
  • Large diameter copper (Cu) heavy wire capability on the Bondjet BJ935 Fully Automatic Heavy Wire Bonder
  • Heavy wire bonder full automation capabilities on the Bondjet BJ935, featuring the only heavy wire bondhead with non-destructive pull test and a unique transducer integrated sensor for 100% quality monitoring in real-time
  • Lead frame indexing on the Bondjet BJ931 High Speed Fully Automatic Dual-Head Wedge Bonder, meeting the latest technology and flexibility demands for automotive and power electronics applications, handling thin and heavy aluminum, copper and gold wire and ribbon on two specialized bond heads that can be changed out in minutes
  • The industry standard for thin wire wedge bonding speed and accuracy with the Bondjet BJ820 High Speed Fully Automatic Fine Wire Wedge Bonder, offering speed of up to 7 wires/sec., accuracy of 1 μm at 3 σ axis repeatability, in addition to the largest work area
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