Axiom Electronics adds 3D X-ray capability

These x-ray capabilities give Axiom Electronics greater ability to examine solder joints for product development, process control, and failure analysis. Solder joint quality and reliability becomes more challenging as component geometries shrink. Preventing solder joint failure and maintaining high-reliability comes down to how well components are soldered during the manufacturing process. Computer tomography enables Axiom to see a complete 3D model of solder joints and other features. This capability is particularly useful for process development (designed experiments) and failure analysis. Small differences in the height of a solder joint, the angle of attachment, or problems with blind or buried vias can result in field failures. These problems should be addressed and prevented in manufacturing before the product is shipped. The 2D and 3D tomography x-ray technologies delivered by the GE Phoenix x-ray machine shortens the inspection cycle and results in improved product reliability.