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Electronics Production | December 07, 2005

"The Formation of Whiskers on<br> Electroplated Tin Containing Copper"

K.-W. Moon, M. E. Williams, C. E. Johnson, G. R. Stafford, C.A. Handwerker, and W. J. Boettinger. These gentlemen at Metallurgy Division, MSEL, NIST, USA, have compiled research results from tests to give us an overview of the tin whisker problems in the electronics manufacturing.
"The probability of whisker growth on as-grown tin(Sn) electrodeposits has been measured as a function of copper(Cu) addition to a commercial bright methanesulfonate electrolyte. To provide reproducible plating conditions and to approximate flow conditions in commercial strip plating, a rotating disk electrode assembly was used. A fixed plating current at 25 °C was used to produce deposits 3 µm and 10 µm thick". Text quoted from pcb007's introduction to the released technical article.

Follow this link to get to the download page at pcb007.com. To download the article right click "Read this article" on the download page to download the pdf.
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