© handmadepictures dreamstime.com Electronics Production | October 10, 2012
Axis Electronics invests in SPI machines
Axis Electronics has invested in two new 3D Solder Paste Inspection (SPI) machines.
The new Cyberoptics SE500 machines will be used to provide 100% inline solder paste inspection for volume, area measurements and height on a variety of complex PCB’s. "The SPI system will provide 3D height, volume and area measurements for all PCB’s ensuring that the printing process is achieves the best possible results for PCB’s with LGA’s, CSP’s, BGA’s, 0201, 01005 and all other complex components with small pad sizes," a company press release said. ‘We reviewed a very wide range of machines before choosing these pieces of kit and we are confident their ease of use and overall capability will be an excellent match for the high mix, high reliability work we do here’ commented Matt Turner, engineering director at Axis Electronics.