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Electronics Production | October 19, 2011

SUSS MicroTec supplies equipment to IDM customer

SUSS MicroTec and TMAT have received a purchase order for SUSS MicroTec’s latest generation of high volume manufacturing temporary bond clusters from a world-leading IDM.

The bonder system is configured to temporarily bond 300mm wafers for 3D integration processes for logic and memory applications using the TMAT adhesive materials and the TMAT process for temporary bonding. TMAT and SUSS MicroTec have been working on process and equipment qualification over the past months in order to adapt the process to the customer specific wafer and process requirements. Installation of the thin wafer handling equipment is scheduled for Q4 2011.
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