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© AT&S PCB | September 05, 2011

AT&S to issue of a corporate bond

Austrian PCB manufacturer AT&S Austria Technologie & Systemtechnik AG intents to issue a corporate bond.
AT&S intents to issue a corporate bond having a volume of EUR 80 million with the possibility of an increase of such volume. It is envisaged that the corporate bond would have a maturity of at least five years. Raiffeisen Bank International AG and Erste Group Bank AG have been mandated as Joint-Lead Managers.

The issuance of any bond is in particular subject to market conditions on the corporate bond markets and successful completion of the prospectus approval process.
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