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PCB | August 31, 2011

Dyconex invests in SEM microscope

Dyconex has invested in a scanning electron microscopy (SEM)
Scanning electron microscope images have a large depth of field and are high resolution, which allows for greater resolution and magnification of closely-spaced, complex features.

The new SEM capability is used to provide enhanced quality inspection of Ultra-HDI circuit board technology as well as for advanced research analysis, such as micro-topography measurement, materials and failure analysis.

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Please note the following: Critical comments are allowed and even encouraged. Discussions are welcome. Verbal abuse, insults and racist / homophobic remarks are not. Such comments will be removed.
Further details can be found here.
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