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Electronics Production | August 23, 2011

Assembléon heads for new markets

In September, Assembléon will make its official appearance in the semiconductor industry. In cooperation with local representative Sigmatek, the pick & place solution provider launches the A-Series Hybrid, a new solution within its A-Series lineup targeting manufacturers in the semiconductor back end industry.
The A-Series Hybrid introduces Assembléon’s proven parallel placement technology to applications like SiP, MCM manufacturing and flip chip bonding. Parallel placement goes hand in hand with Assembléon’s exclusive Programmable Placement Force Control. This avoids a common problem in semicon back end; cracked components due to uncontrolled placement processes. New, and for the semicon industry exclusive features on the A-Series platform of Assembléon are the fluxer dip station and high accuracy cameras.

Patrick Huberts, program manager for the A-Series Hybrid explains: "Where different equipment is currently used in the industry to place chips and known good dies for manufacturing of SiP, MCM and high performance flip chip modules, this can now be done on one single machine. It makes the A-Series Hybrid a true single machine solution, reducing production and investment costs for module manufacturers. And by using the proven technology of parallel placement; it improves the quality of their end products too. Our Hybrid increases a manufacturer’s flexibility by increasing the variety of different types of components placed by one machine. Therefore optimizing the use of valuable floor space, too."

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