Infineon completes CanPAK family

Compared to standard discrete packages, the CanPAK metal ‘can’ construction enables double-sided cooling along with almost no package parasitic inductances. Thermal resistance on the top side of the package is very low (1.5 K/W (Kelvin per Watt) vs. 55K/W for a traditional DPAK), which allows efficient device cooling from still air convection in the power conversion systems of solar energy installations or fan-assisted airflow, which is common in servers for data centers. The advantages of CanPAK are complimented by the performance of OptiMOS MOSFETs, which feature industry’s lowest R DS(on), and Q g across the entire voltage range. Low Gate charge (Q g), results in the lowest switching losses in fast switching applications, like isolated DC-DC converters for telecom applications as well as solar micro inverters and MPP Trackers in solar energy systems. Production release is scheduled for April 2011. OptiMOS 60V-150V in CanPAK comes in R DS(on) classes from 2.8 to 28mOhm. For small quantities (10k units), pricing begins at USD 0.40. ----- Note: CanPAK uses DirectFET technology licensed from International Rectifier.