Freescale reveals technology for intelligent auto applications

Freescale Semiconductor is introducing its next-generation technology to serve the fast-growing automotive intelligent distributed nodes market. Freescale’s new integrated LL18UHV technology, along with existing S12 microcontroller (MCU) system-in-package (SiP) product families, meet the technical and commercial demands of applications in which space requirements and cost need to be minimized, such as window-lifts, sunroofs and motor control. Traditionally, automotive electronic designs have required multiple devices: some created with a high-voltage process to connect to the battery and power actuator outputs, as well as microcontrollers created with a low-voltage digital logic process. This poses a challenge when the end application has physical space limitations. Freesclale's net sales for the third quarter was $1.15 billion. Trailing twelve month adjusted EBITDA was $1.06 billion. “Third quarter results continued our momentum with growth in revenues and profitability for Freescale,” said Rich Beyer, chairman and CEO. “All of our core businesses grew sequentially and year over year, and we continued to solidify our embedded processing solutions leadership with consecutive record quarterly design wins.”