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PCB | April 23, 2010

BASF creates advanced copper plating chemistry for integrated circuits

BASF has created an advanced copper plating chemistry for current and future generation chip technologies.
The chemical solution, which is the direct result of the joint development program with IBM started in June 2007, outperforms other commercially available chemistries.

The two companies are extending their cooperation on setting the parameters for mass production. The related technology, chemicals and materials are expected to be commercialized in mid 2010.
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January 11 2019 8:28 pm V11.10.27-2