Electronics Production | April 22, 2010
Infineon and Fairchild in agreement
Infineon Technologies and Fairchild Semiconductor has entered into a packaging partnership.
The partnership is for their power MOSFETs in the Infineon PowerStage 3x3 or Fairchild MLP 3x3 packages. The compatibility agreement is in response to the need for supply security while balancing the drive towards efficiency and thermal performance in DC-DC conversion.