Tessera and Nanium in licensing agreement

Nanium has now reorganized as an independent company and will focus on providing assembly and test services for the DRAM memory market and other semiconductor products. The initial term of the license agreement runs through the end of 2017. Under the agreement, Nanium has licensed Tessera's semiconductor packaging technology covering a broad range of chip scale, multi chip and flip chip package types. These technologies include integrated circuit devices packaged in "face-down," "face-up," "stacked-die," "package on package," "system-in-package," and "flip chip" formats, utilizing many different types of materials, including packages using either tape- or laminate-based package substrates.