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SMT & Inspection | July 09, 2008

SUSS MicroTec delivers Coat/Develop Cluster to Replisaurus Technologies

SUSS MicroTec has shipped and successfully installed a Gamma coating cluster at Replisaurus Technologies, a provider of a metallization technology called “ElectroChemical Pattern Replication” (ECPR).
The modular coat/bake/develop cluster from SUSS represents the latest generation technology in high volume production spin coating. Gamma systems are designed to maximize performance at the lowest cost of ownership, while delivering consistently uniform results for a variety of applications such as thin and thick resists, BCB, dielectrics or high topographies.

Replisaurus will use the Gamma for applications related to its proprietary ECPRÔ process, a fab-friendly, environmentally-clean metallization process technology, which has extremely fast plating rates. The ECPRÔ process combines the precision and resolution of advanced lithography with the ease and efficiency of electrochemical deposition into one single integrated process solution. ECPRÔ is targeted at key growth markets such as integrated passives, copper pillars and 3D integration.

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