PCB | January 30, 2008

EIPC Summer Conference Dresden 2008

EIPC Summer Conference 2008 and Table Top Exhibition on PCB Technologies, Cost and Innovation in Dresden, Germany between 29 -30 May 2008.
Topics that could be included:
• Global & European PCB market trends
• PCB fabrication success and experience
• Advanced Technology Developments
• Improved performance in high-temperature and high reliability appli cations
• Technology, Processes and Materials for rigid flexible circuits
• Materials for PCBs
• Material for advanced ML PCBs
• State of halogen free laminate in Europe
• Lamination (Standard pressing condition,
• Short cycle pressing HDI layers)
• Multilayer fabrication
• Imaging (conventional and or digital)
• Registration (Inner layer, Outer layer, Solder masking)
• Plating of halogen free laminate
• Chemical processes for environmentally friendly manufacture
• Surface finishes for PCB’s (ENIG, Sn, Ag, HASL, Organic)
• Via hole plugging
• Blind via hole plugging
• Any other topic you feel may be of interest

For more information contact EIPC: Mrs. K. Smit-Westenberg
Tel: 0031-43-3440872 or e-mail:
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