EIPC Summer Conference Dresden 2008

Topics that could be included: • Global & European PCB market trends • PCB fabrication success and experience • Advanced Technology Developments • Improved performance in high-temperature and high reliability appli cations • Technology, Processes and Materials for rigid flexible circuits • Materials for PCBs • Material for advanced ML PCBs • State of halogen free laminate in Europe • Lamination (Standard pressing condition, • Short cycle pressing HDI layers) • Multilayer fabrication • Imaging (conventional and or digital) • Registration (Inner layer, Outer layer, Solder masking) • Plating of halogen free laminate • Chemical processes for environmentally friendly manufacture • Surface finishes for PCB’s (ENIG, Sn, Ag, HASL, Organic) • Via hole plugging • Blind via hole plugging • Any other topic you feel may be of interest For more information contact EIPC: Mrs. K. Smit-Westenberg Tel: 0031-43-3440872 or e-mail: kwestenberg@eipc.org