TI plans massive semiconductor wafer fab expansion

Production at the first new fab could start as early as 2025. Keeping in mind that the site could house up to four fabs, TI says that its total investment potential at the site could reach as much as USD 30 billion and support 3,000 direct jobs over time. "TI’s future analog and embedded processing 300-mm fabs at the Sherman site are part of our long-term capacity planning to continue to strengthen our manufacturing and technology competitive advantage and support our customers’ demand in the coming decades," says Rich Templeton, TI’s chairman, president and CEO in a press release announcing the plans. "Our commitment to North Texas spans more than 90 years, and this decision is a testament to our strong partnership and investment in the Sherman community." The new fabs will complement TI’s existing 300-mm fabs which include DMOS6 (Dallas, Texas), RFAB1 and the soon-to-be-completed RFAB2 (both located in Richardson, Texas), which is expected to start production in the second half of 2022. Additionally, LFAB (Lehi, Utah), which TI recently acquired from Micron, is expected to begin production in early 2023.