© Sivers Semiconductor Business | October 15, 2021
Sivers Semi is gearing up for growth – acquires MixComm
Swedish technology company, Sivers Semiconductors, is looking to take pole position 5G mmWave semiconductors, and the company is taking a major step with the acquisition of US-based mmWave challenger, MixComm Inc.
Sivers Semiconductors will acquire the US-based fabless semiconductor company for USD 135 million. The consideration will be paid through a combination of USD 22.5 million in cash and USD 112.5 million in newly issued Sivers shares. In addition, there is a performance-based earn-out of up to USD 20 million to be paid in new Sivers shares if certain commercial customer milestones are achieved, the Swedish company disclose in a press release. Following the completion, the enlarged Sivers group will become a force to be reckon with in 5G mmWave semiconductors, with strong capabilities and a broad joint IP portfolio of RFIC/BFIC (radio frequency/beam forming integrated circuits) chipsets in a wide variety of mmWave semiconductor technologies, including SiGe (Silicon Germanium) and RF-SOI (RF silicon-on-insulator). Driven by the exponential growth of the wireless connectivity and telecommunications sectors, the semiconductor industry is undergoing a significant technology-based transformation. This is supporting the deployment of new technologies such as the implementation of 5G connectivity, providing opportunities to reach new levels of efficiency and customer value. Founded in 2017, MixComm is headquartered in Chatham, New Jersey and has design centres in Oregon and California. It is an active US participant in the 5G BFIC (repeaters/base stations), SATCOM and radar verticals. The transaction is expected to be completed by mid-Q1 2022. “We have worked closely with the MixComm team to finalize this acquisition and it has been a great pleasure getting to know many of the team members. MixComm has in a short time period been able to build a very impressive customer list as well as sales funnel. MixComm and Sivers have the same philosophy when it comes to building partnerships within the mmWave eco-system and by adding these eco-systems together we will create an even greater combined entity. I would like to welcome MixComm into the Sivers family and look forward to executing on all the exciting plans we have together,” says Anders Storm, Group Chief Executive Officer of Sivers in the press release. “Sivers and MixComm share a vision for mmWave’s impact and potential. Combining with Sivers will accelerate that impact and amplify that potential. The MixComm team is proud of what we have achieved and excited where we will go now as part of the Sivers family,” adds Mike Noonen, Chief Executive Officer of MixComm.
Micron to invest $100 billion in New York megafab Micron says it will invest up to USD 100 Billion to build a megafab in central New York, creating approximately 9,000 direct Micron jobs.
onsemi expands operations in Romania The American semiconductor company is opening a new – 3,000 square metre – design center for semiconductor chips in Bucharest, Romania.
Swedish semiconductor manufacturer plans to increase production following investment round SweGaN, a Swedish manufacturer of custom-made Gallium Nitride on Silicon Carbide (GaN-on-SiC) epitaxial wafers, has completed a Series A financing round totaling SEK 125 million (EUR 12 million).
1,000 GF employee’s to transfer to onsemi following fab sale Back in April of 2019, GlobalFoundries agreed to sell its 300 mm fab in East Fishkill, New York, to onsemi. The sale is now nearing completion and the fab, along with its employees will transfer to onsemi.
Fusion Sourcing Group to represent Intelligent Memory Intelligent Memory (IM), a manufacturer of industrial-grade memory product solutions, has signed Fusion Sourcing Group as its representative in the Northeast United States.
Arm names new Chief Financial Officer Arm has appointed Jason Child as Chief Financial Officer (CFO). Child brings more than 30 years of experience in leadership at high-growth companies and scaling global finance functions to his new role.
Spain launches foundry for III-V semiconductors Spain launches its first commercial foundry for III-V Semiconductors targeting integrated photonics.
Silicon Labs expands in India – opens new office in Hyderabad Silicon Labs has officially inaugurated its new office in Hyderabad, located at Salarpuria Sattva Knowledge City. This new office will also be Silicon Labs' largest global centre for engineering and wireless connectivity innovation.
Poland and Taiwan sign agreement on semiconductor collaboration The Polish Office in Taipei and the Taipei Representative Office in Poland have signed a memorandum of understanding (MoU) to establish the Taiwanese-Polish working group on semiconductors.
Kioxia to adjust flash memory production by 30% at two plants Japan’s Kioxia Corporation says that it will reduce the production volume at two of its flash memory plants.
TI starts production at new 300mm fab in Richardson, Texas Texas Instruments' newest 300-millimeter wafer fab in Richardson, Texas, has started initial production and will ramp output over the coming months.
KLA to build a new R&D and manufacturing facility in Wales KLA Corporation says that it plans to build a new R&D and manufacturing center for the SPTS division, in Newport, Wales, UK.
Additional DoD funding reaches SkyWater US semiconductor foundry SkyWater Technology says that the Department of Defense (DoD) has awarded the company up to USD 99 million as a continuation of the previous initiative to advance onshore production capabilities for strategic radiation-hardened (rad-hard) electronics.
Comet Technologies expands manufacturing in Malaysia Comet Technologies says that it aims to double its production capacity in Malaysia – the company will add 30,000 square feet and about 200 employees to its operations in the country.
Swissbit expands its manufacturing capability in Berlin A new USD multi-million investment will add a new new semiconductor packaging line to Swissbit's electronics production in Berlin, Germany.
Henkel acquires Thermexit business from Nanoramic Henkel has completed the acquisition of the Thermal Management Materials business of Nanoramic Laboratories (Nanoramic) headquartered in Boston, Massachusetts, USA, marketed under the brand Thermexit.
Mobix Labs to acquire EMI Solutions Fabless semiconductor company, Mobix Labs, says it has signed a definitive agreement to acquire EMI Solutions, an Irvine-based manufacturer of electromagnetic interference (EMI) filtering products.
Hexatronic acquires the data center specialist Swedish Hexatronic Group has signed an agreement to acquire 90% of the shares in UK-based Impact Data Solutions Limited (IDS Group).
Kontron AIS takes over LUCOM As of September first, 2022, Kontron AIS GmbH has taken over LUCOM GmbH and thus strengthen its portfolio as an IIoT solution provider for industrial software and industrial automation.
VinFast and Renesas ink strategic partnership Vietnamese EV maker, VinFast, is expanding its collaboration with Japanese semiconductor company Renesas to include automotive technology development of EVs and delivery of system components.
Intel's close to making final selection for new Italian site The Italian government and Intel have reportedly selected the town of Vigasio in the northeastern Veneto region as their preferred site for the company’s future chip factory in Italy.
FPT Software launches chipmaking subsidiary Vietnamese ICT company, FPT Software, announces that it has launched a new chip subsidiary, FPT Semiconductor, meaning that the company is entering the booming semiconductor industry.
Habia Cable opens its brand new Polish production facility Habia Cable has officially inaugurated its new, purpose-built, production facility in Poland.
Astera Labs opens new Vancouver location Connectivity solutions specialist Astera Labs has officially opened Astera Labs Vancouver – a new office and lab to support the company’s development of interconnect technologies for AI and Machine Learning architectures.
Qualcomm's automotive design-win pipeline expands to $30B Qualcomm says that its automotive design-win pipeline has grown to USD 30 billion, driven by increased adoption of the company's Snapdragon Digital Chassis solutions across the auto industry.
Henkel expands South Dakota facility Henkel has broken ground on a 35,000 square-foot expansion of its production facility in Brandon, South Dakota. The expanded facility will add new manufacturing muscles and allow Henkel to increase production of thermal interface materials used to manufacture electronics and electric vehicles.Load more news