© Intel Business | October 11, 2021
UK is off the table for potential Intel fab after Brexit
The UK would have been a potential site for an Intel fab, but not after Brexit, Intel CEO Pat Gelsinger told the BBC.
As previously reported, the US chipmaker is looking to increase its output in the middle of the current ongoing global shortage. In late September the company broke ground on its USD 20 billion capacity expansion in Arizona, which will result in on two new chip factories. When these plans were first announced back in March, the CEO also stated that Intel was looking to accelerate its investments beyond Arizona, and that the next phase of capacity expansions in the U.S., Europe and other global locations would be announced within the year. This was teased further during a keynote at IAA Mobility in Munich, Germany in September this year when he said that the company is “committed to announce our next major mega fab location in Europe and we hope to have this announced before the end of this year.” He explained further that this location would consist of two fabs, which would start the so called “mega site”, which would grow over time, over the next decade or so, to eight fabs. Each of these fabs would represent an investment of EUR 10 billion, which means that Intel’s capacity expansion in Europe is a EUR 80 billion project over the next decade. Where the site will be located is still not decided, but something that is decided is that the UK is not being considered. Pat Gelsinger told the BBC in and interview that the company “absolutely would have been seeking sites for consideration” in the UK, however Brexit had changed this. Post-Brexit, the company is instead looking at EU countries and getting support from the EU. "I have no idea whether we would have had a superior site from the UK," he told the BBC. "But we now have about 70 proposals for sites across Europe from maybe 10 different countries.”
STMicro reports 80% net income growth in 2021 The Semiconductor manufacturer reported fourth quarter net revenues of USD 3.56 billion, gross margin of 45.2%, operating margin of 24.9%, and net income of USD 750 million.
Rohde & Schwarz equips CSA's new EMC and radio labs CSA Group has built a new European headquarters in Plattling in Bavaria, Germany. As part of this project, CSA Group is expanding its testing capabilities for German and European customers.
VAT breaks ground on expansion in Malaysia The developer and manufacturer of vacuum valves has initiated the latest extension of its production facility in Penang, Malaysia.
Toshiba restarts some production following earthquake Toshiba Electronic Devices & Storage Corporation says that it resumed production on the 150-mm wafer line at its Oita operations on January 26. The company had suspended operations at the plant following the earthquakes that occurred off the coast of Kyushu on January 22.
TI revenues increased 19% YoY during Q4 Texas Instruments Incorporated reported fourth quarter revenue of USD 4.83 billion and a net income of USD 2.14 billion.
Agile Analog builds footprint in Asia-Pacific The UK-based analog IP supplier is responding to demand from chip manufacturers in the Asia-Pacific region by establishing its first regional sales and engineering support operation, based in Taipei, Taiwan.
How to use LTspice simulations to account for the effect of voltage dependence Question: How can I take the DC bias effect of multi-layer ceramic capacitors (MLCCs) into account in circuit simulations?
Moov expands and opens second headquarters in Texas Moov, a marketplace for used manufacturing equipment, announces that the company is expanding and making Austin, Texas, the location of its second headquarters.
IVWorks acquires Saint-Gabain’s GaN wafer business South Korean GaN epi-wafer startup, IVWorks announces that it has acquired Saint-Gobain’s GaN wafer business as the company looks to strengthen its competitiveness on the EV market.
Altus signs exclusive partnership with Solderking Capital equipment distributor Altus Group have entered into a strategic exclusive partnership with Solderking, a manufacturer of solders and chemical consumables.
GlobalWafers / Siltronic deal gets Chinese green light GlobalWafers says in an update that it has now obtained merger control clearance from the State Administration for Market Regulation of China regarding its acquisition of Siltronic
Rohm Semiconductor resumes operations in Tianjin Due to the effects of COVID-19, Rohm's plant in Tianjin has been suspended since January 9. However, after receiving approval from the administrative authorities, it has partially resumed operations.
'20% of global chip production should be in Europe by 2030' In a ‘State of the World' special address by President of the European Commission, Ursula von der Leyen, at the World Economic Forum on January 20, the president brought up the fact that the European need for chips will double in the next decade – and that we don’t have the means to supply this.
Renesas reboots equipment after Japanese quake Toshiba wasn't the only electronics company affected by the earthquake that struck the coast of southwestern Japan on January 22. Semiconductor manufacturer Renesas confirms that some equipment halted operation but are being restarted.
Toshiba halts production at chip plant after earthquake Following the major earthquakes that occurred off the coast of Kyushu, Japan on January 22, Toshiba Electronic Devices & Storage Corporation has suspended operations at its semiconductor plant in Oita, southern Japan.
Intel to invest $20 billion in two new Ohio fabs The US chipmaker announces that it will invest more than USD 20 billion to build two new factories and to establish a new epicenter for advanced chipmaking in the Midwest.
Intel's fab 34 gets its first chipmaking tool Intel has started to equip its Fab 34 in Leixlip, Ireland – a USD 7 billion construction project – with its first chipmaking tool.
Manz receives equipment order from semiconductor customer Manz receives order from a new customer within the semiconductor industry. The order consists of equipment for Fan-Out Panel Level Packaging in microchip production.
Point-of-Load DC-to-DC converters solve voltage accuracy, efficiency, and latency issues Question: Why use point-of-load (POL) power supplies where the DC-to-DC converter is as close as possible to the load?
Dukosi partners with GF on battery management silicon Battery Management semiconductor vendor, Dukosi, has partnered with GlobalFoundries to produce feature-rich chips for electric vehicles in the automotive industry.
indie Semiconductor set up sales centre of excellence in Japan indie Semiconductor announces that the company extending its market reach and building up a strategic presence in Japan – targeting the automotive market.
Intel and ASML strengthen their collaboration Intel has made its first purchase order for ASML’s TWINSCAN EXE:5200 system, marking the next step on the path to EUV 0.55 NA (High-NA) introduction.
Investment firm HAL invests in Prodrive Technologies Netherlands-based high-tech electronics company, Prodrive Technologies, announces a minority investment by investment company HAL.
Chroma acquires ESS Chroma ATE Inc. has acquired 100% of the shares of Environmental Stress Systems, Inc. (ESS).Load more news