Products | September 24, 2021
Kontron’s VX3060-S2 takes 3U OpenVPX to next level
Kontron, a leading global provider of IoT/Embedded Computing Technology (ECT), commences first deliveries of its high performance VX3060-S2 Blade PC.
This is a product release announcement by Kontron. The issuer is solely responsible for its content.
Based on 11th Gen Intel® Core™ processors, this underscores Kontron’s strong partnership with Intel, enabling the company to be first to market with a powerful and versatile space-saving 3U VPX single board PC. Kontron’s VX3060-S2 combines robustness, reliability and 15-year-availability with high performance processing, neural network acceleration and powerful graphics capabilities. CPU SKUs included with the Kontron VX3060-S2 are quad core units supporting specialized Vector Neural Network Instructions (VNNI) and Doubled Signal Processing performance (AVX512). The Gen12 Gfx graphics engine ensures maximum performance for computer vision and media processing - twice that of the previous generation. Furthermore, the direct on-chip access to main memory allows exceptional performance from the 96 execution units (EUs), especially when compared to traditional discrete graphics silicon solutions featuring many more EUs. Alain Spors, Director of Products at Kontron, says: “Developers can take advantage of our VX3060-S2 immediately. On a single blade consuming only 12 - 28W of power, the VX3060-S2 is ideal for long-term blade computing deployments in Aerospace, Defense and Transportation – in fact, any innovative embedded application requiring vector neural network acceleration or computer vision. “We are already delivering on numerous requests across a broad spectrum of applications. These include confirmed use cases in proximity surveillance of combat vehicles, tactical communication nodes between aircraft, and certified computers for aeronautics and railways.” Multiple extensions allow developers to more easily address a wide range of demanding mission critical applications. Specific power and temperature monitoring sensors make the VX3060-S2 qualified for safety critical applications. VX3060-S2 can provide Hardware Root of Trust thanks to its TPM module and Kontron SEC-Line elements. For ease of access, the VX3060-S2 pin assignment is compatible with VITA65 OpenVPX Profiles, and supports the SOSA™ standard for expediting avionics certification. Therefore the VX3060 is also able to bring critical new features to existing systems developed in accordance with these standards. A rich Linux™ BSP allows instant evaluation and benchmarking. This includes the source code required to support the VX3060-S2 in any Linux distribution, offering developers an unparalleled ‘out of the box’ experience thanks to CMON-Line, its integrated remotely accessible CBIT service.
Ferrotec to add manufacturing capacity with new plant in Malaysia Ferrotec, a global supplier of materials, components, and precision system solutions, is establishing a new manufacturing facility at Kulim Hi-Tech Park, Kedah, facilitated by the Malaysian Investment Development Authority (MIDA).
Skeleton targets the Polish market – teams up with ZPUE Supercapacitor specialist, Skeleton Technologies, and ZPUE, a Polish manufacturer of electrical devices for electrical power distribution utilities, have entered into a commercial agreement to provide energy storage solutions to the Polish market.
Texas Instruments breaks ground $30 billion investment The semiconductor manufacturer has broken ground on its new 300mm semiconductor wafer fabrication plants in Sherman, Texas – an investment set to create as many as create as many as 3,000 jobs.
ERP partners with Flip to fulfill EOL and Obsolete component solutions Flip Electronics has signed a franchised distributor partnership agreement with ERP Power (ERP) to distribute its End-of Life (EOL) semiconductor products.
Foxconn and DNeX build and operate wafer fab in Malaysia Dagang NeXchange Berhad (DNeX) and Foxconn subsidiary Big Innovation Holdings (BIH), plan to set up a joint venture company to build and operate a new 300mm wafer fab in Malaysia.
Imec and semiconductor partners target greener chip manufacturing Nanoelectronics research and innovation center, imec, says that it has managed to pool together stakeholders from the semiconductor value chain – from companies such as Apple and Microsoft, to suppliers, including ASM, Kurita, SCREEN and Tokyo Electron – to participate in its Sustainable Semiconductor Technologies and Systems (SSTS) research program.
Sponsored content by FusionManufacturers Reassess their Supply Chains Prevailing obstacles since the COVID-19 Pandemic in 2020 have manufacturers reassessing their supply chain strategies. The following major disruptions that occurred entering 2022 added to existing setbacks, or created new ones altogether:
SiPearl reaches milestone – 100 employees The European chip designer has exceeded 100 employees across its six sites in France (Maisons-Laffitte, Grenoble, Massy, Sophia Antipolis), Germany (Duisburg) and Spain (Barcelona).
Renesas to convert closed factory to 300mm wafer fab Renesas plans to conduct a JPY 90 billion (EUR 664 million) investment in its Kofu factory, located in Kai City, Yamanashi Prefecture, Japan. The company closed the factory back in October 2014, but now intends to reopen the fab in 2024 as a 300mm wafer fab.
Arrow names Jörg Strughold as president EMEA components Arrow Electronics announces that Jörg Strughold will take over as president of its components business in EMEA. He succeeds Martin Bielesch who has decided to leave the company.
€14 billion to attract semiconductor players to Germany EUR 14 billion in state support is the German governments new strategy to attract more chipmakers to the country.
10 different companies have expressed interest in Toshiba Back in April 2022, Toshiba Corporation announced that it had resolved to solicit proposals on strategic alternatives from potential investors and sponsors. The Japanese company is seeking to enhance its corporate value and has since the announcement been holding discussions with the potential partners.
TDK expands with new MLCC production site in Japan Japanese TDK Corporation says that it will construct a new production building on the premises of the Kitakami Factory – located in Kitakami city, Iwate prefecture, Japan – in order to to enhance the company's MLCC production.
Avnet breaks ground on German expansion In order to better serve its customers’ local and global needs, Avnet is expanding in two locations in Germany. Avnet Embedded broke ground on a new manufacturing site in Eschbach and Avnet EMEA plans to build its third European logistics centre in Bernburg.
Viettel & Qualcomm team up on 5G infrastructure development Viettel Group and Qualcomm Technologies plans to collaborate and develop a next-generation 5G Radio Unit (RU) with massive MIMO capabilities and distributed units (DUs). This focuses on helping to expedite the development and roll-out of 5G network infrastructure and services in Vietnam and globally.
Applied Materials opens Montana expansion – create 200 new jobs The company has opened its latest expansion in Montana, a new semiconductor manufacturing center set to create 200 jobs in the Flathead Valley.
How to easily select the right frequency generation component Question: What is the right frequency generation component for my application?
Bell Semiconductor is suing companies left and right In late April, Bell Semiconductor, a Pennsylvania-based technology and intellectual property licensing company, filed lawsuits against Micron, Infineon, Nvidia and seven other companies alleging infringement of one of its patents.
Can pre-owned equipment be the way out of the shortage? The global semiconductor supply chain remains under immense pressure. However, major investments are being made to increase capacity and fortify the supply chain for the future – but we wont feel the effect of these investments for years. Adding to the issue, there is not enough chips for the chipmaking machines.
CN Rood takes over ABtronix Test and measurement equipment supplier, CN Rood, expands its position in both Scandinavia and the Belelux via the acquisition of ABtronix, professional T&M equipment.
STMicro supplies SiC tech to Semikron for EV power modules STMicroelectronics has revealed it is supplying SiC technology for the eMPack electric-vehicle power modules from Semikron.
Henkel opens new application center in Silicon Valley Henkel is opening its Application Center in Santa Clara, California designed to support product development for the company's high-tech customers in the Silicon Valley region. The application center will help expedite proof-of-concept initiatives for electronics advances.
Finnish silicon wafer manufacturer invest €400M in new fab An investment of EUR 400 million will result in the creation of 500 new jobs as silicon wafer manufacturer Okmetic plans to build a new production facility next to its current silicon wafer fab in Vantaa, Finland.
Continued strong demand for Infineon amid global uncertainties The German semiconductor power house continues to perform well, reporting a 22% revenue increase for the second quarter of 2022.
Allegro MicroSystems' CEO to retire – successor already appointed Allegro MicroSystems' President and CEO, Ravi Vig, is retiring. Mr. Vig, will retire, effective June 13, 2022, from his roles as President, CEO and a member of the board of directors, which he has held since 2016.
From a distributors point of view – Smith Understanding current market trends, continuous investments in in-house testing and process automation, as well as strategically placed distribution hubs are key factors for mitigating the effects of the current global semiconductor shortage, according to Smith.Load more news