Products | August 24, 2021
Active Clamp Flyback (ACF) Controller for Power Adapters up to 100W
Silanna Semiconductor’s Active Clamp Flyback (ACF) Controller for Power Adapters up to 100W combines industry’s highest integration and operational efficiency with Ultra-Low No-Load Power.
This is a product release announcement by Silanna Semiconductor. The issuer is solely responsible for its content.
Silanna Semiconductor, The Power Density Leader, has launched a new integrated active clamp flyback (ACF) controller that will reduce the operational and no-load/ stand-by power consumption of high-efficiency chargers and adapters while driving down component count, BOM cost and size. The SZ1131 ACF controller is the latest addition to Silanna Semiconductor’s family of CO2 Smart Power™ technologies. These technologies address the ultimate power management challenge facing engineers by simplifying design and improving performance while addressing environmental sustainability goals through more efficient energy use. In the case of the SZ1131, efficiencies of up to 95% across universal (90Vac – 265Vac) input voltages and varying loads, combined with ultra-low no-load power of less than 20mW (including USB-PD applications) significantly reduce overall energy consumption. Mark Drucker, Silanna Semiconductor’s CEO, comments: “This device sets a new benchmark for integration and further re-enforces Silanna’s commitment to combining performance and sustainability. Chargers for smartphones and laptops are often left plugged in, even if they are only charging for a few hours at a time. By focusing on extending efficiency margins against CoC, DoE and other regulatory requirements and driving down no-load power we allow customers to deliver best-in-industry efficiency under varying line, load and temperature conditions at the same time as minimizing ‘vampire’ power.” Silanna’s new ACF controller is targeted at high efficiency and high power density adapters of up to 65W output power with universal input and 100W output power with PFC-support applications, including single-port and multi-port USB-PD fast chargers. Featuring the industry’s highest level of integration, the SZ1131 incorporates an adaptive digital PWM controller, ultra high-voltage (UHV) active clamp FET, active clamp gate driver and startup regulator. The SZ1131 provides the ease-of-design of a simple flyback controller with all the benefits of an ACF design, including recycling the leakage inductance energy of the flyback transformer and limiting the primary FET drain voltage spike during the turn-off events. Employing Silanna Semiconductor’s OptiModeTM digital control architecture, the SZ1131 adjusts the device’s mode of operation on a cycle-by-cycle basis to maintain high efficiency, low EMI, fast dynamic load regulation, and other key power supply parameters in response to varying line voltage and load. An all-silicon 65W USB-PD reference design using the SZ1131 demonstrates a 30W/inch3 power density (uncased) with impressive ~93% low line (90Vac) and > 94% high line (230Vac) efficiencies, while using lower cost components. These include a conventional RM8 transformer, 100V SR FET, minimal clamp capacitor, and a single common mode choke in the input filter. Silanna Semiconductor’s technology-agnostic approach focuses on the ultimate power management challenges and delivers even higher efficiency and power density when paired with GaN primary FETs. Supplied in a 16-pin SOIC package, the SZ1131 offers protection against over-temperature, over-voltage, over-current, over-power and short circuit conditions, and transformer core saturation faults without the need for additional external components. SZ1131 Key Features
- Integrated UHV active clamp FET, active clamp driver and start-up regulator
- Capable of over 95% efficiency
- Flat efficiency across universal (90Vac to 265Vac) input voltage and load
- < 20mW system no-load power consumption
- OptiMode™ cycle-by-cycle adaptive digital control
- Self-tuning valley mode switching (VMS)
- Multi-mode operation (burst mode, QR, VMS)
- > 6 dB EMI margin
- OTP, OVP, OCP, OPP, output short circuit and transformer saturation protection
- Up to 65W output power with universal input and 100W+ output power with front-end PFC
- 16-pin SOIC package
- CO2 Smart Power by Silanna Semiconductor
- High power density AC/DC power supplies
- High-efficiency power adapters
- USB-PD/QC AC/DC power adapters
- Battery chargers for mobile devices
onsemi divests Niigata, Japan fab onsemi continues to execute its "fab-liter" strategy and has completed of the sale of its Niigata, Japan facility to JS Foundry K.K.
Ixana raises $3M with wearable silicon chip Ixana, a wearable hardware company developing high-speed human-computer interfaces, has raised USD 3 million in funding backed by Uncorrelated Ventures, Samsung Next, Evonexus, Paradigm Shift and Hack VC.
STMicro and Soitec cooperate on SiC substrate manufacturing technology STMicroelectronics and Soitec announce the next stage of their cooperation on Silicon Carbide (SiC) substrates, with the qualification of Soitec’s SiC substrate technology by ST planned over the next 18 months.
Pendulum Instruments introduces a 4-channel Frequency Counter/Analyzer Pendulum Instruments, the global expert in time & frequency measurement, analysis, and calibration, announces today the release of the new CNT-104S Multi-channel Frequency Analyzer.
Intel is officially a landowner in Germany The US chip manufacturer has big plans for Europe and Germany in prearticular. The German city of Magdeburg won the lottery when Intel earlier this year announced that it would invest EUR 17 billion euros in a “leading-edge semiconductor fab mega-site”.
Kyocera AVX invests in Hentec/RPS system Kyocera AVX has purchased a Pulsar solderability testing system from Hentec Industries/RPS Automation for its Bangkok, Thailand facility.
Managing obsolescence: FED and COGD agree on cooperation The German Electronics Design and Manufacturing Association (FED) and the Component Obsolescence Group Deutschland (COGD) signed a cooperation agreement at Electronica in Munich.
Trading platform aims to alleviate chip shortage Precogs has launched CHIPSMARKET, an online marketplace for OEM-EMS-ODM businesses to trade chips directly between each other, with brokers, and with distributors.
Richardson portfolio with Gallium Semiconductor Richardson Electronics has entered into a a global distribution agreement with Gallium Semiconductor.
LITEON accelerates – inaugurates phase II Vietnam plant LITEON Technology says that the second phase of its manufacturing facility in Haiphong, Vietnam, has officially been inaugurated.
Layoffs await at GlobalFoundries as the company looks to cut costs The semiconductor manufacturer is planning to reduce its workforce as the company looks to navigate itself through a period of weaker demand and increased costs.
GlobalFoundries to tackle the supply chain with new appointment Ashlie Wallace will lead GlobalFoundries' global supply chain operations, including logistics, supply planning, sourcing, and procurement. She will step into her new role on November 28, 2022.
Filtronic opens new design centre in Manchester Filtronic, a designer and manufacturer of RF-to-mmWave components and subsystems, has recently employed several additional engineers to extend the capabilities of both its design team and its process engineering team. Adding to this expansion, the company has also opened a new design centre in Manchester, UK
Hunan Sanan secures order worth $524 million Hunan Sanan, a Sanan Optoelectronics subsidiary, has signed a procurement letter of intent (LOI) agreement with an automotive partner. Under the agreement, Hunan Sanan will supply USD 524 million worth of SiC chips to the automaker's new electric vehicle product line in the next few years.
The UK is looking into Broadcom’s acquisition of VMware The UK’s Competition and Markets Authority (CMA) is looking into whether chipmaker Broadcom’s USD 61 billion acquisition of VMware may substantially lessen competition.
Heilind's SVP Alan Clapp looks back at 2022 2022 has been a year of challenges for most companies, for connector specialist Heilind these challenges proved to be a "blessing in disguise" as they opened up a lot of customer opportunities due to the supply chain issues.
Cambridge GaN Devices secures funds to scale up The fabless semiconductor company has raised USD 19m in Series B funding. The investment will enable Cambridge GaN Devices (CGD) to begin mass production of its range of GaN transistors for power applications.
EU agree to foot €2.4 billion for satellite internet system The Council and the European Parliament reached a provisional agreement on a regulation establishing the EU's secure connectivity programme for the period 2023-2027.Load more news