© vladek dreamstime.com Business | May 03, 2021
Hprobe receives order for wafer-level magnetic tester
Hprobe, a provider of Automatic Test Equipment (ATE) for magnetic devices, today announced a significant order from a tier-1 semiconductor manufacturer for a wafer-level magnetic tester.
The equipment will be used for research and development of magnetic materials and devices, which represents a very promising technology for MRAM chips and magnetic sensors. “This purchase by a world-famous semiconductor company confirms the unique technology and superior equipment Hprobe provides and highlights the critical role we’ll play in enabling mass production of magnetic devices,” says Laurent Lebrun, CEO of Hprobe in a press release. “We’re absolutely delighted to have this recognition and getting further established in the industry. This sale is also an important testimonial, as we trust the combination of speed, 3D high field generation, and accuracy of our offering is unmatched in the market.” The Hprobe’s IBEX platform is compatible with 200mm and 300mm automated wafer probers, and is dedicated to testing MRAM magnetic tunnel junctions, bit cells based on Spin Transfer Torque (STT-MRAM), Spin-Orbit Torque (SOT-MRAM), and Voltage Controlled (VC-MRAM) technologies. The system is capable of testing at high throughput, both under fast variable 3D magnetic field as well as with ultra-narrow pulsed signals. It contains proprietary technology for wafer-level testing and characterisation of magnetic devices by means of electrical probing, while varying a 3D magnetic field above the device. By applying a very fast sweeping magnetic field in any direction of space, a fast and accurate electrical response is obtained for qualifying the device under test.
STMicro reports 80% net income growth in 2021 The Semiconductor manufacturer reported fourth quarter net revenues of USD 3.56 billion, gross margin of 45.2%, operating margin of 24.9%, and net income of USD 750 million.
Rohde & Schwarz equips CSA's new EMC and radio labs CSA Group has built a new European headquarters in Plattling in Bavaria, Germany. As part of this project, CSA Group is expanding its testing capabilities for German and European customers.
VAT breaks ground on expansion in Malaysia The developer and manufacturer of vacuum valves has initiated the latest extension of its production facility in Penang, Malaysia.
Toshiba restarts some production following earthquake Toshiba Electronic Devices & Storage Corporation says that it resumed production on the 150-mm wafer line at its Oita operations on January 26. The company had suspended operations at the plant following the earthquakes that occurred off the coast of Kyushu on January 22.
TI revenues increased 19% YoY during Q4 Texas Instruments Incorporated reported fourth quarter revenue of USD 4.83 billion and a net income of USD 2.14 billion.
Agile Analog builds footprint in Asia-Pacific The UK-based analog IP supplier is responding to demand from chip manufacturers in the Asia-Pacific region by establishing its first regional sales and engineering support operation, based in Taipei, Taiwan.
How to use LTspice simulations to account for the effect of voltage dependence Question: How can I take the DC bias effect of multi-layer ceramic capacitors (MLCCs) into account in circuit simulations?
Moov expands and opens second headquarters in Texas Moov, a marketplace for used manufacturing equipment, announces that the company is expanding and making Austin, Texas, the location of its second headquarters.
IVWorks acquires Saint-Gabain’s GaN wafer business South Korean GaN epi-wafer startup, IVWorks announces that it has acquired Saint-Gobain’s GaN wafer business as the company looks to strengthen its competitiveness on the EV market.
Altus signs exclusive partnership with Solderking Capital equipment distributor Altus Group have entered into a strategic exclusive partnership with Solderking, a manufacturer of solders and chemical consumables.
GlobalWafers / Siltronic deal gets Chinese green light GlobalWafers says in an update that it has now obtained merger control clearance from the State Administration for Market Regulation of China regarding its acquisition of Siltronic
Rohm Semiconductor resumes operations in Tianjin Due to the effects of COVID-19, Rohm's plant in Tianjin has been suspended since January 9. However, after receiving approval from the administrative authorities, it has partially resumed operations.
'20% of global chip production should be in Europe by 2030' In a ‘State of the World' special address by President of the European Commission, Ursula von der Leyen, at the World Economic Forum on January 20, the president brought up the fact that the European need for chips will double in the next decade – and that we don’t have the means to supply this.
Renesas reboots equipment after Japanese quake Toshiba wasn't the only electronics company affected by the earthquake that struck the coast of southwestern Japan on January 22. Semiconductor manufacturer Renesas confirms that some equipment halted operation but are being restarted.
Toshiba halts production at chip plant after earthquake Following the major earthquakes that occurred off the coast of Kyushu, Japan on January 22, Toshiba Electronic Devices & Storage Corporation has suspended operations at its semiconductor plant in Oita, southern Japan.
Intel to invest $20 billion in two new Ohio fabs The US chipmaker announces that it will invest more than USD 20 billion to build two new factories and to establish a new epicenter for advanced chipmaking in the Midwest.
Intel's fab 34 gets its first chipmaking tool Intel has started to equip its Fab 34 in Leixlip, Ireland – a USD 7 billion construction project – with its first chipmaking tool.
Manz receives equipment order from semiconductor customer Manz receives order from a new customer within the semiconductor industry. The order consists of equipment for Fan-Out Panel Level Packaging in microchip production.
Point-of-Load DC-to-DC converters solve voltage accuracy, efficiency, and latency issues Question: Why use point-of-load (POL) power supplies where the DC-to-DC converter is as close as possible to the load?
Dukosi partners with GF on battery management silicon Battery Management semiconductor vendor, Dukosi, has partnered with GlobalFoundries to produce feature-rich chips for electric vehicles in the automotive industry.
indie Semiconductor set up sales centre of excellence in Japan indie Semiconductor announces that the company extending its market reach and building up a strategic presence in Japan – targeting the automotive market.
Intel and ASML strengthen their collaboration Intel has made its first purchase order for ASML’s TWINSCAN EXE:5200 system, marking the next step on the path to EUV 0.55 NA (High-NA) introduction.
Investment firm HAL invests in Prodrive Technologies Netherlands-based high-tech electronics company, Prodrive Technologies, announces a minority investment by investment company HAL.
Chroma acquires ESS Chroma ATE Inc. has acquired 100% of the shares of Environmental Stress Systems, Inc. (ESS).Load more news