© UMC Business | April 30, 2021
UMC to expand capacity at its 300mm Fab 12A P6 in Tainan
Taiwanese semiconductor foundry, United Microelectronics Corporation (UMC), is planning to expand capacity at its 300mm Fab 12A Phase 6 (P6) in Taiwan’s Tainan Science Park through a collaboration model with several of its global customers. In total NTD 100 billion (EUR 2.96 billion) will be invested to bump up production.
Under the arrangement, the customers will make a deposit that secures their long-term chip supply at P6 using pre-determined pricing. The P6 expansion is scheduled for production in the second quarter of 2023, with total investment for the project earmarked at NTD 100 billion (about EUR 2.96 billion), a press release reads. This investment is in addition to UMC’s previously announced 2021 CAPEX of USD 1.5 billion (EUR 1.24 billion), for which the bulk is allocated towards equipment for the company’s Fab 12A P5 site adjacent to P6, total UMC investment in the Tainan Science Park will reach approximately NTD 150 billion (EUR 4.44 billion) over the next three years. "UMC’s expansion plans follow a return based strategy that focuses on business growth while maintaining sustainable profitability. At the same time, we are constantly exploring innovative methods to enhance the competitiveness of our customers. Recent market dynamics have provided us and our customers an opportunity to reinforce our capital expenditure strategy within our ROI boundary, while trying to alleviate the long term capacity constraint in the supply chain. Within these mature 12" and 8" nodes lies many critical components that play a vital role in the IC supply chain; the combination of these conditions lead us to believe that our role and position as a foundry service are experiencing a structural change that requires an innovative win-win collaboration model in order to help alleviate the industry wide chip shortage,” says Stan Hung, chairman of UMC. SC Chien, co-president at UMC, says in the press release that the P6 site will be equipped with 28nm tools that have the flexibility to produce smaller nodes down to 14nm, and thus create a straightforward migration path to accommodate customers’ future development roadmaps. “Furthermore, the building structure for UMC’s Fab 12A P6 is already built, adding a significant time-to-market advantage versus building a new fab from scratch. We look forward to leveraging our No. 1 worldwide foundry market position in multiple areas such as 28nm OLED driver IC production so we may further strengthen UMC’s semiconductor industry position and capture new market opportunities down the road,” SC Chien says. UMC has operated in the Tainan Science Park since November 1999, when Fab 12A was established. The Fab 12A is currently operating at a capacity of approximately 90'000 300mm wafers per month, with an additional 10'000 wafers per month being installed at P5 starting in 2021. The P6 project will add 27.5'000 more wafers per month production capability when fully equipped. With UMC planning to hire an additional 1'000 employees to support this and other areas of the company’s operations.
Nanya breaks ground on new fab in Taiwan Nanya Technology Corporation has broken ground on its new semiconductor fab in New Taipei City’s Nanlin Technology Park. Once completed, the NTD 300 billion (EUR 9.6 billion) investment will result in an advanced fab with a double-deck cleanroom.
First tool arrive at GlobalFoundries new Singapore fab One year after breaking ground, GlobalFoundries can celebrate a significant milestone on the path to expand its semiconductor manufacturing capacity in Singapore. The first tool has been moved into the company's new facility on its Singapore campus.
Sponsored content by RUTRONIK Elektronische Bauelemente GmbHThe Next Level in Advanced Robotics The key to intelligent, self-controlled industrial and service processes is advanced robotics. Progress in this Future Market relies mainly on better performing electronic elements that make robots more adaptable, perceptive, communicative and mobile, and easier to integrate into processes.
Sivers Semiconductors completes the integration of MixComm Swedish Sivers Semiconductors says it has completed the integration of MixComm, creating a challenger in 5G, SATCOM and radar.
Inventronics to acquire ams Osram digital systems business Inventronics has entered into an agreement to acquire the Digital Systems business in Europe and Asia from ams Osram, a global leader in optical solutions.
Allied Motion Technologies acquires Airex Allied Motion Technologies, a designer and manufacturer of precision and specialty controlled motion products, has acquired Airex, LLC, a privately-owned company providing high precision electromagnetic components and solutions.
Arrow opens new distribution centre in the Netherlands Arrow Electronics has opened a new primary distribution centre (PDC) in Venlo, the Netherlands. The PDC will function as a key hub serving all customers of Arrow’s electronics components business in Europe.
Smith adds 30,000 square feet of space in Houston The distributor of electronic components has officially opened its new global services hub in Houston, Texas. The new location adds 30,000 square feet of space for the company’s services.
Samsung invests in Israeli AI systems & semiconductor company Samsung Ventures has made an investment in NeuReality, an Israeli AI systems and semiconductor company.
Swedes develop new method for manufacturing semiconductor components AlixLabs from Lund, Sweden, has developed a new method for manufacturing semiconductor components with a high degree of packing, eliminating several steps in the manufacturing process - Atomic Layer Etch Pitch Splitting (APS).
Kinetic closes asset purchase agreement with Gain Semiconductor Analog and mixed-signal semiconductor company, Kinetic Technologies, has completed the acquisition of certain assets of Gain Semiconductor Incorporated.
Socionext relocation of its US HQ to Milpitas Fabless SoC supplier, Socionext America Inc. (SNA), has relocated its US headquarters to a34,000 square foot single floor building in the City of Milpitas.
TF-AMD expands with new manufacturing site in Malaysia TF-AMD Microelectronics plans to expand its manufacturing facility in Penang with the construction of a second site at Batu Kawan Industrial Park, Penang. A move set to create more than 3,000 new jobs.
Ericsson boosts distribution center in Malaysia Swedish telecom company, Ericsson, has commissioned a new facility at the Kuala Lumpur International Airport (KLIA) that will expand its regional distribution capacity and role of Malaysia in the company.
Applied Materials acquires of Finland-based Picosun Applied Materials has acquired Finnish atomic layer deposition (ALD) technology specialist Picosun Oy.
Melexis adds new manufacturing and R&D space in Bulgarian In an update on LinkedIn the company states that it has officially opened ints new “high-tech” building in Sofia, Bulgaria. Melexis says that this new facility will contribute to Bulgaria's presence in areas such as microelectronic, automotive, and innovation.
Arduino finds backing among giants Open-source company, Arduino, plans to expand its portfolio of hardware, software, connectivity and developer tools for professionals. To reach its goals the company launched a Series B financing round, raising USD 32 million from the likes of Bosch, Renesas and ARM.
Farnell expands Toshiba portfolio to support design engineers The global distributor says that it has strengthened its global partnership with Toshiba Electronics Europe GmbH (Toshiba), resulting in a significant product line expansion and increased stock holding.
SK hynix pick Lam solution to enhance DRAM production SK hynix has selected Lam Research's dry resist fabrication technology as a development tool for two key process steps in the production of advanced DRAM chips.
Altair expands and acquires Concept Engineering Computational science and artificial intelligence company, Altair, has acquired Concept Engineering, a provider of electronic system visualization software.
Infineon liquidating its entity in Russia One hundred days after the start of the war, Infineon Technologies reaffirms its solidarity with the people of Ukraine. The company states that it made the decision to liquidate its entity in Russia in March already, which is currently being executed.
Newport Wafer Fab deal called-in for national security assessment The acquisition of the UK’s UK's biggest chip plant – Newport Wafer Fab – has been called in for a full national security assessment.
Soitec reports record revenues for 2022 The French designer and manufacturer of semiconductor materials report that its revenue for the full fiscal year of 2022 reached a new all-time record of EUR 863 million.
Atlas Copco acquires provider of semiconductor subfab solutions Swedish Atlas Copco has acquired Qolibri Inc., a company that provides proprietary technologies for semiconductor subfab operations.
Micron plans recruitment spree in Taiwan The US DRAM specialist is reportedly planning to add some 2,000 employees and set up a research and development corridor in Taiwan.
TE Connectivity acquires Kemtron TE advances its capabilities in electromagnetic interference and radio frequency interference shielding via the acquisition of UK-based Kemtron, including its French subsidiary Kemtron Sarl.
LG Innotek to acquire former LG solar factory During an LG Innotek board meeting it was decided that the company would take over the LG Electronics A3 factory in Gumi, South Korea.Load more news