© UMC Business | April 30, 2021
UMC to expand capacity at its 300mm Fab 12A P6 in Tainan
Taiwanese semiconductor foundry, United Microelectronics Corporation (UMC), is planning to expand capacity at its 300mm Fab 12A Phase 6 (P6) in Taiwan’s Tainan Science Park through a collaboration model with several of its global customers. In total NTD 100 billion (EUR 2.96 billion) will be invested to bump up production.
Under the arrangement, the customers will make a deposit that secures their long-term chip supply at P6 using pre-determined pricing. The P6 expansion is scheduled for production in the second quarter of 2023, with total investment for the project earmarked at NTD 100 billion (about EUR 2.96 billion), a press release reads. This investment is in addition to UMC’s previously announced 2021 CAPEX of USD 1.5 billion (EUR 1.24 billion), for which the bulk is allocated towards equipment for the company’s Fab 12A P5 site adjacent to P6, total UMC investment in the Tainan Science Park will reach approximately NTD 150 billion (EUR 4.44 billion) over the next three years. "UMC’s expansion plans follow a return based strategy that focuses on business growth while maintaining sustainable profitability. At the same time, we are constantly exploring innovative methods to enhance the competitiveness of our customers. Recent market dynamics have provided us and our customers an opportunity to reinforce our capital expenditure strategy within our ROI boundary, while trying to alleviate the long term capacity constraint in the supply chain. Within these mature 12" and 8" nodes lies many critical components that play a vital role in the IC supply chain; the combination of these conditions lead us to believe that our role and position as a foundry service are experiencing a structural change that requires an innovative win-win collaboration model in order to help alleviate the industry wide chip shortage,” says Stan Hung, chairman of UMC. SC Chien, co-president at UMC, says in the press release that the P6 site will be equipped with 28nm tools that have the flexibility to produce smaller nodes down to 14nm, and thus create a straightforward migration path to accommodate customers’ future development roadmaps. “Furthermore, the building structure for UMC’s Fab 12A P6 is already built, adding a significant time-to-market advantage versus building a new fab from scratch. We look forward to leveraging our No. 1 worldwide foundry market position in multiple areas such as 28nm OLED driver IC production so we may further strengthen UMC’s semiconductor industry position and capture new market opportunities down the road,” SC Chien says. UMC has operated in the Tainan Science Park since November 1999, when Fab 12A was established. The Fab 12A is currently operating at a capacity of approximately 90'000 300mm wafers per month, with an additional 10'000 wafers per month being installed at P5 starting in 2021. The P6 project will add 27.5'000 more wafers per month production capability when fully equipped. With UMC planning to hire an additional 1'000 employees to support this and other areas of the company’s operations.
GF CEO on Intel rumour: “There’s nothing to that story” In an interview with Jon Fortt from CNBC, GlobalFoundries’ CEO Tom Caulfield sets the record straight regarding the Wall Street Journal’s report of a potential USD 30 billion acquisition by Intel.
Applied Engineering to set up JV operations with Malaysian counterpart US-based Applied Engineering (AE) will be establishing a joint venture (JV) plant with Malaysian counterpart, QES Manufacturing Sdn. Bhd. (QES) in Batu Kawan Industrial Park, Pulau Pinang later this year.
Sponsored content by Shenzen Kinwong ElectronicThe development trend of printed circuit board products and Kinwong's solution With the rapid development of electronic technology in recent years, printed circuit board (PCB) products are pursuing higher heat dissipation capabilities, with high voltage and high current characteristics, and are developing towards high-density interconnection technology (HDI).
GlobalFoundries to build new fab in upstate New York The semiconductor manufacturer says that it will build a new fab in Malta, New York in a private-public partnership. The new fab willl "double the site’s capacity" and create more than 1'000 new direct high-tech jobs.
MKS completes its acquisition of Photon Control MKS Instruments has completed its previously announced acquisition of Photon Control Inc.
Renesas to close its Yamaguchi factory next year Renesas says that it has decided to consolidate the Yamaguchi Factory (located in Ube, Yamaguchi Prefecture in Japan) of its wholly owned subsidiary, Renesas Semiconductor Manufacturing Co., Ltd. at the end of June 2022.
Intel looking to buy GlobalFoundries for $30 billion? US chipmaker Intel is reportedly in talks to acquire semiconductor manufacturer GlobalFoundries for some USD 30 billion, reports the Wall Street Journal citing sources familiar with the matter.
Sponsored content by CMLStrategic solutions to the current material shortage in the PCB industry In the past few month’s PCB laminates and base material costs have seen a dramatic rise. The natural consequences of this inflation besides the higher production costs are the unavailability of certain materials paired with longer delivery lead times. A problem like this will destabilize any supply chain, or that’s what you may think.
A simple way to measure temperature using one GPIO digital interface Question: How can I make an analog measurement if I only have a single GPIO left on the FPGA/microprocessor for my system?
New owner for crystal growth business in Eisenach Jenoptik has sold its crystal growth business to Hellma Materials, and will continue to focus its business on photonic applications. Hellma Materials takes over all 25 employees, and continues all business activities.
Linear Integrated Systems partners with Digi-Key Electronics Linear Integrated Systems, a designer and manufacturer of precision, high-performance, small-signal discrete semiconductors, has entered into a new partnership with Digi-Key Electronics.
Conti invests in Israeli industrial sensing start-up Feelit Continental has acquired a minority stake in the Industry 4.0 start-up Feelit, headquartered in Tel Aviv, Israel. Both companies have agreed not to disclose the amount of the holding.
Skeleton Technologies brings in additional capital On the first of July, Skeleton Technologies, announced the successful closing of a further EUR 29 million in its Series D financing. The total financing in Round D amounts to EUR 70.4 million.
Fingerprint receives follow-on order for its T-Shape sensor Swedish biometrics company, Fingerprint Cards has secured an additional volume order for approximately 250,000 units of T-Shape sensor modules from one of the world’s top three card manufacturers.
Minebea Mitsumi acquires Omron’s of 8-inch fab Minebea Mitsumi’s subsidiary Mitsumi Electric, has entered into an agreement with Omron Corporation for the acquisition of Omron's semiconductor and MEMS fabrication plant in Yasu, Shiga, Japan – as well as its MEMS product development function.
Neonode brings contactless touch to kiosk solution by MiTAC Swedish Neonode will deliver its Touch Sensor Modules (TSMs) to MiTAC Computing Technology Corp. (MCT) who has developed a contactless touch self-service kiosk solution with a 32 inch display featuring Neonode’s TSMs.
Sourceability ink distribution deal with Nexperia Electronic component e-commerce marketplace, Sourcengine, says that it is making components from semiconductor manufacturer Nexperia available worldwide.
SK hynix starts mass production of 1anm DRAM using EUV equipment SK hynix says that it has started mass production of the 8 Gigabit (Gb) LPDDR4 mobile DRAM based on the 1anm, which is the fourth generation of the 10nm process technology this month.
Cirrus Logic to acquire Lion Semiconductor for $335 million Cirrus Logic has entered into an agreement to acquire California-based Lion Semiconductor for USD 335 million in cash. The acquisition brings IP and products for power applications in smartphones, laptops and other devices and accelerates growth of the company’s high-performance mixed-signal business.
Bootstrapping a low voltage Op Amp to operate with high voltage signals and supplies Question: Can I bootstrap a low voltage amplifier to get a high voltage buffer?
Sensirion raises its outlook for full-year 2021 The Swiss manufacturer of digital microsensors and systems raises its outlook for financial year 2021 based on strong demand in the first half of the year.
Altix moves to increase its R&D capabilities Following an increase in manufacturing activity, exposure systems specialist Altix has recently expanded its R&D center located at its French headquarter in Normandy, France.
Micross buys microelectronics business assets of Ultra CEMS Micross Components, a provider of mission-critical microelectronic components and services, is expanding its Hybrid and assembly business with the acquisition of assets of the microelectronics business from Ultra CEMS, a provider of high reliability hybrid electronics engineered for harsh environments.
ITEC emerges as independent semiconductor equipment manufacturer Semiconductor equipment manufacturer ITEC, which was founded in 1991 by Philips (now Nexperia), has announced its launch as a separate independent entity. ITEC will however remain part of the Nexperia group.
LPKF supplies systems to chip manufacturer Technology company LPKF says it has received a follow-up order from the semiconductor industry. An unnamed global chip manufacturer had installed a first LIDE system at the beginning of 2020 and, after a qualification phase, initially used it for its own product development. Now, further systems have been ordered.Load more news