Products | February 18, 2021
More efficiency and precision for high-density applications and SiPs
The new SIPLACE TX micron features more speed, precision and flexibility for advanced packaging and high-density applications.
This is a product release announcement by ASM Pacific Technology. The issuer is solely responsible for its content.
With its improved 20-nozzle SIPLACE SpeedStar high-speed placement head, technology leader ASM has managed to raise the machine’s performance by roughly 23 percent to up to 96,000 components per hour while increasing the component spectrum by 37 percent. A single machine covers the three precision classes of 25, 20 and 15 µm @ 3σ, making it possible to operate with component pitches of as little as 50 µm and place 0201m components at full speed. Special functions for thin-die handling deliver significantly higher yields when assembling system-in-package modules or submodules. Advanced packaging, which is one of today’s key technologies in electronics production, blurs the lines between OSATs, IDMs and “classical” yet demanding SMT applications. In times of rising time, cost and efficiency pressures, the production of SiPs and SoCs as well as the processing of dies and flip-chip modules on high-precision SMT platforms is becoming more common every day. Technology leader ASM aims to meet the requirements of these complex application with a new and heavily improved version of the SIPLACE TX micron. “As the world's largest supplier of equipment to the electronics industry, ASM serves the back-end segment for semiconductor production as well as classical SMT factories,” says Alexander Hagenfeldt, Head of Product Marketing at ASM. “The development of the new SIPLACE TX micron was based on decades of experience and the latest technologies from both fields to raise advanced packaging and high-density applications to a new level of productivity. The new SIPLACE TX micron is the fastest and most precise SIPLACE machine that ASM has ever introduced.” High speed with maximum precision Because the new SIPLACE SpeedStar 20-segment high-speed head can now place up to 48,000 components per hour (cph), the new dual-gantry SIPLACE TX micron achieves a placement performance of up to 96,000 cph. This is made possible by the new placement head as well as by another shortening of its travel paths with a more compact feeder control unit (FCU) and Z-axis travel that has been shortened to two millimeters. Depending on installed options, the SIPLACE TX micron achieves placement accuracies of 25, 20 or 15 µm @ 3σ with minimum component distances of only 50 µm. The highest accuracy class is achieved with a new vacuum tool that features an exchangeable magnetic plate for rapid product changeovers. The new 4-mm versions of the Smart Feeder Xi also make pickups of smallest components and dies faster and more accurate. They use the latest micro-tapes, or the bottoms of the blisters are vacuum-leveled to prevent inclined positions of components within the tape. Thin-die handling further improved Since thin dies, flip-chips and the smallest 0201m components require extremely gentle handling, the entire placement process of the SIPLACE TX micron can be individually programmed for each component and placement position. This includes touchless pickup and zero-force placement. And for sensitive thin dies, the vision system features advanced image processing algorithms such as cracked-die inspection and die-chipping detection. That way, components with hairline fractures and lacerated edges are detected and rejected already during the pickup process. A real space saver The new SIPLACE TX micron delivers all this performance in the smallest possible space. Like its predecessor model, it occupies a footprint of only 2.23 by 1.0 meters (approx. 7.3 by 3.3 feet), it is a particularly attractive option for tight cleanroom environments thanks to its DIN EN ISO 14644-1 Class 7 certification. Ready for the integrated smart factory Like all current ASM solutions, the SIPLACE TX micron features a broad range of M2M and networking capabilities. Open and standardized interfaces such as ASM OIB, IPC-HERMES-9852, IPC-CFX and IPC-SMEMA-9851 allow it to be fully integrated into workflows, higher-level MES/ERP systems, traceability solutions, and the integrated smart factory.
Helios Technologies to acquire the assets of Joyonway Helios Technologies, a motion control and electronic controls specialist, has entered into a definitive agreement to acquire assets related to the electronic control systems and parts business of Shenzhen Joyonway Electronics & Technology Co., Ltd and its related entities.
Teledyne e2v starts cleanroom upgrade Teledyne e2v Semiconductors have laid the first stone to what will become the company's new upgraded semiconductor assembly and test cleanroom at the factory near Grenoble, France.
Sponsored content by Shenzen Kinwong ElectronicThe development trend of printed circuit board products and Kinwong's solution With the rapid development of electronic technology in recent years, printed circuit board (PCB) products are pursuing higher heat dissipation capabilities, with high voltage and high current characteristics, and are developing towards high-density interconnection technology (HDI).
GaN IC company Navitas to go public GaN Power ICs specialis, Navitas Semiconductor, has entered into a definitive agreement to combine with Live Oak Acquisition Corp. II, a publicly-traded special-purpose acquisition company. The transaction, which values the combined entity at $1.4 billion, will result in Navitas becoming a publicly-traded company.
Physik Instrumente continues expansion in Asia Physik Instrumente (PI) is expanding its precision motion offering in the Asia-Pacific region having invested in a new R&D and manufacturing center in Changzhou, China to specifically focus on the local demands in the APAC region.
Overvoltage protection for RTD-based measurement ysstems Question: Is it possible to design a complete RTD module with overvoltage protection?
Ericsson and Samsung sign global patent license agreement Ericsson and Samsung have reached a multi-year agreement on global patent licenses between the two companies, including patents relating to all cellular technologies. The cross-license agreement covers sales of network infrastructure and handsets from January 1, 2021.
Jenoptik secures automation orders in North America Photonics company Jenoptik has secured new automation orders in the US and Canada in the first quarter of 2021 totaling more than 40 million USD that will help increase efficiencies in automotive manufacturing.
Sponsored content by Rochester ElectronicsUncovering the Truth about Semiconductor Counterfeiting Rochester Electronics discusses why AUTHORIZATION is the ultimate tool in the fight against Counterfeit.
In times of supply shortage, or where component obsolescence limits availability, counterfeit devices are more prevalent.
Counterfeiters have moved beyond incorrect logos and packages with no die inside caught by the simplistic visual inspection testing used by those following AS6081. The Counterfeiters now have more sophisticated operations than in the past.
Infineon looking to increase supply of SiC material Infineon says that the company has concluded a supply contract with the Japanese wafer manufacturer Showa Denko K.K. for an extensive range of silicon carbide material (SiC) including epitaxy.
Sources: TSMC is planning five additional fabs in Arizona The worlds biggest semiconductor foundry is reportedly planning to build several new manufacturing facilities in the US, more specifically in Arizona.
Foxconn and Yageo team up to form a semiconductor JV Yageo Group and Foxconn (Hon Hai) Technology Group announces their plans to for a new semiconductor joint venture, XSemi Corporation, for the development and sale of semiconductors.
H. K. Wentworth Group has been acquired MacDermid Alpha Electronics Solutions, a supplier of specialty chemicals and materials used in the semiconductor and PCB markets, has acquired H.K. Wentworth Group, the owner of the Electrolube & AF brands.
EMD Electronics opens new centre of excellence EMD Electronics, a business of Merck KGaA, has inaugurated its new centre of excellence for atomic engineering at Intermolecular's San Jose facility.
Infineon: "The semiconductor market is booming" "The semiconductor market is booming; electronics that help accelerate the energy transition and make work and home life easier remain in high demand. The push for digitalization continues unabated. Infineon is firmly on course to meet its targets for the current fiscal year," says Dr. Reinhard Ploss, CEO of Infineon in the company's quarterly report.
Intel to invest $3.5 billion to expand New Mexico operations The US chipmaker is sinking USD 3.5 billion into its Rio Rancho, New Mexico manufacturing operations to increase its capacity of advanced packaging technologies.
Mobix Labs and Richardson RFPD ink distribution agreement Mobix Labs Inc., a fabless RF (radio frequency) component company focused on next-generation wireless technologies, and Richardson RFPD, an Arrow Electronics company, have entered into a global distribution agreement.
Hprobe receives order for wafer-level magnetic tester Hprobe, a provider of Automatic Test Equipment (ATE) for magnetic devices, today announced a significant order from a tier-1 semiconductor manufacturer for a wafer-level magnetic tester.
Sony starts operations at new fab expansion Sony Semiconductor Solutions Corporation has begun operations on the production lines at the new fab built on the premises of Nagasaki Technology Center in Japan, a production center owned by Sony Semiconductor Manufacturing Corporation.
Optimized power supply measurement setup Question: How can I make sure I’m testing my switching regulator as efficiently as possible?
Vanguard to acquire AU Optronics facility Taiwanese contract chipmaker Vanguard International Semiconductor Corp. has agreed to purchase an 8-inch semiconductor fab (around 48'400sqm) at Hsinchu Science Park for USD 32.5 million.
Mouser adds record 31 new manufacturers to line card The first quarter of 2021 proved to be fruitful start to the year for Mouser Electronics as it bolstered its line card by adding 31 new manufacturers during the first three months of the year.
UMC to expand capacity at its 300mm Fab 12A P6 in Tainan Taiwanese semiconductor foundry, United Microelectronics Corporation (UMC), is planning to expand capacity at its 300mm Fab 12A Phase 6 (P6) in Taiwan’s Tainan Science Park through a collaboration model with several of its global customers. In total NTD 100 billion (EUR 2.96 billion) will be invested to bump up production.
SK hynix is optimistic about the market condition The South Korean semiconductor says that it made better results both QoQ and YoY in the first quarter as the semiconductor market conditions improved earlier this year.
SiPearl launches recruitment plan – aiming for 1'000 by 2025 The Franco-German microprocessor specialist is launching its first recruitment campaign for its sites in Maisons-Laffitte and Sophia-Antipolis, both in France; as well as its German site in Duisburg. The company says it's recruiting 10 engineers per month in France & Germany.Load more news