© ON Semiconductor Business | February 02, 2021
On Semi's CFO to retire - company finds successor at Cypress
Bernard Gutmann, executive vice president and chief financial officer, will retire after a nearly four decade career in finance.
Thad Trent will join ON Semiconductor as executive vice president and chief financial officer (CFO) as of February 16, 2021. Trent joins ON Semiconductor as a nearly 30 year finance veteran of the tech industry. Trent has held several leadership roles throughout his career, most recently as CFO at Cypress Semiconductor responsible for strategic planning, accounting, investor relations, tax, corporate development and information technology. Under his leadership, revenue increased from USD 723 million to USD 2.5 billion and the enterprise value increased by five times within five years. “I have full confidence that Thad’s wealth of experience to the role and a depth of understanding of the transformation underway in our industry will add tremendous value to our organization,” said Hassane El-Khoury, president and CEO at ON Semiconductor, ina press release. “He has the skillset needed to take our company into its next phase as we further focus on accelerating revenue and gross margin while enhancing stakeholder value. We are excited to enter this next phase of growth for the company.” Bernard Gutmann has decided to retire from his position as executive vice president and CFO of the company after a nearly four decade career in finance with ON Semiconductor and Motorola. Gutmann will remain an advisor until April 2021 to ensure a smooth transition. “During the past several decades of my career here, it has been wonderful to be a part of our company’s success and foundation building – starting from my work on the company’s initial public offering (IPO) in 2000,” says Gutmann. “I wish our company a bright future and outlook as I embark on this next phase of my life, focusing on my family in retirement.” “The foundation that Bernard has set during his tenure at our company will enable us to build upon our future strategies,” adds El-Khoury. “We thank Bernard for his dedication to his team, ON Semiconductor and key stakeholders during his tenure at our company.” Earlier this month, Bill Schromm announced his retirement as executive vice president and chief operations officer of the company. With Bill’s departure, ON Semiconductor welcomed Dr. Wei-Chung Wang as executive vice president of manufacturing and operations. Previously, he was executive vice president of worldwide manufacturing and operations at Cypress Semiconductor, responsible for overseeing fab and assembly/test, foundry/subcons, supply chain and packaging development. Wei-Chung elevated Cypress’ operational excellence, managed important transfer and ramp projects, accelerated process and packaging development, in addition to improvements in cost, quality and manufacturing flexibility. During his tenure, Cypress streamlined operations, reduced manufacturing complexity and capital expenditure while supporting revenue growth. Prior to Cypress, Wei-Chung was senior vice president of operations at Fairchild Semiconductor, now part of ON Semiconductor.
SK Hynix ink $4.3 billion deal with ASML The Dutch supplier of semiconductor equipment has signed a five-year long deal, worth USD 4.3 billion, with SK Hynix as the South Korean company works to secure equipment to boost it output.
TSMC ranks in Top10 in three wafer size categories As of December 2020, only TSMC—the world’s largest foundry—was listed among the wafer capacity leaders in each of the three wafer size categories. It had the most 200mm wafer capacity last year and ranked second, trailing only Samsung, in 300mm wafer capacity.
Sponsored content by Shenzen Kinwong ElectronicThe development trend of printed circuit board products and Kinwong's solution With the rapid development of electronic technology in recent years, printed circuit board (PCB) products are pursuing higher heat dissipation capabilities, with high voltage and high current characteristics, and are developing towards high-density interconnection technology (HDI).
Microchip invests $20M in new Irish development centre Up to 200 new engineering jobs will be created in Cork, Ireland as Microchip Technology invests USD 20 million to create a new development centre.
Explosive growth in Automotive DRAM demand expected Driven by such factors as the continued development of autonomous driving technologies and the build-out of 5G infrastructure, the demand for automotive memories will undergo a rapid growth going forward, according to TrendForce’s latest investigations.
Renesas Naka facility is back to full operation Following the earthquake that hit the coast of Fukushima Prefecture and the surrounding areas on February 13, Renesas shut down production at its Naka factory to investigate potential damages. Since then then company has brought the plant back online bit by bit.
Rücker Lypsa is now EDAG Engineering Spain Barcelona-based company Rücker Lypsa S.L. has been operating under the name of "EDAG Engineering Spain, S.L." since January, 2021.
Continental invests in German-US AI chip start-up Continental has acquired a minority stake in the German-US start-up Recogni, a company working on a new chip architecture for object recognition in real time based on artificial intelligence (AI).
Edmund Optics opens new assembly and design facility Edmund Optics, a provider of optical and imaging components, has opened a new Assembly and Advanced Design Facility in Tucson, Arizona, the second Edmund Optics location in the state.
SEMI calls on Biden to reinvigorate US semiconductor manufacturing SEMI, along side 16 industry groups have sent a letter to President Biden urging the administration to bolster domestic semiconductor manufacturing and research.
Solas OLED settles patent disputes with LG Display Solas OLED, an Irish company that specialises in OLED technologies that it licenses to consumer electronics manufacturers, has entered into a Settlement and License Agreement with LG Display, resolving a number of patent infringement actions brought by Solas against LG Display and a certain number of its customers, including Sony.
Panthronics seals global partnership agreement with AdvanIDe Panthronics AG, a fabless semiconductor company specialising in high performance wireless technology, has signed a global partnership agreement with specialist supplier of NFC, RFID and smart card components, AdvanIDe.
Logic ICs account for the largest share of China’s IC market China became the largest IC market in the world in 2005 and has continued to grow in size since then. In 2020, the Chinese IC market increased to USD 143.4 billion, a 9% gain from USD 131.3 billion in 2019.
Why Is my processor leaking power? That sounds like an open-ended question Question: Why is my processor consuming more power than its data sheet suggests?
BAE Systems to produce GPS receivers in Iowa BAE Systems received a USD 247 million contract to design and manufacture an advanced military M-Code GPS receiver and ASIC.
Osram invests in California-based UV LED specialist Osram acquires around 20 percent of US company Bolb Inc. via its venture capital arm Fluxunit. With its investment in the California-based UV-C LED specialist Bolb Inc., Osram is further expanding its technological know-how of disinfection applications with UV-C light.
Cohu's 4000th handler makes its way to Infineon Technologies Back-end semiconductor equipment supplier Cohu has shipped 4000th handler from its manufacturing facility in Melaka, Malaysia. The milestone system, a MATRiX thermal pick-and-place handler was delivered to semiconductor manufacturer Infineon for testing automotive and industrial devices.
NXP is watching the situation in Austin carefully As previously reported, the unusually severe winter weather conditions has crippled power facilities in Texas. Which has led to several Austin semiconductor facilities standing idle without power.
Using A2B for Audio-Conferencing Systems One of the main hurdles in audio installation in a modern conference room these days is the need to interconnect a variety of input/output transducers into the main audio console. This is usually done using individual point-to-point shielded cables for each node, which is bulky and still requires separated external power supplies on each of them.
FabExchange acquires ON Semiconductor's Rochester site Private equity and divestiture partner, FabExchange, says it has completed the acquisition of ON Semiconductor’s Rochester, New York site.Load more news