UTAC completes acquisition of Singapore wafer bumping assets

As part of the transaction, UTAC has entered into several ancillary agreements including a Transitional Services Agreement and License Agreement with Powertech Technology Inc. to enable a seamless transition of the wafer bumping related operations to UTAC. “With the completion of this transaction, UTAC can provide advanced 300mm wafer bumping capabilities and technology. It complements our world-class wafer probe and back-end WLCSP capabilities within the island,” says Dr. John Nelson, Chief Executive Officer of UTAC, in a press release. This new capability enables UTAC to provide full turn-key WLCSP services in Singapore. The company entered into an Asset Purchase Agreement (“APA”) to acquire the Singapore wafer bumping assets back in late September last year. Back then the company said it would offer employment to all current employees of PTI Singapore’s bumping operations - how many who actually accepted the offer is however not disclosed. “UTAC is an important assembly and test manufacturer in Singapore’s semiconductor ecosystem. With the expansion into wafer bumping, UTAC will be more competitive through its Singapore manufacturing base. This is testament to UTAC’s commitment to undertake high-value manufacturing activities in Singapore,” said Terence Gan, Senior Vice President and Head, Semiconductors, Singapore Economic Development Board. “We will continue to partner UTAC and its ecosystem to capture more business in Singapore.”