© Infineon Business | November 18, 2020
Infineon expands supply base for silicon carbide
Infineon Technologies and GT Advanced Technologies (GTAT) have signed a supply agreement for silicon carbide (SiC) boules. The contract has an initial term of five years.
With this supply contract, the German semiconductor manufacturer adds a further element to secure its growing base material demand in this area. SiC is the basis for power semiconductors that are particularly efficient, robust, and cost-effective at the system level. "We are seeing a steadily increasing demand for SiC-based switches, especially for industrial applications," says Peter Wawer, President of Infineon’s Industrial Power Control Division, in a press release. "However, it has become clear that the automotive sector is quickly following suit. With the supply agreement we have now concluded, we ensure that we will be able to meet the rapidly growing demand of our customers with a diversified supplier base. GTAT’s high-quality boules will provide an additional source for competitive SiC wafers fulfilling the best-in-class material standards now and in the future. This supports our ambitious SiC growth plans, making good use of our existing in-house technologies and core competencies in thin-wafer manufacturing.” “We are very excited to enter into a long-term supply agreement with Infineon,” adds Greg Knight, President and CEO of GT Advanced Technologies. “GTAT will enable Infineon to achieve a secure high-quality internal SiC wafer supply by applying their proprietary thin-wafer technology to GTAT’s crystal. The growth of SiC device adoption is tied largely to the aggressive cost down of the substrate, and this agreement is a significant step towards achieving that goal.” SiC has mainly been used up to now in photovoltaic inverters, industrial power supplies, and the charging infrastructure for electric vehicles. This is where the advantages of SiC at the system level, compared to classical silicon solutions, have already come into play. Other industrial applications such as uninterruptible power supplies and variable-speed drives are increasingly making use of the new semiconductor technology. In addition, electric vehicles show potential for application options, including the main inverters for the drive train and onboard battery charging units.
Teledyne e2v starts cleanroom upgrade Teledyne e2v Semiconductors have laid the first stone to what will become the company's new upgraded semiconductor assembly and test cleanroom at the factory near Grenoble, France.
GaN IC company Navitas to go public GaN Power ICs specialis, Navitas Semiconductor, has entered into a definitive agreement to combine with Live Oak Acquisition Corp. II, a publicly-traded special-purpose acquisition company. The transaction, which values the combined entity at $1.4 billion, will result in Navitas becoming a publicly-traded company.
Physik Instrumente continues expansion in Asia Physik Instrumente (PI) is expanding its precision motion offering in the Asia-Pacific region having invested in a new R&D and manufacturing center in Changzhou, China to specifically focus on the local demands in the APAC region.
Overvoltage protection for RTD-based measurement ysstems Question: Is it possible to design a complete RTD module with overvoltage protection?
Sponsored content by Rochester ElectronicsUncovering the Truth about Semiconductor Counterfeiting Rochester Electronics discusses why AUTHORIZATION is the ultimate tool in the fight against Counterfeit.
In times of supply shortage, or where component obsolescence limits availability, counterfeit devices are more prevalent.
Counterfeiters have moved beyond incorrect logos and packages with no die inside caught by the simplistic visual inspection testing used by those following AS6081. The Counterfeiters now have more sophisticated operations than in the past.
Ericsson and Samsung sign global patent license agreement Ericsson and Samsung have reached a multi-year agreement on global patent licenses between the two companies, including patents relating to all cellular technologies. The cross-license agreement covers sales of network infrastructure and handsets from January 1, 2021.
Jenoptik secures automation orders in North America Photonics company Jenoptik has secured new automation orders in the US and Canada in the first quarter of 2021 totaling more than 40 million USD that will help increase efficiencies in automotive manufacturing.
Infineon looking to increase supply of SiC material Infineon says that the company has concluded a supply contract with the Japanese wafer manufacturer Showa Denko K.K. for an extensive range of silicon carbide material (SiC) including epitaxy.
Sponsored content by Shenzen Kinwong ElectronicThe development trend of printed circuit board products and Kinwong's solution With the rapid development of electronic technology in recent years, printed circuit board (PCB) products are pursuing higher heat dissipation capabilities, with high voltage and high current characteristics, and are developing towards high-density interconnection technology (HDI).
Sources: TSMC is planning five additional fabs in Arizona The worlds biggest semiconductor foundry is reportedly planning to build several new manufacturing facilities in the US, more specifically in Arizona.
Foxconn and Yageo team up to form a semiconductor JV Yageo Group and Foxconn (Hon Hai) Technology Group announces their plans to for a new semiconductor joint venture, XSemi Corporation, for the development and sale of semiconductors.
H. K. Wentworth Group has been acquired MacDermid Alpha Electronics Solutions, a supplier of specialty chemicals and materials used in the semiconductor and PCB markets, has acquired H.K. Wentworth Group, the owner of the Electrolube & AF brands.
EMS Electronics opens new centre of excellence EMD Electronics, a business of Merck KGaA, has inaugurated its new centre of excellence for atomic engineering at Intermolecular's San Jose facility.
Infineon: "The semiconductor market is booming" "The semiconductor market is booming; electronics that help accelerate the energy transition and make work and home life easier remain in high demand. The push for digitalization continues unabated. Infineon is firmly on course to meet its targets for the current fiscal year," says Dr. Reinhard Ploss, CEO of Infineon in the company's quarterly report.
Intel to invest $3.5 billion to expand New Mexico operations The US chipmaker is sinking USD 3.5 billion into its Rio Rancho, New Mexico manufacturing operations to increase its capacity of advanced packaging technologies.
Mobix Labs and Richardson RFPD ink distribution agreement Mobix Labs Inc., a fabless RF (radio frequency) component company focused on next-generation wireless technologies, and Richardson RFPD, an Arrow Electronics company, have entered into a global distribution agreement.
Hprobe receives order for wafer-level magnetic tester Hprobe, a provider of Automatic Test Equipment (ATE) for magnetic devices, today announced a significant order from a tier-1 semiconductor manufacturer for a wafer-level magnetic tester.
Sony starts operations at new fab expansion Sony Semiconductor Solutions Corporation has begun operations on the production lines at the new fab built on the premises of Nagasaki Technology Center in Japan, a production center owned by Sony Semiconductor Manufacturing Corporation.
Optimized power supply measurement setup Question: How can I make sure I’m testing my switching regulator as efficiently as possible?
Vanguard to acquire AU Optronics facility Taiwanese contract chipmaker Vanguard International Semiconductor Corp. has agreed to purchase an 8-inch semiconductor fab (around 48'400sqm) at Hsinchu Science Park for USD 32.5 million.
Mouser adds record 31 new manufacturers to line card The first quarter of 2021 proved to be fruitful start to the year for Mouser Electronics as it bolstered its line card by adding 31 new manufacturers during the first three months of the year.
UMC to expand capacity at its 300mm Fab 12A P6 in Tainan Taiwanese semiconductor foundry, United Microelectronics Corporation (UMC), is planning to expand capacity at its 300mm Fab 12A Phase 6 (P6) in Taiwan’s Tainan Science Park through a collaboration model with several of its global customers. In total NTD 100 billion (EUR 2.96 billion) will be invested to bump up production.
SK hynix is optimistic about the market condition The South Korean semiconductor says that it made better results both QoQ and YoY in the first quarter as the semiconductor market conditions improved earlier this year.
SiPearl launches recruitment plan – aiming for 1'000 by 2025 The Franco-German microprocessor specialist is launching its first recruitment campaign for its sites in Maisons-Laffitte and Sophia-Antipolis, both in France; as well as its German site in Duisburg. The company says it's recruiting 10 engineers per month in France & Germany.
NXP sees its 1Q revenues soar 27% YoY Semiconductor manufacturer NXP delivered first quarter revenues of USD 2.6 billion, an increase of 27% from 2,02 billion during the same period last year.Load more news