© balint radu dreamstime.com
Products | November 05, 2020
New CoolSiC MOSFETs: Maintenance-free servo drives without cooling fans
Infineon Technologies AG supports the robotics and automation industry in implementing maintenance-free motor drive inverters.
This is a product release announcement by Infineon Technologies AG. The issuer is solely responsible for its content.
By introducing the new CoolSiC™ MOSFET with .XT interconnection technology in a 1200 V optimized D 2PAK-7 SMD package, passive cooling becomes possible. Up to 80 percent loss reduction compared to a silicon-based solution eliminates the need for cooling fans and related services. The devices enable high efficiency in various power ratings for servo drive solutions, additional applications profiting from the SMD devices include compact charging infrastructure and industrial power supplies.
“Automation solutions without cooling fans open up a new reality when it comes to savings on maintenance effort and material,” said Peter Wawer, Division President Industrial Power and Control at Infineon. “By combining CoolSiC trench MOSFET chip with .XT interconnection technology we enhance the thermal and cycling capabilities in a small package form factor. This also allows a compact integration of the drive within the motor or into a robot arm.”
A servo drive is the “activator” of the motor in manufacturing equipment. Ohmic conduction losses and fully controllable switching transients of SiC MOSFETs are a perfect match with the load profile of such motors. An 80 percent system loss reduction is possible, even for the same EMC level as for IGBT solutions, at dv/dt:s of 5 to 8 V/ns. The new CoolSiC MOSFET SMD devices come with a short-circuit withstand time of 3 µs. This meets servo motor requirements where relatively small inductors and short cables are in use.
The new portfolio is rated from 30 mΩ up to 350 mΩ. The .XT technology allows up to 30 percent extra loss to be dissipated through the chip-package interconnection, compared to standard packages. The CoolSiC .XT portfolio shows best-in-class thermal performance and cycling capabilities, resulting in up to 14 percent higher output current, or doubled switching frequency, or 10 to 15 K lower operating temperatures compared to standard technology.
Availability
The 1200 V CoolSiC MOSFETs in D 2PAK-7 package can be ordered now. Infineon plans to extend the SMD package portfolio also in 650 V, with more than 18 new products (R DS(on) 25 to 200 mΩ) to be available as engineering samples in 2021. More information is available at www.infineon.com/coolsic-mosfet.
SkyWater to invest $56M in Minnesota capacity expansion
SkyWater Technology's Board of Directors has approved USD 56 million in capital investments to expand the capacity and capabilities of its Minnesota facility and to accelerate the company’s entry into the 200 mm GaN market.
Sponsored content by CML
Strategic solutions to the current material shortage in the PCB industry
In the past few month’s PCB laminates and base material costs have seen a dramatic rise. The natural consequences of this inflation besides the higher production costs are the unavailability of certain materials paired with longer delivery lead times. A problem like this will destabilize any supply chain, or that’s what you may think.
Silicon Labs completes sale of Infrastructure & Automotive business
Silicon Labs announces that it has completed the divestiture of its Infrastructure & Automotive business to Skyworks Solutions for USD 2.75 billion in an all-cash asset transaction.
Strong improvement for RoodMicrotec
Semiconductor supplier RoodMicrotec's total income during the first half of 2021 amounted to EUR 7.3 million, which is 36% above the total income of the same period 2020 and 12% higher than the total income reported for the second half of 2020.
TSMC says its to early make a final decision on German expansion
Semiconductor foundry giant TSMC says that it’s too early to say whether the company will expand with new factories in Germany and that discussions are still in early stages.
Sivers Photonics invests to expand capacity
Sivers Photonics, a part of Sivers Semiconductors, is looking to expand it manufacturing capability and capacity with a fab investment of up to GBP 3 million in 2021.
Sponsored content by Nordson ELECTRONICS SOLUTIONS
There’s a better way to dispense thermal gap filler.
We hear a lot about the advancement, properties, and use of dispensable thermal interface materials (TIM) to keep devices cool. But what about the dispensing process? If you're choosing a dispensable thermal gap filler for your application, download our new guide.
Molex goes with FUJI NXT series pick-and-place machines
Molex CVS Dabendorf GmbH has decided to use the NXT III placement machine from FUJI EUROPE CORPORATION GmbH.
Inductor current measurement in switched power supplies
Question: How do you measure inductor current?
Fingerprint Cards partners with Mouser Electronics
Swedish biometrics company Fingerprint Cards has entered into a collaboration with global distributor Mouser Electronics.
GF CEO on Intel rumour: “There’s nothing to that story”
In an interview with Jon Fortt from CNBC, GlobalFoundries’ CEO Tom Caulfield sets the record straight regarding the Wall Street Journal’s report of a potential USD 30 billion acquisition by Intel.
Sponsored content by Shenzen Kinwong Electronic
The development trend of printed circuit board products and Kinwong's solution
With the rapid development of electronic technology in recent years, printed circuit board (PCB) products are pursuing higher heat dissipation capabilities, with high voltage and high current characteristics, and are developing towards high-density interconnection technology (HDI).
Applied Engineering to set up JV operations with Malaysian counterpart
US-based Applied Engineering (AE) will be establishing a joint venture (JV) plant with Malaysian counterpart, QES Manufacturing Sdn. Bhd. (QES) in Batu Kawan Industrial Park, Pulau Pinang later this year.
MKS completes its acquisition of Photon Control
MKS Instruments has completed its previously announced acquisition of Photon Control Inc.
Renesas to close its Yamaguchi factory next year
Renesas says that it has decided to consolidate the Yamaguchi Factory (located in Ube, Yamaguchi Prefecture in Japan) of its wholly owned subsidiary, Renesas Semiconductor Manufacturing Co., Ltd. at the end of June 2022.
Intel looking to buy GlobalFoundries for $30 billion?
US chipmaker Intel is reportedly in talks to acquire semiconductor manufacturer GlobalFoundries for some USD 30 billion, reports the Wall Street Journal citing sources familiar with the matter.
A simple way to measure temperature using one GPIO digital interface
Question: How can I make an analog measurement if I only have a single GPIO left on the FPGA/microprocessor for my system?
New owner for crystal growth business in Eisenach
Jenoptik has sold its crystal growth business to Hellma Materials, and will continue to focus its business on photonic applications. Hellma Materials takes over all 25 employees, and continues all business activities.
Linear Integrated Systems partners with Digi-Key Electronics
Linear Integrated Systems, a designer and manufacturer of precision, high-performance, small-signal discrete semiconductors, has entered into a new partnership with Digi-Key Electronics.
Conti invests in Israeli industrial sensing start-up Feelit
Continental has acquired a minority stake in the Industry 4.0 start-up Feelit, headquartered in Tel Aviv, Israel. Both companies have agreed not to disclose the amount of the holding.
Skeleton Technologies brings in additional capital
On the first of July, Skeleton Technologies, announced the successful closing of a further EUR 29 million in its Series D financing. The total financing in Round D amounts to EUR 70.4 million.
Fingerprint receives follow-on order for its T-Shape sensor
Swedish biometrics company, Fingerprint Cards has secured an additional volume order for approximately 250,000 units of T-Shape sensor modules from one of the world’s top three card manufacturers.
Minebea Mitsumi acquires Omron’s of 8-inch fab
Minebea Mitsumi’s subsidiary Mitsumi Electric, has entered into an agreement with Omron Corporation for the acquisition of Omron's semiconductor and MEMS fabrication plant in Yasu, Shiga, Japan – as well as its MEMS product development function.
Neonode brings contactless touch to kiosk solution by MiTAC
Swedish Neonode will deliver its Touch Sensor Modules (TSMs) to MiTAC Computing Technology Corp. (MCT) who has developed a contactless touch self-service kiosk solution with a 32 inch display featuring Neonode’s TSMs.
Sourceability ink distribution deal with Nexperia
Electronic component e-commerce marketplace, Sourcengine, says that it is making components from semiconductor manufacturer Nexperia available worldwide.
SK hynix starts mass production of 1anm DRAM using EUV equipment
SK hynix says that it has started mass production of the 8 Gigabit (Gb) LPDDR4 mobile DRAM based on the 1anm, which is the fourth generation of the 10nm process technology this month.
Load more news
