© Intel Business | July 28, 2020
Intel’s chief engineering officer to leave the company
Changes to Intel’s technology organisation are coming. New leaders have been appointed and Murthy Renduchintala will leave the company.
Intel CEO Bob Swan has announced changes to the company’s technology organisation and executive team. Effective immediately, the Technology, Systems Architecture and Client Group (TSCG) will be separated into the following teams, whose leaders will report directly to the CEO. Intel’s Technology Development will be led by Dr. Ann Kelleher. Kelleher has been head of Intel manufacturing and will now lead Intel technology development focusing on 7nm and 5nm processes. Dr. Mike Mayberry, who has been leading Technology Development, will consult and assist in the transition until his planned retirement at the end of the year. Manufacturing and Operations will be led by Keyvan Esfarjani. Esfarjani most recently led manufacturing for Intel’s Non-Volatile Memory Solutions Group (NSG). He will now lead global manufacturing operations and continue Kelleher’s work driving product ramp and the build-out of new fab capacity. Design Engineering, which in the interim will be led by Josh Walden while Intel conducts a global search to identify a permanent leader. Most recently Walden has been leading the Intel Product Assurance and Security Group (IPAS), which will continue to report to him. Architecture, Software and Graphics will continue to be led by Raja Koduri and the Supply Chain will continue to be led by Dr. Randhir Thakur. As a result of these changes, Murthy Renduchintala will leave Intel on in early August, 2020. “I look forward to working directly with these talented and experienced technology leaders, each of whom is committed to driving Intel forward during this period of critical execution,” says CEO Bob Swan, in a press release. “I also want to thank Murthy for his leadership in helping Intel transform our technology platform. We have the most diverse portfolio of leadership products in our history and, as a result of our six pillars of innovation and disaggregation strategy, much more flexibility in how we build, package and deliver those products for our customers.”
Fraunhofer IAF expands semiconductor research infrastructure Two new research buildings provide researchers at the Fraunhofer Institute for Applied Solid State Physics IAF with facilities to continue developing technologies based on compound semiconductors.
Research facility to help UK take the lead in semi R&D University of Sheffield announces a "major research facility" that will support the UK in its position as a "world-leader" in semiconductor R&D.
AI chipmaker Hailo collaborates with Renesas The collaboration is said to result in a powerful and energy-efficient processing solution enabling advanced driver-assistance (ADAS) functions and automated driving (AD) systems in motor vehicles.
Mediatek to open design center at U.S. university Fabless chipmaker Mediatek announces commitment to support its first Midwest semiconductor chip design center in West Lafayette, Indiana.
Japan’s next chip challenge: finding engineers Japan, along with a number of companies, has invested a lot to build up the country’s domestic chip industry. The next challenge is to find a multitude of engineers to run and operate it.
Dexerials and SemsoTec to set up an optical solution center Dexerials Corporation, a provider of leading-edge technologies, materials, and devices for smartphones, automobiles, and other products, and German automobile design house SemsoTec Group, will jointly establish an Optical Solution Center for leading-edge In-Vehicle HMIs in Cham, Germany.
90,000 square metres – Arrows new Dutch distribution centre Arrow recently opened its new primary distribution centre (PDC) in Venlo, the Netherlands. The new centre is one of the company’s largest warehouses globally and replaces the existing facilities in the region and also provides increased capacity for future growth.
Nanya breaks ground on new fab in Taiwan Nanya Technology Corporation has broken ground on its new semiconductor fab in New Taipei City’s Nanlin Technology Park. Once completed, the NTD 300 billion (EUR 9.6 billion) investment will result in an advanced fab with a double-deck cleanroom.
First tool arrive at GlobalFoundries new Singapore fab One year after breaking ground, GlobalFoundries can celebrate a significant milestone on the path to expand its semiconductor manufacturing capacity in Singapore. The first tool has been moved into the company's new facility on its Singapore campus.
Sivers Semiconductors completes the integration of MixComm Swedish Sivers Semiconductors says it has completed the integration of MixComm, creating a challenger in 5G, SATCOM and radar.
Inventronics to acquire ams Osram digital systems business Inventronics has entered into an agreement to acquire the Digital Systems business in Europe and Asia from ams Osram, a global leader in optical solutions.
Allied Motion Technologies acquires Airex Allied Motion Technologies, a designer and manufacturer of precision and specialty controlled motion products, has acquired Airex, LLC, a privately-owned company providing high precision electromagnetic components and solutions.
Arrow opens new distribution centre in the Netherlands Arrow Electronics has opened a new primary distribution centre (PDC) in Venlo, the Netherlands. The PDC will function as a key hub serving all customers of Arrow’s electronics components business in Europe.
Smith adds 30,000 square feet of space in Houston The distributor of electronic components has officially opened its new global services hub in Houston, Texas. The new location adds 30,000 square feet of space for the company’s services.
Samsung invests in Israeli AI systems & semiconductor company Samsung Ventures has made an investment in NeuReality, an Israeli AI systems and semiconductor company.
Swedes develop new method for manufacturing semiconductor components AlixLabs from Lund, Sweden, has developed a new method for manufacturing semiconductor components with a high degree of packing, eliminating several steps in the manufacturing process - Atomic Layer Etch Pitch Splitting (APS).
Kinetic closes asset purchase agreement with Gain Semiconductor Analog and mixed-signal semiconductor company, Kinetic Technologies, has completed the acquisition of certain assets of Gain Semiconductor Incorporated.
Socionext relocation of its US HQ to Milpitas Fabless SoC supplier, Socionext America Inc. (SNA), has relocated its US headquarters to a34,000 square foot single floor building in the City of Milpitas.
TF-AMD expands with new manufacturing site in Malaysia TF-AMD Microelectronics plans to expand its manufacturing facility in Penang with the construction of a second site at Batu Kawan Industrial Park, Penang. A move set to create more than 3,000 new jobs.
Ericsson boosts distribution center in Malaysia Swedish telecom company, Ericsson, has commissioned a new facility at the Kuala Lumpur International Airport (KLIA) that will expand its regional distribution capacity and role of Malaysia in the company.
Applied Materials acquires of Finland-based Picosun Applied Materials has acquired Finnish atomic layer deposition (ALD) technology specialist Picosun Oy.
Melexis adds new manufacturing and R&D space in Bulgarian In an update on LinkedIn the company states that it has officially opened ints new “high-tech” building in Sofia, Bulgaria. Melexis says that this new facility will contribute to Bulgaria's presence in areas such as microelectronic, automotive, and innovation.
Arduino finds backing among giants Open-source company, Arduino, plans to expand its portfolio of hardware, software, connectivity and developer tools for professionals. To reach its goals the company launched a Series B financing round, raising USD 32 million from the likes of Bosch, Renesas and ARM.
Farnell expands Toshiba portfolio to support design engineers The global distributor says that it has strengthened its global partnership with Toshiba Electronics Europe GmbH (Toshiba), resulting in a significant product line expansion and increased stock holding.
SK hynix pick Lam solution to enhance DRAM production SK hynix has selected Lam Research's dry resist fabrication technology as a development tool for two key process steps in the production of advanced DRAM chips.Load more news