© Intel Business | July 28, 2020
Intel’s chief engineering officer to leave the company
Changes to Intel’s technology organisation are coming. New leaders have been appointed and Murthy Renduchintala will leave the company.
Intel CEO Bob Swan has announced changes to the company’s technology organisation and executive team. Effective immediately, the Technology, Systems Architecture and Client Group (TSCG) will be separated into the following teams, whose leaders will report directly to the CEO. Intel’s Technology Development will be led by Dr. Ann Kelleher. Kelleher has been head of Intel manufacturing and will now lead Intel technology development focusing on 7nm and 5nm processes. Dr. Mike Mayberry, who has been leading Technology Development, will consult and assist in the transition until his planned retirement at the end of the year. Manufacturing and Operations will be led by Keyvan Esfarjani. Esfarjani most recently led manufacturing for Intel’s Non-Volatile Memory Solutions Group (NSG). He will now lead global manufacturing operations and continue Kelleher’s work driving product ramp and the build-out of new fab capacity. Design Engineering, which in the interim will be led by Josh Walden while Intel conducts a global search to identify a permanent leader. Most recently Walden has been leading the Intel Product Assurance and Security Group (IPAS), which will continue to report to him. Architecture, Software and Graphics will continue to be led by Raja Koduri and the Supply Chain will continue to be led by Dr. Randhir Thakur. As a result of these changes, Murthy Renduchintala will leave Intel on in early August, 2020. “I look forward to working directly with these talented and experienced technology leaders, each of whom is committed to driving Intel forward during this period of critical execution,” says CEO Bob Swan, in a press release. “I also want to thank Murthy for his leadership in helping Intel transform our technology platform. We have the most diverse portfolio of leadership products in our history and, as a result of our six pillars of innovation and disaggregation strategy, much more flexibility in how we build, package and deliver those products for our customers.”
Mycronic receives US order for two SLX systems The Swedish technology company has received an order for two SLX mask writers from an unnamed, but existing customer in the USA. The total order value is between USD 8 and 12 million.
Sponsored content by Shenzen Kinwong ElectronicThe development trend of printed circuit board products and Kinwong's solution With the rapid development of electronic technology in recent years, printed circuit board (PCB) products are pursuing higher heat dissipation capabilities, with high voltage and high current characteristics, and are developing towards high-density interconnection technology (HDI).
HP to acquire HyperX in a $425 million HP Inc. has entered into a definitive agreement to acquire HyperX, the gaming division of Kingston Technology Company, for USD 425 million.
TSMC ranks in Top10 in three wafer size categories As of December 2020, only TSMC—the world’s largest foundry—was listed among the wafer capacity leaders in each of the three wafer size categories. It had the most 200mm wafer capacity last year and ranked second, trailing only Samsung, in 300mm wafer capacity.
SK Hynix ink $4.3 billion deal with ASML The Dutch supplier of semiconductor equipment has signed a five-year long deal, worth USD 4.3 billion, with SK Hynix as the South Korean company works to secure equipment to boost it output.
Microchip invests $20M in new Irish development centre Up to 200 new engineering jobs will be created in Cork, Ireland as Microchip Technology invests USD 20 million to create a new development centre.
Explosive growth in Automotive DRAM demand expected Driven by such factors as the continued development of autonomous driving technologies and the build-out of 5G infrastructure, the demand for automotive memories will undergo a rapid growth going forward, according to TrendForce’s latest investigations.
Renesas Naka facility is back to full operation Following the earthquake that hit the coast of Fukushima Prefecture and the surrounding areas on February 13, Renesas shut down production at its Naka factory to investigate potential damages. Since then then company has brought the plant back online bit by bit.
Rücker Lypsa is now EDAG Engineering Spain Barcelona-based company Rücker Lypsa S.L. has been operating under the name of "EDAG Engineering Spain, S.L." since January, 2021.
Continental invests in German-US AI chip start-up Continental has acquired a minority stake in the German-US start-up Recogni, a company working on a new chip architecture for object recognition in real time based on artificial intelligence (AI).
Edmund Optics opens new assembly and design facility Edmund Optics, a provider of optical and imaging components, has opened a new Assembly and Advanced Design Facility in Tucson, Arizona, the second Edmund Optics location in the state.
SEMI calls on Biden to reinvigorate US semiconductor manufacturing SEMI, along side 16 industry groups have sent a letter to President Biden urging the administration to bolster domestic semiconductor manufacturing and research.
Solas OLED settles patent disputes with LG Display Solas OLED, an Irish company that specialises in OLED technologies that it licenses to consumer electronics manufacturers, has entered into a Settlement and License Agreement with LG Display, resolving a number of patent infringement actions brought by Solas against LG Display and a certain number of its customers, including Sony.
Panthronics seals global partnership agreement with AdvanIDe Panthronics AG, a fabless semiconductor company specialising in high performance wireless technology, has signed a global partnership agreement with specialist supplier of NFC, RFID and smart card components, AdvanIDe.
Logic ICs account for the largest share of China’s IC market China became the largest IC market in the world in 2005 and has continued to grow in size since then. In 2020, the Chinese IC market increased to USD 143.4 billion, a 9% gain from USD 131.3 billion in 2019.
Why Is my processor leaking power? That sounds like an open-ended question Question: Why is my processor consuming more power than its data sheet suggests?
BAE Systems to produce GPS receivers in Iowa BAE Systems received a USD 247 million contract to design and manufacture an advanced military M-Code GPS receiver and ASIC.
Osram invests in California-based UV LED specialist Osram acquires around 20 percent of US company Bolb Inc. via its venture capital arm Fluxunit. With its investment in the California-based UV-C LED specialist Bolb Inc., Osram is further expanding its technological know-how of disinfection applications with UV-C light.
Cohu's 4000th handler makes its way to Infineon Technologies Back-end semiconductor equipment supplier Cohu has shipped 4000th handler from its manufacturing facility in Melaka, Malaysia. The milestone system, a MATRiX thermal pick-and-place handler was delivered to semiconductor manufacturer Infineon for testing automotive and industrial devices.
NXP is watching the situation in Austin carefully As previously reported, the unusually severe winter weather conditions has crippled power facilities in Texas. Which has led to several Austin semiconductor facilities standing idle without power.Load more news