Products | May 26, 2020
Board-Level hardware enables preemptive experimentation with latest Ka-Band DACs
Teledyne e2v is set to further expand its portfolio of digital-to-analog converter (DAC) ICs and through availability of an accompanying evaluation platform, engineers will be able to begin applying it to their design projects soon.
This is a product release announcement by Teledyne e2v. The issuer is solely responsible for its content.
The company is about to start initial sampling of the EV12DD700 dual-channel DACs, which are capable of operating up into Ka-band frequencies. Predominantly targeting mission-critical microwave systems, these devices support beamforming applications. They have a 25GHz output bandwidth with only 3dB attenuation being witnessed, and can go way beyond this with just a little over 3dB attenuation. Built into each DAC is an array of sophisticated signal processing functionality. This encompasses a programmable anti-sinc filter and direct digital synthesis (DDS) capabilities, as well as a programmable complex mixer. Also included is a digital up-converter (with four interpolation stages, plus sinc compensation).
Via the EV12DD700 evaluation kit, engineers will have the opportunity to investigate the key operational parameters of the 12.5GSamples/s EV12DD700, ahead of the full production release later this year. This means they can assess its validity in respect to their particular design criteria early on. Having registered, users will also get access to valuable lab measurement data over the course of the coming months.
"There is a growing need to migrate RF systems from being heavily hardware dependent to following a more software-centric structure, thereby making them much easier and quicker to configure. It's now becoming clear that the Ka-band is going to be where much of this activity occurs," states Nicolas Chantier, Marketing Director at Teledyne e2V Semiconductors. "Through the EV12DD700, and its support for higher frequency levels, it will be possible for engineers to replace a much larger proportion of RF hardware with digital code, and our evaluation kit will give them a useful head-start."
GF CEO on Intel rumour: “There’s nothing to that story”
In an interview with Jon Fortt from CNBC, GlobalFoundries’ CEO Tom Caulfield sets the record straight regarding the Wall Street Journal’s report of a potential USD 30 billion acquisition by Intel.
Applied Engineering to set up JV operations with Malaysian counterpart
US-based Applied Engineering (AE) will be establishing a joint venture (JV) plant with Malaysian counterpart, QES Manufacturing Sdn. Bhd. (QES) in Batu Kawan Industrial Park, Pulau Pinang later this year.
Sponsored content by CML
Strategic solutions to the current material shortage in the PCB industry
In the past few month’s PCB laminates and base material costs have seen a dramatic rise. The natural consequences of this inflation besides the higher production costs are the unavailability of certain materials paired with longer delivery lead times. A problem like this will destabilize any supply chain, or that’s what you may think.
MKS completes its acquisition of Photon Control
MKS Instruments has completed its previously announced acquisition of Photon Control Inc.
Renesas to close its Yamaguchi factory next year
Renesas says that it has decided to consolidate the Yamaguchi Factory (located in Ube, Yamaguchi Prefecture in Japan) of its wholly owned subsidiary, Renesas Semiconductor Manufacturing Co., Ltd. at the end of June 2022.
Intel looking to buy GlobalFoundries for $30 billion?
US chipmaker Intel is reportedly in talks to acquire semiconductor manufacturer GlobalFoundries for some USD 30 billion, reports the Wall Street Journal citing sources familiar with the matter.
Sponsored content by Shenzen Kinwong Electronic
The development trend of printed circuit board products and Kinwong's solution
With the rapid development of electronic technology in recent years, printed circuit board (PCB) products are pursuing higher heat dissipation capabilities, with high voltage and high current characteristics, and are developing towards high-density interconnection technology (HDI).
A simple way to measure temperature using one GPIO digital interface
Question: How can I make an analog measurement if I only have a single GPIO left on the FPGA/microprocessor for my system?
New owner for crystal growth business in Eisenach
Jenoptik has sold its crystal growth business to Hellma Materials, and will continue to focus its business on photonic applications. Hellma Materials takes over all 25 employees, and continues all business activities.
Linear Integrated Systems partners with Digi-Key Electronics
Linear Integrated Systems, a designer and manufacturer of precision, high-performance, small-signal discrete semiconductors, has entered into a new partnership with Digi-Key Electronics.
Conti invests in Israeli industrial sensing start-up Feelit
Continental has acquired a minority stake in the Industry 4.0 start-up Feelit, headquartered in Tel Aviv, Israel. Both companies have agreed not to disclose the amount of the holding.
Skeleton Technologies brings in additional capital
On the first of July, Skeleton Technologies, announced the successful closing of a further EUR 29 million in its Series D financing. The total financing in Round D amounts to EUR 70.4 million.
Fingerprint receives follow-on order for its T-Shape sensor
Swedish biometrics company, Fingerprint Cards has secured an additional volume order for approximately 250,000 units of T-Shape sensor modules from one of the world’s top three card manufacturers.
Minebea Mitsumi acquires Omron’s of 8-inch fab
Minebea Mitsumi’s subsidiary Mitsumi Electric, has entered into an agreement with Omron Corporation for the acquisition of Omron's semiconductor and MEMS fabrication plant in Yasu, Shiga, Japan – as well as its MEMS product development function.
Neonode brings contactless touch to kiosk solution by MiTAC
Swedish Neonode will deliver its Touch Sensor Modules (TSMs) to MiTAC Computing Technology Corp. (MCT) who has developed a contactless touch self-service kiosk solution with a 32 inch display featuring Neonode’s TSMs.
Sourceability ink distribution deal with Nexperia
Electronic component e-commerce marketplace, Sourcengine, says that it is making components from semiconductor manufacturer Nexperia available worldwide.
SK hynix starts mass production of 1anm DRAM using EUV equipment
SK hynix says that it has started mass production of the 8 Gigabit (Gb) LPDDR4 mobile DRAM based on the 1anm, which is the fourth generation of the 10nm process technology this month.
Cirrus Logic to acquire Lion Semiconductor for $335 million
Cirrus Logic has entered into an agreement to acquire California-based Lion Semiconductor for USD 335 million in cash. The acquisition brings IP and products for power applications in smartphones, laptops and other devices and accelerates growth of the company’s high-performance mixed-signal business.
Bootstrapping a low voltage Op Amp to operate with high voltage signals and supplies
Question: Can I bootstrap a low voltage amplifier to get a high voltage buffer?
Sensirion raises its outlook for full-year 2021
The Swiss manufacturer of digital microsensors and systems raises its outlook for financial year 2021 based on strong demand in the first half of the year.
Altix moves to increase its R&D capabilities
Following an increase in manufacturing activity, exposure systems specialist Altix has recently expanded its R&D center located at its French headquarter in Normandy, France.
Micross buys microelectronics business assets of Ultra CEMS
Micross Components, a provider of mission-critical microelectronic components and services, is expanding its Hybrid and assembly business with the acquisition of assets of the microelectronics business from Ultra CEMS, a provider of high reliability hybrid electronics engineered for harsh environments.
ITEC emerges as independent semiconductor equipment manufacturer
Semiconductor equipment manufacturer ITEC, which was founded in 1991 by Philips (now Nexperia), has announced its launch as a separate independent entity. ITEC will however remain part of the Nexperia group.
LPKF supplies systems to chip manufacturer
Technology company LPKF says it has received a follow-up order from the semiconductor industry. An unnamed global chip manufacturer had installed a first LIDE system at the beginning of 2020 and, after a qualification phase, initially used it for its own product development. Now, further systems have been ordered.
Load more news
