Products | April 22, 2020
Next generation IoT services are developed in Oulu
A new generation IoT hub developed by UROS and Qualcomm will open in Oulu, Finland. The Innovation Center is the first facility in Finland to utilize private 5G network in IoT product development and validation.
This is a product release announcement by UROS. The issuer is solely responsible for its content.
The private 5G network, deployed by Finnish operator Elisa, is already up and running and will serve all IoT ecosystem partners at the Innovation Center. The forthcoming Innovation Center established by UROS and Qualcomm will be a state-of-the-art facility utilizing IoT products and services from Qualcomm Technologies and Elisa´s 5G mobile network. Allowing various teams to collaborate and work together with UROS in a live environment, the center accelerates IoT technology creation and adaptation for real-world solutions. Elisa´s private network guarantees its users stable network speed and great capacity and provides the new center with perfect conditions for IoT solution development. The Innovation Center is targeted at start-ups, established companies (OEMs and ODMs) as well as universities as a place to promote IP generation and monetization of solutions with a quick-turn platform offering, focusing on e.g. artificial intelligence (AI), wearables, smart cities, robotics, drones, industrial IoT and automotive. 5G enables new IoT applications 5G technology will take IoT to the next level with the capability to support an extremely high density of IoT devices in a small area, targeting up to a million devices per square kilometre. It will also be able to provide a connection of ultra-low latency and exceptionally high reliability. In addition to massive IoT, 5G will enable mission critical services such as remote controlled automotives and digital healthcare, expected to lead to the next industrial revolution. “5G connectivity is a vital enabler for industry digitalisation with Cellular IoT. Elisa has been an excellent partner for the deployment of the new private 5G network at the Innovation Center, well on schedule and with the desired performance. With this added premium functionality, we strive to offer the best-in-class innovation environment for the stakeholders in our IoT ecosystem”, says Rauno Jokelainen, CTO of UROS Group. “Elisa is very excited about this collaboration with UROS in the brand new field of 5G. We get very valuable experiences on the usage of 5G technologies also for private networks and massive IoT”, says Eetu Prieur, Director of Elisa’s Mobile Solutions. The Innovation Center will be inaugurated later in 2020. In addition to private networks, Elisa is continuing to build the national 5G mobile network with great speed. Elisa´s 5G network has already been opened in 17 cities all across Finland, Rauma being the latest addition to the Elisa 5G family.
Applied Materials and Besi to jointly develop chip integration technology Applied Materials and BE Semiconductor Industries (Besi) says they aim to develop the industry’s first complete and proven equipment solution for die-based hybrid bonding, an emerging chip-to-chip interconnect technology that enables heterogeneous chip and subsystem designs for applications including high-performance computing, AI and 5G.
Sourceability appoints new managing director for APAC Semiconductor veteran joins the management team of digital supply chain solutions provider.
POET and Sanan IC to form a joint venture company POET Technologies and Xiamen Sanan Integrated Circuit (Sanan IC), a wholly owned subsidiary of Sanan Optoelectronics, have signed a definitive joint venture contract.
From wafer sawing to the finished packaged component Encapsulation is essential for the reliability of a component, as it needs to protect the sensitive silicon and bonding joints even under variable environmental conditions or temperature ranges. High-quality packaging is therefore indispensable to ensure the functionality and reliability of a component and the entire device.
Sponsored content by JBCHigh Quality & efficient fume extraction is not only important to meet workplace regulations It's also important to ensure the safety and health of everyone. Soldering fumes and gases may be one of the main causes of potential health problems at any soldering workplace without a proper fume extraction. To protect all employees and their health, keep the following suggestions in mind!
Avnet Silica names Gilles Beltran as president Beltran succeeds Mario Orlandi who takes on global assignments in Avnet.
SkyWater is looking to lease a 200 mm fab in Florida Having just completed the expansion of its Minnesota facility, SkyWater does not seem to be done adding to its footprint. The company is looking to take over the Center for Neovation, a 200 mm semiconductor manufacturing facility.
Airbus Ventures invests in Singapore startup Airbus Ventures latest investment has led the company to Singapore and Zero Error Systems (ZES).
SK hynix to acquire Intel NAND memory business The two parties have signed an agreement under which SK Hynix will acquire Intel's NAND memory and storage business for USD 9 billion.
Sponsored content by NCAB Group BeneluxHow to design a high speed PCB! It wasn’t that long ago when the word “high speed” didn’t exist in the vocabulary of PCB designers. Thinking back for example at the 90’s and 00’s, the speeds they used were much slower. In 2005, 3 Gbps was considered the typical high speed data rate, but today engineers are dealing with 10 Gbps, or even 25 Gbps.
High power quarter brick isolated DC/DC converter addresses demands of energy-conscious data centers Continuing to extend its portfolio of high-density DC/DC converter solutions with built-in digital interfaces, Flex Power Modules introduces two variants of the new BMR491 series.
Wipro to acquire Eximius Design The information technology specialist says it has signed a definitive agreement to acquire Eximius Design, an engineering services company with strong expertise in semiconductor, software and systems design.
Cree to sell LED Business to SMART Global Holdings Cree says it has entered into a definitive agreement to sell its LED Products business unit (Cree LED) to SMART Global Holdings for up to USD 300 million.
Murata opens second factory in Wuxi Wuxi Murata Electronics Co., Ltd., a manufacturing subsidiary of Murata, has completed to construction of a new facility and officially opened the new plant on October 19.
Skeleton's next-gen high energy ultracapacitors to power Wrightbus’ hydrogen buses Skeleton Technologies is cooperating with Wrightbus, a bus OEM headquartered in Northern Ireland, in which the company will supply its next generation high energy ultracapacitor modules to power fuel cell buses in the UK.
Zytronic adds a third dimension to touch with its ZyBrid® hover technology Touch technology innovator Zytronic has released a contactless sensing option that can detect user interactions up to 30mm away from the surface of the glass.
Improved signal integrity on High Frequency and High Speed PCBs In PCB design guidelines chip makers recommend using VLP (very low profile) and HVLP (hyper very low profile) copper to mitigate insertion loss caused by the skin effect – But do you know what happens to the copper surface roughness during PCB fabrication?
TSMC's profit soars on the back of strong revenue growth The semiconductor foundry announces consolidated revenues of NTD 356.43 billion (EUR 10.57 billion) for its third quarter of 2020, a 21.6% increase from the same period last year.
COVID-19 is still impacting the business of RoodMicrotec The independent semiconductor supplier recorded a total income of EUR 3.0 million during the third quarter of 2020, a slight decrease from EUR 3.1 million during the same period last year.
Digi-Key and Netlist announce US marketplace distribution partnership Digi-Key Electronics has added Netlist, a builder of memory and storage solutions, to its Marketplace.
STMicro acquires French fabless semiconductor company The acquired fabless semiconductor company specialises in silicon-based power amplifiers and RF Front-End Module products for the cellular IoT and 5G markets.
Advantech expands with three new offices in North America The embedded production and solution provider has opened three new branch offices in Downers Grove, Illinois; Danvers, Massachusetts; and Toronto, Canada.
ASM's CFO, Peter van Bommel, to retire Chief Financial Officer, Peter van Bommel, has notified the Supervisory Board of ASM of his wish to retire from the company at the next Annual General Meeting to be held in May 2021.
Italian manufacturer acquires German producer of magnetic measurement solutions Lika Electronic, a developer and manufacturer of encoders and position measuring systems, announces the successful strategic acquisition of BOGEN Electronic GmbH.
ClassOne's Solstice S4 wet processing system chosen by TRUMPF Semiconductor equipment manufacturer ClassOne Technology has sold its Solstice S4 fully-automated wet-processing system to VCSEL laser manufacturer, TRUMPF Photonic Components.
Prodrive Technologies officially opens North American HQ The Dutch technology company has officially opened their North American headquarters in Massachusetts USA.Load more news