© Infineon Technologies AG
Products | April 15, 2020
Infineon module and chip technology powers 250 kW PV solution from Sungrow
Sungrow offers the SG250HX PV string inverter that features a high capacity of 250 kW. On board: customized EasyPACK™ 3B power modules from Infineon Technologies AG, equipped with the latest TRENCHSTOP™ and CoolSiC™ chip technologies.
This is a product release announcement by Infineon Technologies AG. The issuer is solely responsible for its content.
Supporting a high voltage of 1500 V DC and 800 V AC, the Sungrow SG250HX string inverter offers a maximum of 99 percent efficiency.
“Sungrow is dedicated to paving the way for grid parity across Europe with growing technical innovations. We are accelerating our global step to fulfill the corporate mission of ‘clean power for all’”, said Stefan Froboese, Technical Director at Sungrow Europe. “In this regard, we are excited to bring forth another disruptive string inverter technology to Europe, maximizing ROI for our customers at unforeseen levels.”
Added Dr. Peter Wawer, President of the Industrial Power Control Division of Infineon: “We are very proud to support Sungrow’s goals with our new EasyPACK 3B power module, which was just recently launched at PCIM 2019. Combining our Si and SiC chip technologies, this is another proof point for our strategy to turn from product thinking to system understanding. Proprietary know-how and production capacity in frontend and backend puts us in the position to realize customer specific solutions within months.”
Weighing only 95 kg with a dimension of 1051 x 660 x 363 mm 3 the Sungrow SG250HX boasts a power density of approximately 1000 W/liter. This not only makes it the most powerful inverter but also one with leading power density. Thanks to Infineon’s new technologies, the heat sink can be reduced in both size and weight significantly. Additionally, the Infineon products also enable weight savings by reducing the passive components through increasing switching frequency.
The system features twelve MPPTs (Maximum Power Point Tracking) and a flexible block design allowing for up to 6.3 MW blocks. This makes it an ideal solution for utility scale photovoltaic applications. With smart forced air-cooling technology, the SG250HX can operate at extremely high temperatures without derating.
Applied Materials and Besi to jointly develop chip integration technology
Applied Materials and BE Semiconductor Industries (Besi) says they aim to develop the industry’s first complete and proven equipment solution for die-based hybrid bonding, an emerging chip-to-chip interconnect technology that enables heterogeneous chip and subsystem designs for applications including high-performance computing, AI and 5G.
Sourceability appoints new managing director for APAC
Semiconductor veteran joins the management team of digital supply chain solutions provider.
POET and Sanan IC to form a joint venture company
POET Technologies and Xiamen Sanan Integrated Circuit (Sanan IC), a wholly owned subsidiary of Sanan Optoelectronics, have signed a definitive joint venture contract.
From wafer sawing to the finished packaged component
Encapsulation is essential for the reliability of a component, as it needs to protect the sensitive silicon and bonding joints even under variable environmental conditions or temperature ranges. High-quality packaging is therefore indispensable to ensure the functionality and reliability of a component and the entire device.
Sponsored content by NCAB Group Benelux
How to design a high speed PCB!
It wasn’t that long ago when the word “high speed” didn’t exist in the vocabulary of PCB designers. Thinking back for example at the 90’s and 00’s, the speeds they used were much slower. In 2005, 3 Gbps was considered the typical high speed data rate, but today engineers are dealing with 10 Gbps, or even 25 Gbps.
Ad
Avnet Silica names Gilles Beltran as president
Beltran succeeds Mario Orlandi who takes on global assignments in Avnet.
SkyWater is looking to lease a 200 mm fab in Florida
Having just completed the expansion of its Minnesota facility, SkyWater does not seem to be done adding to its footprint. The company is looking to take over the Center for Neovation, a 200 mm semiconductor manufacturing facility.
Airbus Ventures invests in Singapore startup
Airbus Ventures latest investment has led the company to Singapore and Zero Error Systems (ZES).
SK hynix to acquire Intel NAND memory business
The two parties have signed an agreement under which SK Hynix will acquire Intel's NAND memory and storage business for USD 9 billion.
Sponsored content by JBC
High Quality & efficient fume extraction is not only important to meet workplace regulations
It's also important to ensure the safety and health of everyone. Soldering fumes and gases may be one of the main causes of potential health problems at any soldering workplace without a proper fume extraction. To protect all employees and their health, keep the following suggestions in mind!
High power quarter brick isolated DC/DC converter addresses demands of energy-conscious data centers
Continuing to extend its portfolio of high-density DC/DC converter solutions with built-in digital interfaces, Flex Power Modules introduces two variants of the new BMR491 series.
Wipro to acquire Eximius Design
The information technology specialist says it has signed a definitive agreement to acquire Eximius Design, an engineering services company with strong expertise in semiconductor, software and systems design.
Cree to sell LED Business to SMART Global Holdings
Cree says it has entered into a definitive agreement to sell its LED Products business unit (Cree LED) to SMART Global Holdings for up to USD 300 million.
Murata opens second factory in Wuxi
Wuxi Murata Electronics Co., Ltd., a manufacturing subsidiary of Murata, has completed to construction of a new facility and officially opened the new plant on October 19.
Skeleton's next-gen high energy ultracapacitors to power Wrightbus’ hydrogen buses
Skeleton Technologies is cooperating with Wrightbus, a bus OEM headquartered in Northern Ireland, in which the company will supply its next generation high energy ultracapacitor modules to power fuel cell buses in the UK.
Zytronic adds a third dimension to touch with its ZyBrid® hover technology
Touch technology innovator Zytronic has released a contactless sensing option that can detect user interactions up to 30mm away from the surface of the glass.
Improved signal integrity on High Frequency and High Speed PCBs
In PCB design guidelines chip makers recommend using VLP (very low profile) and HVLP (hyper very low profile) copper to mitigate insertion loss caused by the skin effect – But do you know what happens to the copper surface roughness during PCB fabrication?
TSMC's profit soars on the back of strong revenue growth
The semiconductor foundry announces consolidated revenues of NTD 356.43 billion (EUR 10.57 billion) for its third quarter of 2020, a 21.6% increase from the same period last year.
COVID-19 is still impacting the business of RoodMicrotec
The independent semiconductor supplier recorded a total income of EUR 3.0 million during the third quarter of 2020, a slight decrease from EUR 3.1 million during the same period last year.
Digi-Key and Netlist announce US marketplace distribution partnership
Digi-Key Electronics has added Netlist, a builder of memory and storage solutions, to its Marketplace.
STMicro acquires French fabless semiconductor company
The acquired fabless semiconductor company specialises in silicon-based power amplifiers and RF Front-End Module products for the cellular IoT and 5G markets.
Advantech expands with three new offices in North America
The embedded production and solution provider has opened three new branch offices in Downers Grove, Illinois; Danvers, Massachusetts; and Toronto, Canada.
ASM's CFO, Peter van Bommel, to retire
Chief Financial Officer, Peter van Bommel, has notified the Supervisory Board of ASM of his wish to retire from the company at the next Annual General Meeting to be held in May 2021.
Italian manufacturer acquires German producer of magnetic measurement solutions
Lika Electronic, a developer and manufacturer of encoders and position measuring systems, announces the successful strategic acquisition of BOGEN Electronic GmbH.
ClassOne's Solstice S4 wet processing system chosen by TRUMPF
Semiconductor equipment manufacturer ClassOne Technology has sold its Solstice S4 fully-automated wet-processing system to VCSEL laser manufacturer, TRUMPF Photonic Components.
Prodrive Technologies officially opens North American HQ
The Dutch technology company has officially opened their North American headquarters in Massachusetts USA.
Load more news
