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Denso & TMC launches JV to develop in-vehicle semiconductors
DENSO Corporation and Toyota Motor Corporation have named the joint venture to be established in April 2020 MIRISE Technologies. Through the JV the companies aims to to contribute through the development of advanced semiconductor electronics technologies.
The joint venture will conduct research and advanced development of next-generation in-vehicle semiconductors. MIRISE is an acronym for Mobility Innovative Research Institute for SEmiconductors. Yoshifumi Kato has been appointed President and Representative Director of the new company. The goal for 2030 has been established has been drawn up for building a rapid, competitive development system after the company is formed. In short the goal is to "achieve the future of mobility while preserving a pleasant environment and ensuring safety and comfort, based on the semiconductor electronics of MIRISE Technologies." The JV will accelerate the development of next-generation in-vehicle semiconductors that play a key role in technology innovation for electric vehicles and automated driving vehicles from aspects of both vehicles and components by combining Toyota's knowledge on mobility with DENSO's knowledge on in-vehicle components. MIRISE will work on three technology development fields, power electronics, sensing, and SoC. In the power electronics field, the company will work on R&D mainly for in-house production (including contract manufacturing) by leveraging the semiconductor material technologies as well as manufacturing and design technologies accumulated by Toyota and DENSO in electrification technologies, mainly in hybrid vehicles. In the sensing field, the company will work on development for in-house production and cooperation with joint development partners. In the SoC field, the company will strengthen its ability to determine the specifications of optimal SoCs for mobility in the future.
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