© IC Insights Components | October 18, 2019
Wafer capacity by feature size shows rapid growth at <10nm
Leading-edge processes (<28nm) took over as the largest portion in terms of monthly installed capacity available in 2015. By the end of 2019, <28nm capacity is forecast to represent about 49 percent of the IC industry’s total capacity.
At the very leading edge, <10nm processes are now in volume production and are forecast to represent 5 percent of worldwide capacity in 2019. The share of <10nm capacity is forecast to jump to 25 percent and become the largest capacity segment by 2023. South Korea (Samsung) and Taiwan (TSMC) are currently the only two regions with fabs processing what are being called <10nm processes. South Korea and Japan both have large shares of capacity in the <20nm – ≥10nm segment, with the vast majority of it being used to produce NAND flash (equivalent feature size) and DRAM, but also some for advanced logic and application processors built with 14nm, 10nm, or 8/7nm technology. Taiwan also has a large share of the <20nm – ≥10nm capacity, with roughly half of it being for foundry services and the other half for DRAM production. Trends at the leading edge have been changing and the industry is departing from historical 'norms'. The grey area of what constitutes a generation and how to measure the minimum process geometry gets more difficult every year. Therefore, any assumptions made regarding the wafer fab capacity of new process technologies can have a big impact on the forecast for wafer capacity by minimum feature size. Other findings from the Global Wafer Capacity 2019-2023 report include,
- South Korea remains significantly more leading-edge (i.e., <28nm) focused than the other regions or countries. Given Samsung and SK Hynix’s emphasis on high-density DRAM and flash memory products, it is not a surprise that the country has the highest concentration of wafer capacity dedicated to the leading-edge processes
- When only the most advanced processes (<20nm) are considered, South Korea also has the largest share of its total capacity dedicated to these processes than any other region. For logic-based processes, Taiwan, North America, and South Korea have the highest concentrations at the leading edge.
- Current leading-edge (<28nm) capacity in China is completely owned and controlled by foreign companies, namely Samsung, SK Hynix, Intel, and TSMC.
- Taiwan has the largest shares of capacity in the <65nm – ≥28nm and <0.2µ – ≥65nm technology segments. Nevertheless, the 28nm, 45/40nm, and 65nm generations continue to generate significant business volumes for foundries like TSMC and UMC
Overvoltage protection for RTD-based measurement ysstems Question: Is it possible to design a complete RTD module with overvoltage protection?
Ericsson and Samsung sign global patent license agreement Ericsson and Samsung have reached a multi-year agreement on global patent licenses between the two companies, including patents relating to all cellular technologies. The cross-license agreement covers sales of network infrastructure and handsets from January 1, 2021.
Sponsored content by Shenzen Kinwong ElectronicThe development trend of printed circuit board products and Kinwong's solution With the rapid development of electronic technology in recent years, printed circuit board (PCB) products are pursuing higher heat dissipation capabilities, with high voltage and high current characteristics, and are developing towards high-density interconnection technology (HDI).
Jenoptik secures automation orders in North America Photonics company Jenoptik has secured new automation orders in the US and Canada in the first quarter of 2021 totaling more than 40 million USD that will help increase efficiencies in automotive manufacturing.
Infineon looking to increase supply of SiC material Infineon says that the company has concluded a supply contract with the Japanese wafer manufacturer Showa Denko K.K. for an extensive range of silicon carbide material (SiC) including epitaxy.
Sources: TSMC is planning five additional fabs in Arizona The worlds biggest semiconductor foundry is reportedly planning to build several new manufacturing facilities in the US, more specifically in Arizona.
Sponsored content by Rochester ElectronicsUncovering the Truth about Semiconductor Counterfeiting Rochester Electronics discusses why AUTHORIZATION is the ultimate tool in the fight against Counterfeit.
In times of supply shortage, or where component obsolescence limits availability, counterfeit devices are more prevalent.
Counterfeiters have moved beyond incorrect logos and packages with no die inside caught by the simplistic visual inspection testing used by those following AS6081. The Counterfeiters now have more sophisticated operations than in the past.
Foxconn and Yageo team up to form a semiconductor JV Yageo Group and Foxconn (Hon Hai) Technology Group announces their plans to for a new semiconductor joint venture, XSemi Corporation, for the development and sale of semiconductors.
H. K. Wentworth Group has been acquired MacDermid Alpha Electronics Solutions, a supplier of specialty chemicals and materials used in the semiconductor and PCB markets, has acquired H.K. Wentworth Group, the owner of the Electrolube & AF brands.
EMS Electronics opens new centre of excellence EMD Electronics, a business of Merck KGaA, has inaugurated its new centre of excellence for atomic engineering at Intermolecular's San Jose facility.
Infineon: "The semiconductor market is booming" "The semiconductor market is booming; electronics that help accelerate the energy transition and make work and home life easier remain in high demand. The push for digitalization continues unabated. Infineon is firmly on course to meet its targets for the current fiscal year," says Dr. Reinhard Ploss, CEO of Infineon in the company's quarterly report.
Intel to invest $3.5 billion to expand New Mexico operations The US chipmaker is sinking USD 3.5 billion into its Rio Rancho, New Mexico manufacturing operations to increase its capacity of advanced packaging technologies.
Mobix Labs and Richardson RFPD ink distribution agreement Mobix Labs Inc., a fabless RF (radio frequency) component company focused on next-generation wireless technologies, and Richardson RFPD, an Arrow Electronics company, have entered into a global distribution agreement.
Hprobe receives order for wafer-level magnetic tester Hprobe, a provider of Automatic Test Equipment (ATE) for magnetic devices, today announced a significant order from a tier-1 semiconductor manufacturer for a wafer-level magnetic tester.
Sony starts operations at new fab expansion Sony Semiconductor Solutions Corporation has begun operations on the production lines at the new fab built on the premises of Nagasaki Technology Center in Japan, a production center owned by Sony Semiconductor Manufacturing Corporation.
Optimized power supply measurement setup Question: How can I make sure I’m testing my switching regulator as efficiently as possible?
Vanguard to acquire AU Optronics facility Taiwanese contract chipmaker Vanguard International Semiconductor Corp. has agreed to purchase an 8-inch semiconductor fab (around 48'400sqm) at Hsinchu Science Park for USD 32.5 million.
Mouser adds record 31 new manufacturers to line card The first quarter of 2021 proved to be fruitful start to the year for Mouser Electronics as it bolstered its line card by adding 31 new manufacturers during the first three months of the year.
UMC to expand capacity at its 300mm Fab 12A P6 in Tainan Taiwanese semiconductor foundry, United Microelectronics Corporation (UMC), is planning to expand capacity at its 300mm Fab 12A Phase 6 (P6) in Taiwan’s Tainan Science Park through a collaboration model with several of its global customers. In total NTD 100 billion (EUR 2.96 billion) will be invested to bump up production.
SK hynix is optimistic about the market condition The South Korean semiconductor says that it made better results both QoQ and YoY in the first quarter as the semiconductor market conditions improved earlier this year.
SiPearl launches recruitment plan – aiming for 1'000 by 2025 The Franco-German microprocessor specialist is launching its first recruitment campaign for its sites in Maisons-Laffitte and Sophia-Antipolis, both in France; as well as its German site in Duisburg. The company says it's recruiting 10 engineers per month in France & Germany.
NXP sees its 1Q revenues soar 27% YoY Semiconductor manufacturer NXP delivered first quarter revenues of USD 2.6 billion, an increase of 27% from 2,02 billion during the same period last year.
Semiconductor fab inaugurated on the African continent On the 26th of April, Kenyan president Uhuru Kenyatta officially inaugurated a nanotechnology and semiconductor manufacturing facility – the first one in Kenya.
GlobalFoundries moves HQ to Fab 8 in New York Semiconductor manufacturer GlobalFoundries says it will relocate its headquarters to Malta, New York, the site of Fab 8 — as the company positions itself for growth, strengthens partnerships with customers and recruits new talent.
Neonode tech to make self-checkout kiosk contactless Neonode Inc. says that Japan Aerospace Corporation, a Neonode value-added reseller, has been selected by a major Japanese retail chain to retrofit the chain’s self-checkout kiosks with Neonode contactless touch technology.
$1 billion for every chip maker that wants to “Make in India” India has under the banner “Make in India” been encouraging companies to manufacture in the country and incentivised dedicated investments into manufacturing.
Silicon Labs sells infrastructure & auto unit to Skyworks Analog semiconductor specialist Skyworks Solutions, has entered into a definitive agreement with Silicon Laboratories Inc., under which Skyworks will acquire the Infrastructure & Automotive business of Silicon Labs in an all-cash asset transaction valued at USD 2.75 billion.Load more news