© tom schmucker dreamstime.com Components | October 16, 2019
EC imposes interim measures on Broadcom
The European Commission has ordered Broadcom to stop applying certain provisions contained in agreements with six of its main customers. This will "prevent serious and irreparable harm to competition likely to be caused by Broadcom's conduct, which prima facie (at first sight) infringes EU competition rules".
Margrethe Vestager, Commissioner in charge of competition policy, said: “We have strong indications that Broadcom, the world's leading supplier of chipsets used for TV set-top boxes and modems, is engaging in anticompetitive practices. Broadcom's behaviour is likely, in the absence of intervention, to create serious and irreversible harm to competition. We cannot let this happen, or else European customers and consumers would face higher prices and less choice and innovation. We therefore ordered Broadcom to immediately stop its conduct.” Broadcom is a supplier of chipsets for TV set-top boxes and modems, including so-called systems-on-a-chip. In June 2019, the Commission opened an antitrust investigation to assess whether Broadcom restricted competition in various markets for these chipsets and components for so-called central office/head end equipment by means of certain practices, including exclusivity, tying, bundling, interoperability degradation and abusive use of intellectual property rights. At the same time, the Commission issued a Statement of Objections where it preliminarily concluded that interim measures with respect to certain aspects of Broadcom's conduct may be required to ensure the effectiveness of any final decision taken by the Commission in the future. The interim measures decision (October 16, 2019) Today's decision concludes that interim measures are warranted to prevent serious and irreparable damage to competition from occurring in certain markets for systems-on-a-chip for TV set-top boxes and modems. This is based on the following elements:
- Broadcom is, at first sight, dominant in three different markets, namely the markets for systems-on-a-chip for (i) TV set-top boxes, (ii) fibre modems and (iii) xDSL modems
- Broadcom is, at first sight, infringing competition rules by abusing its prima facie dominant position. In particular, Broadcom entered into agreements with six manufacturers of TV set-top boxes and modems, which include the following anticompetitive provisions
- To strengthen Broadcom's prima facie dominance in systems-on-a-chip for TV set-top boxes, fibre modems and xDSL modems, clauses containing exclusive or quasi-exclusive purchasing obligations and commercial advantages, such as rebates and other non-price related advantages (for example, early access to its technology and premium technical support) that are conditional on the customer buying these products exclusively or quasi-exclusively from Broadco
- To leverage Broadcom's prima facie dominance from systems-on-a-chip for TV set-top boxes, fibre modems and xDSL modems into the separate market forsystems-on-a-chip for cable modems, clauses granting customers in these markets commercial advantages, such as price and non-price advantages, which are conditional on the customer buying systems-on-a-chip for cable modems exclusively or quasi-exclusively from Broadcom
- unilaterally cease to apply the anticompetitive provisions identified by the Commission and to inform its customers that it will no longer apply such provisions
- refrain from agreeing the same provisions or provisions having an equivalent object or effect in other agreements with these customers, and refrain from implementing punishing or retaliatory practices having an equivalent object or effect
Pocket-Size white noise generator for quickly testing circuit signal response Question: Can you produce a frequency spectrum for all frequencies at the same time?
II-VI expands its silicon carbide manufacturing footprint II-VI Incorporated says it has expanded its silicon carbide (SiC) wafer finishing manufacturing footprint in China to serve the largest worldwide market for electric vehicles (EVs) and for clean energy applications.
Sponsored content by KyzenThe Effectiveness of IPA/DI on No-clean Flux Residues This article studies the ability of the current 75%IPA/25%DI extraction solution, commonly used to detect ion contamination since the 1960s, to detect and quantify new technology weak organic acids common in modern soldering materials employing ROSE, Gravimetric, and Ion Chromatography.
AQ Group acquires Schaffner’s Power Magnetic Division Swedish AQ Group AB has signed an agreement with the Swiss company Schaffner Group to acquire its Power Magnetics Division.
Chinese companies hold only 5% of global IC market Propelled by 50% share of IDM sales and 64% share of fabless sales, U.S. companies captured 55% of the total worldwide IC market in 2020.
Farnell adds 20'000 new products - targets the home office Farnell, an Avnet Company and global distributor of electronic components, products and solutions, has added 20'000 new electronic and electrical products to its portfolio.
Asahi Kasei Europe unites activities at Düsseldorf Harbour Late last year, Asahi Kasei Europe started office operation at its new location at Düsseldorf Harbour, Germany. In March 2021, the Asahi Kasei Europe R&D Center relocated from Dormagen to the new location.
Sponsored content by TotechLong Term Storage Safe, secure storage and quality testing of sensitive components Shortage of electronic components Worldwide there is a significant shortage of electronic components, especially SMT components. The Long Term Storage of electronic components can be the solution for this problem in the future. But the requirements for long-term storage are increasing.
Intel steps up as a supplier to the automotive industry According to Intel’s new CEO, Pat Gelsinger, the company is ready to step up and start making chips for car makers to take the edge off the current shortage that has hit the automotive industry hard.
Fund II triples the size of TDK Ventures’ Fund I TDK Corporation's subsidiary TDK Ventures Inc. has closed its second fund, totalling USD 150 million in new capital. The new fund will primarily target early-stage, global investments in clean technology, advanced materials, industrial, robotics, energy, autonomous vehicles, electric vehicles, and healthtech segments.
MacDermid Alpha opens new die attach applications centre MacDermid Alpha Electronics Solutions officially opened a Greater China Die Attach Application Centre on April 1st, 2021. The technology and application centre will house technical service and lab personnel, equipped with die attach assembly and process equipment.
Sponsored content by Shenzen Kinwong ElectronicThe development trend of printed circuit board products and Kinwong's solution With the rapid development of electronic technology in recent years, printed circuit board (PCB) products are pursuing higher heat dissipation capabilities, with high voltage and high current characteristics, and are developing towards high-density interconnection technology (HDI).
WISeKey to increase manufacturing capabilities to support demand Cybersecurity and IoT company, WISeKey, says that it is significantly investing in its supply chain transformation to better and faster serve its customers. The company is simultaneously impacted by the current semiconductor shortage situation and a tremendously growing order backlog.
Renesas resumes operations at fire damaged facility Renesas say that the N3 Building (300mm line) clean room at Naka Factory resumed operations on Friday April 9.
Neonode to supply its tech to a major South Korean elevator OEM Neonode has received an order for and will supply touch sensor modules to Finetek, a Neonode value-added reseller, who has been selected by a major elevator OEM in South Korea to install its contactless elevator control panel solutions powered by Neonode’s technology in existing elevators in this market.
High Speed ADC Power Supply Domains Question: Why are there all these power domains for high speed ADCs?
Sponsored content by Würth Elektronik eiSosFour days of concentrated electronics knowledge Würth Elektronik invites you to a virtual conference with expert presentations on EMC, thermal management, power management, connectivity, and many other circuit design topics from April 26-29, 2021 from 8 am to 6 pm CET each day.
BAE Systems receives adaptive RF contracts from DARPA BAE Systems will design mechanisms for the U.S. Defense Advanced Research Projects Agency (DARPA) that protect emerging wideband receivers from interference, enabling their use in contested and congested environments.
Swedish biometrics company expands in Europe and Asia Swedish biometrics company, Fingerprint Cards, is seeing more and more reasons to move closer to "the action". The world’s top three payment card producers are all based in continental Europe, while most of the largest smartphone OEMs are headquartered in Asia - so that's where the company's heading.
Siemens Mobility to triple R&D headcount in Hungary Siemens Mobility is set to create 120 new R&D related jobs at its Budapest, Hungary location as the company moves moves forward in its efforts to "digitalise track-based transport modes".
AMD and Xilinx stockholders approve proposed acquisition The stockholders of both companies voted to approve their respective proposals relating to the pending acquisition of Xilinx by AMD.
Renesas to shift production from fire-hit Naka fab The Japanese semiconductor manufacturer is reportedly set to shift some production from its fire damaged Naka fab to a facility in the southwestern prefecture of Ehime.
Netlist and SK hynix reach patent and technology agreement Netlist and SK hynix have reached an agreement for a patent cross license covering memory technologies of both companies and an agreement for the supply of SK hynix products and technical cooperation on Netlist's CXL HybriDIMM technology.
13% increase to lift total semi shipments to a new record high Total semiconductor unit shipments, which include integrated circuits as well as optoelectronics, sensor/actuator, and discrete (O-S-D) devices, are forecast to rise 13% in 2021, to 1,135.3 billion (1.1353 trillion) units to set a new all-time annual record.
ROHM Semiconductor Europe appoints new President As of April 1st, 2021, Wolfram Harnack has taken the helm as ROHM Semiconductor Europe's new President. Former President, Toshimitsu Suzuki, will lead the European Sales Division as General Manager from the company's headquarters in Japan.
SK hynix negotiates supply deal with Bosch The South Korean company is reportedly in talks with Germany’s Robert Bosch Gmbh regarding a long-term supply contract.
Camtek receives orders worth more than $20 million The developer and manufacturer of inspection and metrology equipment for the semiconductor industry, says that in recent weeks it has received orders for inspection and metrology systems totaling over USD 20 million.
u‑blox acquires full ownership in Sapcorda JV Wireless and positioning technology specialist, u-blox, says that it has acquired full ownership of Sapcorda Services GmbH, a joint venture formed by u‑blox, Bosch, Geo++, and Mitsubishi Electric.
Murata spins off plant – establishes new company Murata Manufacturing says it will spin off its Kanazawa Murata Manufacturing Sendai plant and establish a new group company with the name of Sendai Murata Manufacturing, on July 1, 2021.Load more news