Ad
Ad
evertiq.comevertiq.seevertiq.plevertiq.de
Search
Register
Ad
Ad
© yuri arcurs dreamstime.com Business | August 20, 2019

Smith earns ISO/IEC 17025 accreditation at its European facility

Smith says it has earned accreditation under the ISO/IEC 17025 standard at its recently upgraded warehouse in Amsterdam.

Smith’s global headquarters in Houston and Asian headquarters in Hong Kong received ISO/IEC 17025 accreditation in 2012 and 2013, respectively. The ISO/IEC 17025 standard outlines both the specific mechanical testing requirements for electronic components and calibration services for equipment in the lab. Smith’s testing equipment is calibrated by a third party and provides measurement to NIST and/or manufacturer standards. Smith’s in-house test laboratory ensures that electronic components are verified by placing parts through a series of stringent examinations, including escalation to additional levels of testing when required by Smith’s quality control and management or customer specification. Smith’s ISO/IEC 17025-accredited testing equipment and capabilities include chemical testing, C-SAM acoustic microscopy, decapsulation, X-ray fluorescence, solderability testing, and X-ray systems. “Smith’s warehouse in Amsterdam has added a multitude of capabilities since the beginning of this year,” said Kirk Wehby, Smith’s Chief Operating Officer. “In addition to earning ISO/IEC 17025 accreditation, the warehouse has also finalized its second phase of expansion and added CCAP-101 certification to its list of qualifications.” "Earning ISO/IEC 17025 accreditation in Amsterdam further showcases Smith’s commitment to providing the highest-quality electronic components to customers worldwide,” continued Wehby. “The growth of our global operations team and our in-house testing capabilities will only keep gaining momentum.”
The UK’s biggest wafer fab wants to become even bigger Newport Wafer Fab, Infineon’s former manufacturing fab in South Wales, is looking to raise GBP 50 million to expand its production capacity amidst global semiconductor shortage.
TE Connectivity has sold Axicom to RCP TE Connectivity has divested its Axicom high voltage products business division to RCP Group, an independent investment firm based in Munich.
John Ternus to take over as Apple's hardware engineering chief Apple's Dan Riccio will transition to a new role focusing on a new project and reporting to CEO Tim Cook. John Ternus will now lead Apple’s Hardware Engineering organization as a member of the executive team.
24 V dual-channel low side EiceDRIVER™ with enable function and integrated thermal pad
Ad
HC Solutions is now in the hands of S&T S&T AG has acquired 100% of the Linz-based company HC Solutions GmbH (HCS) through its wholly-owned subsidiary Kontron Technologies GmbH (KTEC).
Cadence to acquire NUMECA Cadence Design Systems has entered into a definitive agreement to acquire NUMECA International, a company focused on computational fluid dynamics (CFD), mesh generation, multi-physics simulation and optimization.
Tech Etch installs Aqua Rose cleaner and tester Tech Etch, a US-based provider of custom flex and rigid-flex circuits, EMI/RFI shielding solutions, and precision etch & form, has purchased an Aqua ROSE Batch Cleaner/Ionic Contamination Tester.
GlobalWafers increases its offer for Siltronic GlobalWafers says it has increased its all-cash takeover offer of Siltronic, by its subsidiary GlobalWafers GmbH, to EUR 140 per Siltronic share.
NI and Konrad ink agreement to accelerate autonomous vehicle test NI and Konrad Technologies (KT) have entered into a strategic agreement to develop test systems and solutions for autonomous driving software and hardware validation.
Intel expands in Poland The US chipmaker is preparing to expand its operations in the Polish city of Gdańsk. The company will be constructing its sixth building at its campus in the city.
Murata completes new Okayama production building The Japanese company’s production subsidiary, Okayama Murata Manufacturing, initiated an expansion of its operations in Setouchi City with a new production building in December 2019. Now the building stands complete.
Osram signs supply and commercial agreement with LeddarTech ADAS and AD sensing specialist, LeddarTech, and automotive lighting and laser systems supplier Osram, have entered into a long-term agreement.
ITW to acquire MTS Test & Simulation business From Amphenol Illinois Tool Works Inc., a global multi-industrial manufacturing company, and the provider interconnect, antenna and sensor solutions, Amphenol Corporation, have entered into an agreement under which ITW will acquire MTS Systems Corporation’s Test & Simulation business, following the closing of Amphenol’s acquisition of MTS.
Tobey Gonnerman named Fusion Worldwide's new President The global sourcing distributor announces that Tobey Gonnerman has been appointed as the company’s new President.
Solving the Cable TV Infrastructure Downstream Transmitter Challenge Driven by demand for faster internet connectivity, the cable TV industry has developed new network architectures for the delivery of multigigabit services to subscribers. This fiber deep approach, using a remote PHY device (RPD), moves critical hardware closer to the users by using digital fiber.
Boyd expands its footprint with new facility in Mexico Thermal management and engineered material solutions specialist Boyd Corporation, has expanded its presence in North America with a newly built facility strategically located in Juarez, Mexico.
Farnell becomes a global distribution partner NI the distributor of electronic components, products and solutions has been appointed as an NI Authorized Distributor, expanding its product portfolio to include NI software-connected test and measurement solutions for customers of all sizes.
Foxconn and Winbond invest in chipmaker Kneron Foxconn and Winbond joins companies such as Qualcomm, Horizons, Sequoia and Weltrend as high profile investors in Kneron
EV Group sets up customer training facility at HQ EV Group (EVG) has established the EVG Academy, a training facility for customers that provides technical training on all classes of the company's equipment as well as on its CIM Framework software platform in an optimised environment.
Denso team up with Aeva to develop sensing and perception systems Mobility supplier Denso says that it is partnering with U.S. LiDAR and perception systems company, Aeva, to develop next-generation sensing and perception systems.
Fire hit Taiwanese MLCC manufacturer in China On January 13 a fire broke out at Taiwanese passive component maker Walsin Technology’s Dongguan, China site.
Thin Film Products joins SERMA Microelectronics SERMA Microelectronics, a subsidiary of the French electronics specialist SERMA Group, has finalised the purchase of TFP (Thin Film Products), a French manufacturer of thin-film microwave circuits for space, military and civil applications.
New Korean Zestron Technical Center opens for customers The provider of high precision cleaning products has expanded its operations by opening a new Technical Center, located in Anyang, Korea.
A2 Global Electronics names new executives Electronic component distribution and supply chain service provider, A2 Global Electronics, has appointed Anthony Andriano as its new Chief Financial Officer and promoted Jesper Romell as its new President.
ROHM expands production capacity of SiC power devices ROHM has recently held an opening ceremony announcing the completion of a new building at ROHM Apollo's Chikugo plant, which the company started building back in February 2019, to enhance the production capacity of SiC power devices.
Elmos acquires Online Engineering GmbH Elmos is strengthening its in-house competencies in software engineering via the acquisition of Dortmund based engineering service provider Online Engineering.
Load more news
January 26 2021 10:57 am V18.15.16-1