Smith earns ISO/IEC 17025 accreditation at its European facility

Smith says it has earned accreditation under the ISO/IEC 17025 standard at its recently upgraded warehouse in Amsterdam.

Smith’s global headquarters in Houston and Asian headquarters in Hong Kong received ISO/IEC 17025 accreditation in 2012 and 2013, respectively. The ISO/IEC 17025 standard outlines both the specific mechanical testing requirements for electronic components and calibration services for equipment in the lab. Smith’s testing equipment is calibrated by a third party and provides measurement to NIST and/or manufacturer standards. Smith’s in-house test laboratory ensures that electronic components are verified by placing parts through a series of stringent examinations, including escalation to additional levels of testing when required by Smith’s quality control and management or customer specification. Smith’s ISO/IEC 17025-accredited testing equipment and capabilities include chemical testing, C-SAM acoustic microscopy, decapsulation, X-ray fluorescence, solderability testing, and X-ray systems. “Smith’s warehouse in Amsterdam has added a multitude of capabilities since the beginning of this year,” said Kirk Wehby, Smith’s Chief Operating Officer. “In addition to earning ISO/IEC 17025 accreditation, the warehouse has also finalized its second phase of expansion and added CCAP-101 certification to its list of qualifications.” "Earning ISO/IEC 17025 accreditation in Amsterdam further showcases Smith’s commitment to providing the highest-quality electronic components to customers worldwide,” continued Wehby. “The growth of our global operations team and our in-house testing capabilities will only keep gaining momentum.”

Neonode has received an order for and will supply touch sensor modules to Finetek, a Neonode value-added reseller, who has been selected by a major elevator OEM in South Korea to install its contactless elevator control panel solutions powered by Neonode’s technology in existing elevators in this market.

Question: Why are there all these power domains for high speed ADCs?

Sponsored content by Shenzen Kinwong Electronic

With the rapid development of electronic technology in recent years, printed circuit board (PCB) products are pursuing higher heat dissipation capabilities, with high voltage and high current characteristics, and are developing towards high-density interconnection technology (HDI).

BAE Systems will design mechanisms for the U.S. Defense Advanced Research Projects Agency (DARPA) that protect emerging wideband receivers from interference, enabling their use in contested and congested environments.

Swedish biometrics company, Fingerprint Cards, is seeing more and more reasons to move closer to "the action". The world’s top three payment card producers are all based in continental Europe, while most of the largest smartphone OEMs are headquartered in Asia - so that's where the company's heading.

Siemens Mobility is set to create 120 new R&D related jobs at its Budapest, Hungary location as the company moves moves forward in its efforts to "digitalise track-based transport modes".

The stockholders of both companies voted to approve their respective proposals relating to the pending acquisition of Xilinx by AMD.

Sponsored content by Rochester Electronics

Rochester Electronics discusses why it is imperative to purchase components from fully authorized sources who are AS6496 compliant.
For the many professionals tasked with maintaining products and systems with mission-critical components that have gone into obsolescence, building a reliable supply chain for these parts is crucial.

The Japanese semiconductor manufacturer is reportedly set to shift some production from its fire damaged Naka fab to a facility in the southwestern prefecture of Ehime.

Netlist and SK hynix have reached an agreement for a patent cross license covering memory technologies of both companies and an agreement for the supply of SK hynix products and technical cooperation on Netlist's CXL HybriDIMM technology.