Ad
Ad
evertiq.comevertiq.seevertiq.plevertiq.de
Search
Register
Ad
Ad
Ad
Ad
Ad
Ad
© vinnstock dreamstime.com Components | July 22, 2019

Cell phone 3D sensing market enters growth stage

LEDinside predicts that smartphone shipments are to decline for whole 2019 year, cell phone brands will be engaging in a 'specs -contest' with their flagship devices for the second half-year, and 3D sensing modules will become an important component in that race.

Market revenue for VCSELs used by cell phones utilising 3D sensing is projected to reach USD 1.139 billion as a result of this trend. “For 2019, besides Apple, who will be implementing 3D face recognition in its iPhones wholesale, Samsung, Huawei and Sony have also scheduled implementations of world-facing 3D sensing in flagship devices in 2H. It is estimated that near to 10 high-end phones may use 3D sensing solutions in 2020, with some devices going so far as to implement the solution on both the front- and world-facing cameras and pushing up VCSEL revenue,” says TrendForce Research Manager Joanne Wu. VCSEL Suppliers Actively Developing World-facing TOF Camera Solutions The 3D sensing solutions currently used in the consumer market are structured light and time-of-flight (TOF). Structured light acquires the image through projected light patterns, and is able to determine depth with extreme precision, though it comes with a high cost and computational complexity. Moreover, Apple holds the patent for the technology, forming a formidable patent barrier. TOF does not enjoy the precision and depth that structured light does, but its fast reaction speeds and detection range make up for it. TOF cameras may be divided into front-facing and world-facing versions, with front-facing cameras costing more and world -facing cameras using the higher power VCSELs. Major VCSEL-related companies currently include Lumentum, Finisar, OSRAM's Vixar, ams, WIN Semiconductors Corp., Advanced Wireless Semiconductor Company (AWSC), VIAVI Solutions Inc. etc. Android Players Eager to Penetrate Market for Varied VCSEL Applications Many acquisitions and investments have taken place in the VCSEL market between 2017 and 2018, demonstrating that suppliers are optimistic towards future VCSEL demand. Since Apple adopted 3D sensing features in its iPhones wholesale in 2018, using it for face recognition and face unlock, many non -Apple companies such as Xioami, Huawei and OPPO caught on and began development. Yet there are serious bottlenecks in 3D sensing technology as well as a patent barrier, causing development by members of the Android camp to be slower than anticipated. Yet many cell phone brands still see 3D sensing as a technology with much potential. As the 3D sensing market emerges, 3D sensing technology in future cell phones will no longer be limited to simple face recognition and face unlock applications, but extend to 3D object recognition, modeling, AR and various other features.
More information can be found here.
Fingerprint finds its way into another PC Swedish biometrics company, Fingerprint Cards, says that the company has been awarded a design win by an unnamed, but described as a top tier, PC manufacturer, with a product launch planned for Q1 2021.
Osram scores major win in patent dispute At the end of April 2019, US-based Lighting Science Group (LSG) filed a patent infringement complaint at the U.S. International Trade Commission (ITC) against Osram and other companies in the lighting industry.
Cicor expands capacity at Wangs facility Due to the strong demand for the company’s thin-film services, the production capacities at the Wangs (Switzerland) site will be expanded with immediate effect by an additional shift.
Pixelworks to sell 7% stake to Chinese investors Pixelworks says it has entered into a Securities Purchase Agreement with MTM-Xinhe Investment Limited, a consortium of investors from the Chinese semiconductor and mobile eco-system, under which Pixelworks would issue and sell in shares representing about 7% of the company's outstanding shares for USD 6.6 million dollars.
Ad
Ad
Allegro MicroSystems sets terms for $325 IPO Allegro MicroSystems, a fabless chip company focusing on sensing and power technology, has commenced a proposed initial public offering of its common stock.
Applied Materials and Besi to jointly develop chip integration technology Applied Materials and BE Semiconductor Industries (Besi) says they aim to develop the industry’s first complete and proven equipment solution for die-based hybrid bonding, an emerging chip-to-chip interconnect technology that enables heterogeneous chip and subsystem designs for applications including high-performance computing, AI and 5G.
Sourceability appoints new managing director for APAC Semiconductor veteran joins the management team of digital supply chain solutions provider.
POET and Sanan IC to form a joint venture company POET Technologies and Xiamen Sanan Integrated Circuit (Sanan IC), a wholly owned subsidiary of Sanan Optoelectronics, have signed a definitive joint venture contract.
From wafer sawing to the finished packaged component Encapsulation is essential for the reliability of a component, as it needs to protect the sensitive silicon and bonding joints even under variable environmental conditions or temperature ranges. High-quality packaging is therefore indispensable to ensure the functionality and reliability of a component and the entire device.
Avnet Silica names Gilles Beltran as president Beltran succeeds Mario Orlandi who takes on global assignments in Avnet.
SkyWater is looking to lease a 200 mm fab in Florida Having just completed the expansion of its Minnesota facility, SkyWater does not seem to be done adding to its footprint. The company is looking to take over the Center for Neovation, a 200 mm semiconductor manufacturing facility.
Airbus Ventures invests in Singapore startup Airbus Ventures latest investment has led the company to Singapore and Zero Error Systems (ZES).
SK hynix to acquire Intel NAND memory business The two parties have signed an agreement under which SK Hynix will acquire Intel's NAND memory and storage business for USD 9 billion.
High power quarter brick isolated DC/DC converter addresses demands of energy-conscious data centers Continuing to extend its portfolio of high-density DC/DC converter solutions with built-in digital interfaces, Flex Power Modules introduces two variants of the new BMR491 series.
Wipro to acquire Eximius Design The information technology specialist says it has signed a definitive agreement to acquire Eximius Design, an engineering services company with strong expertise in semiconductor, software and systems design.
Cree to sell LED Business to SMART Global Holdings Cree says it has entered into a definitive agreement to sell its LED Products business unit (Cree LED) to SMART Global Holdings for up to USD 300 million.
Murata opens second factory in Wuxi Wuxi Murata Electronics Co., Ltd., a manufacturing subsidiary of Murata, has completed to construction of a new facility and officially opened the new plant on October 19.
Skeleton's next-gen high energy ultracapacitors to power Wrightbus’ hydrogen buses Skeleton Technologies is cooperating with Wrightbus, a bus OEM headquartered in Northern Ireland, in which the company will supply its next generation high energy ultracapacitor modules to power fuel cell buses in the UK.
Zytronic adds a third dimension to touch with its ZyBrid® hover technology Touch technology innovator Zytronic has released a contactless sensing option that can detect user interactions up to 30mm away from the surface of the glass.
Improved signal integrity on High Frequency and High Speed PCBs In PCB design guidelines chip makers recommend using VLP (very low profile) and HVLP (hyper very low profile) copper to mitigate insertion loss caused by the skin effect – But do you know what happens to the copper surface roughness during PCB fabrication?
TSMC's profit soars on the back of strong revenue growth The semiconductor foundry announces consolidated revenues of NTD 356.43 billion (EUR 10.57 billion) for its third quarter of 2020, a 21.6% increase from the same period last year.
COVID-19 is still impacting the business of RoodMicrotec The independent semiconductor supplier recorded a total income of EUR 3.0 million during the third quarter of 2020, a slight decrease from EUR 3.1 million during the same period last year.
Digi-Key and Netlist announce US marketplace distribution partnership Digi-Key Electronics has added Netlist, a builder of memory and storage solutions, to its Marketplace.
STMicro acquires French fabless semiconductor company The acquired fabless semiconductor company specialises in silicon-based power amplifiers and RF Front-End Module products for the cellular IoT and 5G markets.
Load more news
Most Read
October 26 2020 3:29 pm V18.11.11-1