© NeuroBlade Components | June 27, 2019
NeuroBlade raises over $27M to develop a new type of AI chip
Israeli startup NeuroBlade has completed a USD 23 million round A, led by Marius Nacht, Co-founder of Check Point Software Technologies, with the participation of new investor Intel Capital and existing investors StageOne Ventures and Grove Ventures.
In addition to the USD 4.5 million the company has raised, this new funding will be used by NeuroBlade to scale its workforce and ramp up its marketing efforts in order to bring the first generation of its AI chip to the market. Founded in 2017 by CEO Elad Sity and Eliad Hillel, CTO and VP Product Strategy, NeuroBlade raised its initial capital while in stealth mode from StageOne Ventures and Grove Ventures, headed by Dov Moran, the inventor of the USB flash drive and Co-founder of M-Systems. Additional initial capital was received by several private investors, including Rami Lipman. The AI processor market segment is currently led by Nvidia and Intel but is becoming more crowded as more startups develop processors for different market segments, as well as large corporations that are developing processors for their own needs. AI chips are used today in a wide range of applications, including image and speech recognition, video analysis, autonomous driving and many more. The deployment and use of AI is still limited by factors such as size, price, throughput or performance of these chips. NeuroBlade aims to solve this with their chip which is designed with different technology and architecture that allows it to solve a fundamental issue of running AI applications. It maintains a strong performance level despite being smaller and less expensive to make. According to NeuroBlade, the chip is meant to run several neural networks and multiple complex algorithms at the same time. Its main advantage, according to the company, is that it is able to also solve tomorrow’s problems, not just the relatively “simple” problems computers grapple with today. "We started out slightly over two years ago with an ambitious idea how to solve AI’s computational challenges. I would like to thank the investors and partners who share the excitement and faith in our product and the way to get there. This is also an opportunity to thank our employees for all their work and for walking the extra mile to make our vision materialize. Our core team has grown stronger over the past two years, creating a solid foundation for the upcoming growth," Elad Sity, CEO and Co-founder of NeuroBlade, says in a press release.
Intel nabs former GlobalFoundries, IBM executive Intel Corp has hired former IBM chip exec and GlobalFoundries CTO Gary Patton to its team.
Yokogawa UK partners with power supply manufacturer TDK-Lambda Yokogawa UK has signed a distribution deal with TDK-Lambda. Through Yokogawa’s distribution channels, customers across the UK will now have access to TDK-Lambda’s range of laboratory power supplies.
Denso & TMC launches JV to develop in-vehicle semiconductors DENSO Corporation and Toyota Motor Corporation have named the joint venture to be established in April 2020 MIRISE Technologies. Through the JV the companies aims to to contribute through the development of advanced semiconductor electronics technologies.
Murata to cease production at several subsidiaries Saitama Murata Manufacturing – previously Toko, Inc. – a wholly-owned subsidiary of Murata Manufacturing is ceasing production at its production subsidiaries Shantou S.E.Z. Huajian Electronics and Hua Jiuh Technology by the end of 2019.
KORE Wireless picks up Integron KORE Wireless Group announced the acquisition of Integron, an IoT solutions and managed services provider specializing in the connected health market.
Aixtron qualified for MicroLED production at PlayNitride PlayNitride Inc., has qualified Aixtron's AIX G5+ C MOCVD system for the manufacturing of GaN-based (gallium nitride) MicroLEDs.
memsstar ships MEMS production system to University of Freiburg memsstar Ltd., a provider of etch and deposition equipment to manufacturers of semiconductors and MEMS,has shipped its three-chamber ORBIS 3000 system for MEMS research and manufacturing to the Department of Microsystems Engineering (IMTEK) of the University of Freiburg, Germany.
Vishay's plant in Turin, Italy, receives R&D grant Vishay Intertechnology’s facility in Borgaro Torinese, Italy, has received an industrialisation of research results (IR2) R&D grant from the EU and the Regional Government of Piedmont.
MacDermid Alpha acquires Kester Connecticut-based MacDermid Alpha Electronics Solutions has announced the acquisition of Kester, a global supplier of materials used in electronics assembly and semiconductor applications.
LuminaLED opens new production facility The company officially opened the doors to its new production facility in Chisinau, Moldova on the last day of November.
LeddarTech partners with First Sensor to accelerate LiDAR deployment LeddarTech, a LiDAR platform provider, has entered into a strategic collaboration with First Sensor AG, a developer of advanced sensor solutions that is also now joining the Leddar Ecosystem.
Digi-Key extends partnership with Precogs Electronics component distributor, Digi-Key Electronics has renewed its partnership agreement with Paris-based startup, Precogs.
Rambus completes acquisition of the Verimatrix's silicon IP Rambus has completed acquisition of the silicon IP, secure protocols and provisioning business from Verimatrix, formerly Inside Secure.
Osram invites ams to talks about the future Following the successful takeover offer from ams AG, Osram’s Managing Board has invited the management of ams to make the journey together to becoming a global technology powerhouse for sensor solutions and photonics on the basis of the Business Combination Agreement.
Marvell completes sale of Wi-Fi connectivity business to NXP Marvell has completed the sale of its Wi-Fi Connectivity business to NXP. The divestiture encompasses Marvell's Wi-Fi and Bluetooth technology portfolios and related assets.
Cadence to acquire AWR from NI Cadence Design Systems and National Instruments have entered into a definitive agreement under which Cadence expects to acquire AWR Corporation, a wholly owned subsidiary of National Instruments (NI).
Nidec completed acquisition of Roboteq Nidec Corporation has completed the acquisition of 90% ownership of Roboteq Inc., a U.S.-based designer of ultra-low voltage (ULV) drives, from its owners through Nidec Motor Corporation.
Vesper's ZPL technology included in Alexa-enabled headset Acoustic sensors developer, Vesper, has had its proprietary ZeroPower Listening (ZPL) technology certified by Amazon for extended battery and far-field voice interactions. Vesper's piezoelectric MEMS microphones are powering the first hands-free, extended battery life Alexa-enabled headset that uses ZPL technology.
AutoChips & X-FAB launch mass production of China’s first TPMS chipset AutoChips Inc., a Chinese automotive electronics chip design company (and a subsidiary of NavInfo), in partnership with X-FAB Silicon Foundries, has successfully initiated volume production of a Tire Pressure Monitoring System (TPMS) chipset.
Sumitomo launches 150mm GaN-on-SiC production with Aixtron system Japanese group Sumitomo Electric Device Innovations, Inc. (SEDI) has ordered an AIX G5+ tool from Aixtron, with 8x6-inch wafer configuration in order to expand the production capacity of GaN-on-SiC (gallium nitride-on-silicon carbide) radio frequency (RF) devices for wireless applications.
Green light for NXP’s acquisition of Marvell’s wireless connectivity assets NXP Semiconductors N.V. and Marvell have cleared all necessary hurdles and received the required regulatory approvals for NXP’s acquisition of the wireless connectivity portfolio from Marvell.
Murata continues to expand its Okayama operations A production building that had been under construction since October of last year has been completed at Murata’s production subsidiary Okayama Murata Manufacturing, in Setouchi City, Okayama Prefecture.Load more news