Components | April 25, 2019
TDK teams with Immersion on haptics
TDK Corporation's subsidiary TDK Electronics has signed a co-marketing agreement with Immersion Corporation, a developer and licensor of touch feedback technology, for the design and marketing of cutting-edge touch response solutions that utilise TDK PowerHap piezo actuators with haptic feedback.
Under the agreement Immersion will certify TDK’s actuators for use with its software products and include them in reference designs. This will enable Immersion customers to implement advanced haptic solutions with the world’s highest performance actuators in a broad spectrum of applications that includes smartphones and tablets, automotive displays and controls, wearables, consumer electronics devices, ATMs and vending machines, gaming consoles, industrial equipment and medical devices and more. “Our partnership with Immersion enables us to expand our market reach to customers, who are looking for the most innovative haptic solutions for their applications,” explains Dr. Georg Kuegerl, CTO of the TDK Piezo & Protection Devices Business Group, in a press release. “They will benefit from Immersion’s expert integration support along the entire range of touch technology, from actuator selection to design of the haptic experience.” “Teaming with TDK enables us to offer a significantly broader range of technologically superior haptic solutions using powerful and compact actuators,” says Ramzi Haidamus, Immersion’s CEO. “As haptics continues to become pervasive in numerous markets, working with TDK helps meet that demand and ensures OEMs can easily incorporate the power of touch into user interfaces.” The PowerHap product spectrum includes a new miniaturized type (0904H014V060) which has dimensions of just 9 x 3.75 x 1.4 mm. At the maximum operating voltage of 60 V the new actuator can achieve an acceleration of 6.4 g (pp) under a load of 100 grams. This enables a maximum displacement of 18 µm or a high force of up to 3 N to be achieved. At the other end of the PowerHap product spectrum a new actuator (6005H090V120) is now in development with dimensions of 60 x 5.0 x 9.0 mm. At the maximum operating voltage of 120 V this powerful actuator can achieve an acceleration of 8 g (pp) under a load of 1000 grams. TDK also has an agreement with Immersion for its ultra-thin PiezoHapt actuators, which feature a very short response time of just 2 ms. PiezoHapt has a unimorph design consisting of a multilayer piezo element bonded to one side of a vibration plate. With a thickness of a mere 0.35 mm the new haptic actuator is much thinner than conventional eccentric rotary motors and linear resonant actuators, and one of the world’s thinnest haptic devices.
JEOL Ltd. acquires Integrated Dynamic Electron Solutions JEOL Ltd. , manufacturer of semiconductor equipment and other industrial instruments and equipment, announced the acquisition of Integrated Dynamic Electron Solutions Inc. (IDES), an entrepreneurial venture specializing in technologies related to transmission electron microscopy (TEM).
NEXT receives major order for Indian government program NEXT Biometrics has received an order for UIDAI and STQC certified fingerprint biometric readers in India with a value of USD 750,000.
Cadence completes acquisition of AWR from NI Cadence Design Systems, Inc. has completed the acquisition of AWR Corporation from National Instruments Corporation.
Fiat Chrysler and Foxconn plans EV joint venture A new competitor in the industry for electric vehicles are in the making.
Collins Aerospace inks multimillion-dollar space contract Collins Aerospace Systems has signed a contract with Lockheed Martin to provide critical subsystems to support production of NASA’s Orion spacecraft fleet for Artemis missions III through VIII.
Imagination Technologies expands with new European design centre Imagination Technologies has opened a new design centre in Timisoara, Romania. The centre will focus on IP designed for artificial intelligence (AI) and computer vision.
AKI Electronic becomes Schurter Electronics As part of the further integration into the Schurter Group, AKI Electronic spol. s r.o. changes its name to SCHURTER Electronics spol. s r.o.
From Bosch to Silicon Mobility - Kallenbach takes the helm Automotive semiconductor company, Silicon Mobility, has appointed former Robert Bosch GmbH executive Rainer Kallenbach as CEO of the company as of January 6, 2020. The current CEO Bruno Paucard will remain with the company as COO and on the Board of Directors.
Sponsored content by CMLCML manufactures Insulated Metal Substrate (IMS) solutions Printed circuit boards (PCBs) plays an important role in our day to day life. Whether it’s the car you’re driving, the phone that you’re scrolling through or computers that you’re sending emails from. What happens when you use heat generating components on a PCB? That’s right, cooling is needed!
NEXT Biometrics reorganises - reduces headcount NEXT Biometrics says it is executing a program to optimise the organisation and cost base with its strategic priorities and market opportunities; which also translates to layoffs
LPKF delivers laser system to semiconductor industry customer In December, LPKF delivered – for the first time – a highly automated version of its LIDE system for integration into a semiconductor fab to an unnamed semiconductor manufacturers.
ROHM company SiCrystal & STMicro ink wafer supply deal ROHM and STMicroelectronics have signed a multi-year silicon carbide (SiC) wafers supply agreement with SiCrystal, a ROHM group company having a top share of SiC wafers in Europe.
Cadence expands collaboration with Broadcom Cadence Design Systems says it has expanded its collaboration with Broadcom Inc. for the creation of semiconductor solutions targeting next-generation networking, broadband, enterprise storage, wireless and industrial applications.
Marvell expands R&D footprint in India Marvell has announced the addition of its new facility in Bangalore, part of Marvell India Private Limited, the company’s second largest research and development (R&D) effort spanning three sites – Bangalore, Pune and Hyderabad.
imec spin-off raises €4,5 million in funding MICLEDI Microdisplays, the latest spin-off of imec, has raised EUR 4,5 million seed capital from imec.xpand, with participation of PMV and FIDIMEC.
Synopsys to acquire certain IP assets of INVECAS The acquisition broadens the company’s IP portfolio and adds a team of experienced R&D engineers to the company’s development department.
Fire at Kioxia's Yokkaichi NAND fab A fire broke out at Kioxia’s Yokkaichi plant – a joint venture facility owned by Kioxia and Western Digital – in Japan on January 7.
New Hella electronics JV starts production in China The joint venture HELLA BHAP Electronics has started production. The company was founded in 2018 by HELLA and BHAP, one of the largest automotive suppliers in China.
European backing for Prodrive's growth plans The European Investment Bank is providing a EUR 50 million loan to Dutch technology company Prodrive Technologies.
Murata acquires 3DHaptics company Murata Manufacturing and MIRAISENS, which offers haptic solutions technology using 3DHaptics technology, have signed an agreement for MIRAISENS to become a wholly-owned subsidiary of Murata Manufacturing.
Diodes updates on Lite-On acquisition Since the initial announcement of the acquisition back in August, 2019, all customary closing conditions have been met, including approval by the Lite-On shareholders. In conjunction, Diodes has been working through the final process of securing the required regulatory approvals in both Taiwan and China.
Grant helps Diodes to grow in Greenock Semiconductor manufacturer Diodes Incorporated has received a GBP 13.7 million funding package from Scottish Enterprise towards a GBP 47 million project enabling its future growth in Greenock, Scotland.
Murata starts construction on new production building Okayama Murata Manufacturing Co., Ltd. (Setouchi, Okayama Prefecture), started construction on a new production building in December 2019.Load more news