Business | March 29, 2019
Toshiba’s new semi company aims to bring efficiency to R&D
Toshiba Electronic Devices & Storage Corporation (TDSC) is cosolodationg two of its subsidiaries, Toshiba Microelectronics Corporation (TOSMEC) and Toshiba Discrete Semiconductor Technology Corporation (TDIT), into a new company, Toshiba Electronic Device Solutions Corporation (TEDS).
The move is expected to strengthen capabilities in proposing solutions and bringing greater efficiency to R&D for the semiconductor business. The new company will start operation on April 1. TDIT’s business covers product development and technical sales for discrete semiconductors, while TOSMEC provides services for system LSI, ranging from product planning, development and design to testing and failure analysis. Following the merger, TEDS will be responsible for product planning, product development, failure analysis and solution proposals for the semiconductor business, and will cooperate with TDSC as the engineering arm of its semiconductor business. The company says that the merger will also bring greater efficiency to product development and sales promotion, and to the provision of shared services.
JEOL Ltd. acquires Integrated Dynamic Electron Solutions JEOL Ltd. , manufacturer of semiconductor equipment and other industrial instruments and equipment, announced the acquisition of Integrated Dynamic Electron Solutions Inc. (IDES), an entrepreneurial venture specializing in technologies related to transmission electron microscopy (TEM).
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AKI Electronic becomes Schurter Electronics As part of the further integration into the Schurter Group, AKI Electronic spol. s r.o. changes its name to SCHURTER Electronics spol. s r.o.
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Sponsored content by CMLCML manufactures Insulated Metal Substrate (IMS) solutions Printed circuit boards (PCBs) plays an important role in our day to day life. Whether it’s the car you’re driving, the phone that you’re scrolling through or computers that you’re sending emails from. What happens when you use heat generating components on a PCB? That’s right, cooling is needed!
NEXT Biometrics reorganises - reduces headcount NEXT Biometrics says it is executing a program to optimise the organisation and cost base with its strategic priorities and market opportunities; which also translates to layoffs
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ROHM company SiCrystal & STMicro ink wafer supply deal ROHM and STMicroelectronics have signed a multi-year silicon carbide (SiC) wafers supply agreement with SiCrystal, a ROHM group company having a top share of SiC wafers in Europe.
Cadence expands collaboration with Broadcom Cadence Design Systems says it has expanded its collaboration with Broadcom Inc. for the creation of semiconductor solutions targeting next-generation networking, broadband, enterprise storage, wireless and industrial applications.
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imec spin-off raises €4,5 million in funding MICLEDI Microdisplays, the latest spin-off of imec, has raised EUR 4,5 million seed capital from imec.xpand, with participation of PMV and FIDIMEC.
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Fire at Kioxia's Yokkaichi NAND fab A fire broke out at Kioxia’s Yokkaichi plant – a joint venture facility owned by Kioxia and Western Digital – in Japan on January 7.
New Hella electronics JV starts production in China The joint venture HELLA BHAP Electronics has started production. The company was founded in 2018 by HELLA and BHAP, one of the largest automotive suppliers in China.
European backing for Prodrive's growth plans The European Investment Bank is providing a EUR 50 million loan to Dutch technology company Prodrive Technologies.
Murata acquires 3DHaptics company Murata Manufacturing and MIRAISENS, which offers haptic solutions technology using 3DHaptics technology, have signed an agreement for MIRAISENS to become a wholly-owned subsidiary of Murata Manufacturing.
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Grant helps Diodes to grow in Greenock Semiconductor manufacturer Diodes Incorporated has received a GBP 13.7 million funding package from Scottish Enterprise towards a GBP 47 million project enabling its future growth in Greenock, Scotland.
Murata starts construction on new production building Okayama Murata Manufacturing Co., Ltd. (Setouchi, Okayama Prefecture), started construction on a new production building in December 2019.Load more news