Nexperia uses Aixtron equipment as it enters the SiC market
Semiconductor manufacturer Nexperia, is using Aixtron's production technology to enter the high performance SiC device market.
Micron and UMC team up to strengthen supply chains
Micron says it is expanding its business relationship with United Microelectronics Corporation (UMC), which will provide "Micron opportunities to secure supply for automotive, mobile and critical customers into the future."
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With the rapid development of electronic technology in recent years, printed circuit board (PCB) products are pursuing higher heat dissipation capabilities, with high voltage and high current characteristics, and are developing towards high-density interconnection technology (HDI).
Global Semiconductor equipment billings jump 38% YoY in Q3
Global semiconductor equipment billings increased a robust 38% year-over-year to US D26.8 billion in the third quarter of 2021, an 8% rise from the prior quarter to register their fifth consecutive quarter-over-quarter record high, SEMI reports.
Littelfuse completes its acquisition of Carling
Littelfuse has completed its previously announced acquisition of Carling Technologies.
Amphenol acquires Halo Technology
Amphenol Corporation announces that the company has acquired Halo Technology Limited for approximately USD 715 million. Separately, Amphenol also announced the closing of the sale of the MTS Test & Simulation business to Illinois Tool Works Inc.
Jenoptik completes the acquisition of BG Medical and SwissOptic
With these acquisitions, Jenoptik continues to focus on its core competency in photonics while speeding up profitable and sustainable growth.
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Are Encapsulation Resins Suitable for EV Applications?
Beth Turner from Electrolube (MacDermid Alpha Electronic Solutions) discusses how and where encapsulation resins can be incorporated into electric vehicle design to protect vital electronics and improve overall efficiency.
TouchNetix gains automotive qualification for family of touchscreen controller ICs
UK manufacturer of high-performance touchscreen controller ICs, TouchNetix, announces that its aXiom AX112 user interface chip has gained qualification to the Automotive Electronics Council’s AEC-Q100-6 standard, validating the device’s use in applications such as the central information display in passenger cars and other types of vehicles.
Mercury Systems acquires RF module manufacturer
Mercury Systems announces that the company has acquired Norcross, Georgia based RF module manufacturer, Atlanta Micro.
Syntronixs Asia becomes part of Infineon
German semiconductor manufacturer, Infineon, has via its subsidiary Infineon Technologies (Malaysia) Sdn. Bhd. acquired Syntronixs Asia Sdn. Bhd., a Melaka-based electroplating company.
Intel’s EU investment: Details to be expected soon
Earlier this year US chip manufacturer Intel launched a USD 20 billion expansion plan which would see the construction of two new chip plants in Arizona – as well as an expansion in Europe.
X-FAB releases statement following explosion at Texas fab
On November 12, 2021, an explosion occurred at X-FAB’s site in Lubbock, Texas, during maintenance work done at the deionized water system. One employee lost his life, another employee was taken to hospital with non-life-threatening injuries and was later released.
AKM provides an update on its fire damaged fab
In late October last year a fire broke out at Asahi Kasei Microsystem’s (AKM) semiconductor factory in Nobeoka, Miyazaki prefecture. The fire completely ravished the fab and took a total of three days to completely extinguish. But how does the company fare today?
Micron and UMC reaches a global settlement
According to the global settlement agreement, both companies will globally withdraw their complaints against the other party, and UMC will make a one-time payment of an undisclosed amount to Micron.
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A*STAR and STMicro team up on SiC R&D for the EV market
The Institute of Microelectronics (IME) at the Agency for Science, Technology and Research (A*STAR) and STMicroelectronics are launching an R&D collaboration in the field of silicon carbide for power-electronics applications in the automotive and industrial markets.
Jenoptik signs agreement to sell Vincorion
Jenoptik AG has signed an agreement to sell the Vincorion division. It will be acquired by a fund managed by private equity firm STAR Capital Partnership LLP.
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NAND Flash revenue rises by 15% QoQ for 3Q21
The growth of the NAND Flash market in 3Q21 was primarily driven by strong demand from the data center and smartphone industries, according to TrendForce’s latest investigations.
Qualcomm acquires Clay AIR
Clay AIR, an AI powered hand tracking and gesture recognition technology company, has been acquired by Qualcomm.
AmpliTech to acquire Spectrum Semiconductor Materials
AmpliTech Group, a designer, developer and manufacturer of signal-processing components, has executed a definitive agreement to acquire the assets and operations of San Jose-based Spectrum Semiconductor Materials Inc., a specialty distributor of semiconductor components.
Veeco ships first system from new manufacturing facility
Veeco Instruments says that the company has shipped the first LSA101 Laser Spike Annealing System from its new San Jose, California facility to an unnamed semiconductor manufacturer.
Smith to divest its Its solar division
The distributor of electronic components says that it has signed an agreement to sell its solar sales and services division, known as ONTILITY Powered by Smith, to BBB Industries, LLC under its new division, TerrePower.
TTI to acquire SMD Inc.
Specialty distributor of electronic components, TTI, Inc.,has entered into a purchase agreement to acquire SMD Inc., a privately held electronic component distributor headquartered in Irvine, California.
Former GlobalFoundries executive to lead IQE
Following an extensive and rigorous search process, the board of the UK supplier of compound semiconductor wafer products announces that it has appointed Americo Lemos as Chief Executive Officer, starting on 10 January 2022.
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