“Our Singapore location is already one of our largest R&D locations in Asia. Its position is strategic as Singapore is one of Asia’s four tigers, and an important financial and trade center”, says Ralph Lauxmann, head of Systems & Technology, member of the Chassis & Safety management board, and head of the Automated Driving project house at Continental. “With the joint autonomous driving R&D team we have expanded the network of our Automated Driving project house to another important location. Together with EasyMile, we are proud to contribute to the Singapore Smart City Initiative. It is a privilege for our AV team to be part of this journey into the future. The results can also be used as a blueprint for the deployment of driverless systems in other regions of the world.”
Gilbert Gagnaire, CEO of EasyMile SAS, confirmed during the inauguration: “I am delighted to further extend the already deep collaboration between Continental and EasyMile. For the past four years, EasyMile has demonstrated its leadership in deploying reliable and safe autonomous systems. The Continental and EasyMile joint R&D team in Singapore is an important step to accelerate the development of new technology for global markets as well as to benefit the advance and dynamism of Singapore’s autonomous driving ecosystem to further test our products.”
Ingun's going global; expands in Latin America and Eastern Europe
Benjamin Sontag (INGUN Prüfmittel GmbH) gave a short update on expansion plans in Latin America and Eastern Europe.
Yageo to acquire KEMET in a $1.8 billion deal
Yageo Corporation and KEMET Corporation have entered into a definitive agreement under which Yageo will acquire all of the outstanding shares of KEMET’s common stock for USD 27.20 per share in an all-cash transaction valued at USD 1.8 billion.
EVG and DELO partner to expand materials and process capabilities
Supplier of wafer bonding and lithography equipment for the MEMS and semiconductor industry, EV Group (eVG), is partnering with DELO, a manufacturer of industrial high-tech adhesives, in the area of wafer-level optics.
Osram recommends current takeover offer from ams
Osram says it has concluded a business combination with Austrian chipmaker ams and is recommending its shareholders to accept the current takeover offer.
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EpiWorld speeds up commercialisation of SiC devices with AIXTRON
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FlexEnable makes acquisition for flex displays
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Samsung’s CPU project ends, layoffs in CA and TX
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Marvell completes acquisition of Avera Semi
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IAR Systems opens office in Taiwan
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ZF and Cree partners up to advance the electric drive
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Broadcom completes acquisition of Symantec Enterprise Security business
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AVX acquires Chengdu OK New Energy
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Vesper names new SVP of worldwide sales & business development
MEMS sensor company Vesper, announces that Lorenzo Ponzanelli has joined the company as senior vice president of worldwide sales and business development, overseeing sales strategy and execution to drive global growth.
Gigaphoton establishes new company in China
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Acal BFi signs pan-European agreement with Champs Technologies
Acal BFi says it has added Champs Technologies to its magnetics portfolio. Acal BFi is a Europe-wide specialist technology supplier and design partner with a specialist portfolio of magnetic cores and inductive components products and services.
POET’s sale of DenseLight Semi to close
POET Technologies Inc. announced the sale of its subsidiary, DenseLight Semiconductors Pte. Ltd. to DenseLight Semiconductor Technology (Shanghai) Co. Ltd. is scheduled to close on or before Friday, November 8, 2019.
Odyssey Semiconductor picks up wafer fab
Ithaca, New York’s Odyssey Semiconductor Technologies, specializing in high-voltage power switching components and systems based on proprietary gallium nitride (GaN) processing technology, has acquired an integrated semiconductor design, fabrication, test, and packaging facility.
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RBVC, Ford and BMW invests in flexible electric circuit start-up
Robert Bosch Venture Capital GmbH (RBVC), the venture capital company of the Bosch Group, announces that it has completed a series B follow-on investment in CelLink Corporation.
Alex Davern to step down as CEO of National Instruments
NI has announced that Alex Davern will step down as Chief Executive Officer of the company, effective January 31, 2020. The NI Board of Directors has appointed current President and COO, Eric Starkloff, as NI President and CEO, effective February 1, 2020.
RoodMicrotec takes leading role in APPLAUSE
A consortium of 31 key players for packaging of electronics, optics and photonics, equipment suppliers and testing experts from 11 countries launched a new project, “Advanced packaging for photonics, optics and electronics for low cost manufacturing in Europe,” simply called APPLAUSE.
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