© hannu viitanen dreamstime.com Business | November 15, 2018
Pickering invests £5M in UK and Czech facilities to meet demand
The Pickering Group is undergoing a significant expansion at its UK and Czech Republic sites in order to support growth and new product development.
The group of companies, which includes Pickering Electronics and Pickering Interfaces, has already completed a refurbishment of its UK interfaces’ site, and work at the relay company is due for completion in Q1 2019. In addition to redeveloping its global headquarters and manufacturing centre in the UK, Pickering is also investing in an additional 3'000 square metre facility in the Czech Republic. This Czech facility is already producing many of Pickering Interfaces’ switching and simulation products in the industry for PXI, LXI, and PCI applications, including value add assembly such as cable and connector solutions. In total, the investment in the UK and Czech is expected to reach GBP 5 millions, the company discloses in a press release. “Despite predictions as far back as the 1970s that our relay business would have a limited lifetime, we have seen exactly the reverse. We are challenged by our customers – including our sister company Pickering Interfaces - to deliver ever-higher performance in miniature packages, and that means that demand for our reed relays has never been higher. Similarly, demand for our simulation, test and verification products is also increasing, thanks to the complexity of today’s automotive and semiconductor manufacturing systems and the need for automated test processes. Therefore, we needed to streamline our manufacturing operations and add more capacity,” says CEO Keith Moore, in the release. The company is expecting this this to be an ongoing process, especially in Czech Republic as it is looking to add new products and support activities.
Farnell adds Sorensen power supplies to its roster Distributor Farnell announces that it has added Sorensen, the premier DC programmable power supply brand from Ametek, to its range of power supplies.
Infineon raises EUR 1 billion following successful share placement Infineon informs that the company placed 55 million new shares, following an accelerated bookbuilding process with institutional investors, under the exclusion of subscription rights. The shares were placed at a price of EUR19.30 per share, meaning that the company managed to raise EUR 1.06 billion.
Skeleton Technologies strengthens management with new COO Skeleton Technologies has appointed Ants Vill, former Vice President of Product, as Chief Operating Officer.
SiPearl chooses Germany for its first international operational subsidiary SiPearl, a designer of the microprocessor for the European exascale supercomputer, is opening its first international subsidiary in Duisburg, in the Ruhr region, Germany, in order to build closer connections with its German partners and future clients.
DELO reports increased revenues despite current pandemic DELO closed the financial year that ended on March 31 with a turnover of EUR 163 million. This is an increase of almost 5% compared to the previous year (EUR 156 million).
China falls far short of its "Made-in-China 2025" goal IC production in China represented 15.7% of its $125 billion IC market in 2019, up only slightly from 15.1% five years earlier in 2014. IC Insights forecasts that this share will increase by 5.0 percentage points to 20.7% in 2024 (one percentage point per year on average).
COVID-19 highlights the gravity of the secondary market for SME Cha Jin-Seok, Chief Financial Officer of SK Hynix, said it best in the company’s Q1 earnings call, “Because of a never experienced pandemic, even basic business activities such as maintaining normal operations and predicting future demand have become challenging tasks.”
GlobalFoundries to implement ITAR at US manufacturing facility GlobalFoundries plans to implement export control security measures at its most advanced manufacturing facility, Fab 8, in Malta, New York.
Rebound Electronics expands in Asia The independent supplier of electronic components says it is investing to increase its market coverage in Asia with the opening of several new offices and setting up a customer service & telesales centre.
Samsung expands foundry capacity with new production line Samsung Electronics says that it plans to boost its foundry capacity at the company's new production line in Pyeongtaek, Korea, to meet growing global demand for extreme ultraviolet (EUV) solutions.
Super Dry Totech expands Long Term Storage Solutions offering The most recent development for Super Dry Totech, is the acquisition of a new building to expand on capacity & to minimise risk by assuring continuity should a disrupting incident occur in one of the facilities.
Ynvisible acquires electrochromic display company rdot Printed electronics specialist, Ynvisible Interactive, announces that it will acquire the printed electrochromic displays business of rdot AB of Gothenburg, Sweden.
Manz receives follow-up order for display production equipment Manz says it has received an order with a total volume in the low double-digit million euro range for display production equipment.
Aehr Receives initial order from new customer for FOX-NP solution Aehr Test Systems says it has received orders from a new customer and their subcontract manufacturing supplier for a FOX solution including a FOX-NP full wafer test system, an initial WaferPak Contactor, and a FOX WaferPak Aligner to perform production qualification of their silicon photonics devices.
AIM names new director of product management AIM Solder has appointed Timothy O’Neill to the position of Director of Product Management.
Seoul Semi files patent suit against automotive LED light distributor Seoul Semiconductor says it has filed a patent infringement lawsuit in the United States District Court for the District of New Jersey against Onyx Enterprise Int’l Corp., a distributor of automotive components.
X-FAB expands foundry offering for silicon-based microfluidics In order to address heightening demands, X-FAB Silicon Foundries SE, has taken steps to simplify the integration of microfluidic elements with CMOS and SOI dies.Load more news