© ra2studio dreamstime.com Components | June 26, 2018
European Chip distribution market shows solid growth in Q1/2018
The European semiconductor industry continues to grow solidly in 2018. According to DMASS Ltd., semiconductor sales as reported by the members in Q1/2018 ended at a record EUR 2.28 billion, 6.9 percent over Q1/CY17 and 13 percent above Q4/CY17.
Georg Steinberger, chairman of DMASS: “As we face peak demand in many industries and long lead-times for many semiconductor products, the growth is no surprise. It could have been even higher, considering channel shifts back to some manufacturers and the negative exchange rate effects from a weak US-Dollar. It remains to be seen how sustainable this is, considering that customers have to push out production in many instances due to hard allocation in other component segments. Nevertheless, at the moment outlook is solid.” Regionally, the real surprise was the double-digit growth in smaller countries in Northern and Eastern Europe as well as in Austria and Iberia. Among the bigger regions, Italy grew fastest (9.7% to EUR 220 million), followed by Germany (6.4% to EUR 695 million) and the UK (6.3% to EUR 166 million). France reported below average growth of 3.4 percent to EUR 157 million. Eastern Europe in total grew 12 percent to EUR 366 million and Nordic by 5.4 percent to EUR 187 million. Georg Steinberger: “In a nutshell, the smaller countries grew faster than the big ones. The mix of fast-growing countries is surprising, however, reaching from smaller Nordic tech economies to increasingly critical production hubs in Eastern Europe. Italy’s high-tech industry continues to surprise positively as well.” A closer look at the products breakdown reveals strong and solid growth in Discretes (Small Signal, RF Discretes), Power Discretes (MOSFETs) and Sensors as well as in Programmable Logic – all double-digit – while Opto, Analog, Memories and Other Logic (ASSPs) came in short – between 1 and 2.5 percent. Analog, the biggest product group, grew by 2.4 percent to 672 EUR million, MOS Micro by 8 percent to 477 EUR million, Power by 16.9 percent to 241 EUR million, Opto (including LEDs) by 2.3 percent to EUR 217 million, Memories by 2.4 percent to EUR 184 million and Programmable Logic by 13.5 percent to EUR 153 million. Georg Steinberger: “Looking at the market by product, we cannot see a very consistent picture in Q1, some of the below-average increases in big product categories may be driven by allocation or channel shifts. However, one quarter does not really tell a story. After the dust of various market effects has settled, the situation may become clearer (and so far the weight of the big product groups has not really changed dramatically).”
Foxconn and Heraeus sign MoU Foxconn Technology Group and Heraeus have signed a Memorandum of Understanding for a strategic cooperation within the space of 5G.
BAE to pick up Collins Aerospace’s GPS business and Raytheon’s ATR business BAE Systems has reached definitive agreements for the proposed acquisitions of Collins Aerospace’s military Global Positioning System (GPS) business and Raytheon’s Airborne Tactical Radios (ATR) business.
JEOL Ltd. acquires Integrated Dynamic Electron Solutions JEOL Ltd. , manufacturer of semiconductor equipment and other industrial instruments and equipment, announced the acquisition of Integrated Dynamic Electron Solutions Inc. (IDES), an entrepreneurial venture specializing in technologies related to transmission electron microscopy (TEM).
NEXT receives major order for Indian government program NEXT Biometrics has received an order for UIDAI and STQC certified fingerprint biometric readers in India with a value of USD 750,000.
Sponsored content by CMLCML manufactures Metal Substrate solutions Printed circuit boards (PCBs) plays an important role in our day to day life. Whether it’s the car you’re driving, the phone that you’re scrolling through or computers that you’re sending emails from. What happens when you use heat generating components on a PCB? That’s right, cooling is needed!
Cadence completes acquisition of AWR from NI Cadence Design Systems, Inc. has completed the acquisition of AWR Corporation from National Instruments Corporation.
Fiat Chrysler and Foxconn plans EV joint venture A new competitor in the industry for electric vehicles are in the making.
Collins Aerospace inks multimillion-dollar space contract Collins Aerospace Systems has signed a contract with Lockheed Martin to provide critical subsystems to support production of NASA’s Orion spacecraft fleet for Artemis missions III through VIII.
Imagination Technologies expands with new European design centre Imagination Technologies has opened a new design centre in Timisoara, Romania. The centre will focus on IP designed for artificial intelligence (AI) and computer vision.
AKI Electronic becomes Schurter Electronics As part of the further integration into the Schurter Group, AKI Electronic spol. s r.o. changes its name to SCHURTER Electronics spol. s r.o.
From Bosch to Silicon Mobility - Kallenbach takes the helm Automotive semiconductor company, Silicon Mobility, has appointed former Robert Bosch GmbH executive Rainer Kallenbach as CEO of the company as of January 6, 2020. The current CEO Bruno Paucard will remain with the company as COO and on the Board of Directors.
NEXT Biometrics reorganises - reduces headcount NEXT Biometrics says it is executing a program to optimise the organisation and cost base with its strategic priorities and market opportunities; which also translates to layoffs
LPKF delivers laser system to semiconductor industry customer In December, LPKF delivered – for the first time – a highly automated version of its LIDE system for integration into a semiconductor fab to an unnamed semiconductor manufacturers.
ROHM company SiCrystal & STMicro ink wafer supply deal ROHM and STMicroelectronics have signed a multi-year silicon carbide (SiC) wafers supply agreement with SiCrystal, a ROHM group company having a top share of SiC wafers in Europe.
Cadence expands collaboration with Broadcom Cadence Design Systems says it has expanded its collaboration with Broadcom Inc. for the creation of semiconductor solutions targeting next-generation networking, broadband, enterprise storage, wireless and industrial applications.
Marvell expands R&D footprint in India Marvell has announced the addition of its new facility in Bangalore, part of Marvell India Private Limited, the company’s second largest research and development (R&D) effort spanning three sites – Bangalore, Pune and Hyderabad.
imec spin-off raises €4,5 million in funding MICLEDI Microdisplays, the latest spin-off of imec, has raised EUR 4,5 million seed capital from imec.xpand, with participation of PMV and FIDIMEC.
Synopsys to acquire certain IP assets of INVECAS The acquisition broadens the company’s IP portfolio and adds a team of experienced R&D engineers to the company’s development department.
Fire at Kioxia's Yokkaichi NAND fab A fire broke out at Kioxia’s Yokkaichi plant – a joint venture facility owned by Kioxia and Western Digital – in Japan on January 7.
New Hella electronics JV starts production in China The joint venture HELLA BHAP Electronics has started production. The company was founded in 2018 by HELLA and BHAP, one of the largest automotive suppliers in China.
European backing for Prodrive's growth plans The European Investment Bank is providing a EUR 50 million loan to Dutch technology company Prodrive Technologies.
Murata acquires 3DHaptics company Murata Manufacturing and MIRAISENS, which offers haptic solutions technology using 3DHaptics technology, have signed an agreement for MIRAISENS to become a wholly-owned subsidiary of Murata Manufacturing.
Diodes updates on Lite-On acquisition Since the initial announcement of the acquisition back in August, 2019, all customary closing conditions have been met, including approval by the Lite-On shareholders. In conjunction, Diodes has been working through the final process of securing the required regulatory approvals in both Taiwan and China.Load more news