© Toshiba Memory Corp Products | June 22, 2018
Toshiba Memory deliver Value SAS SSDs targeting SATA applications
New RM5 value SAS series brings improved performance, reliability and capacity at a price point that enables SATA replacement in servers.[b][/b]
This is a product release announcement by Toshiba Memory Europe GmbH. The issuer is solely responsible for its content.
Toshiba Memory Europe (TME), European subsidiary of Toshiba Memory Corporation, unveiled today a new, game-changing category of SAS SSDs expected to replace SATA SSDs in server applications. The RM5 12Gbit/s value SAS (vSAS) series features capacity, performance, reliability, and manageability and data security advantages – at a price that obsoletes SATA SSDs. A homogeneous SAS environment has long been the gold standard for enterprise server and storage systems. With vertical integration expertise in flash technology, firmware and controller design, Toshiba Memory Corporation leveraged its leading position as the world’s leading SAS SSD line optimising RM5 to close the cost gap with SATA – and usher in a new class of SSDs. SATA simply cannot compete with SAS, falling well short in terms of performance, robustness, and encryption options. “Designed with affordability and server applications in mind, the Toshiba RM5 vSAS series seeks to provide a cost effective and much higher performing solution to overcome the bottlenecks that are inherent with SATA today,” Comments Paul Rowan, General Manager for the SSD unit at Toshiba Memory Europe. Where SATA drives often use SAS expanders to scale out, the RM5 enables the use of native SAS from end-to-end, eliminating the need for protocol translation to SATA. Customers can now take full advantage of SAS’s richer feature set and realise performance throughput superiority over SATA. Featuring Toshiba Memory Corporation’s BiCS FLASH TLC (3-bit-per-cell) 3D flash memory, the RM5 series will initially be available in capacities up to 7.68TB with a single 12Gbit/s port, SFF-8639 connector and in a 2.5-inch form factor. Sample shipments to OEM customers started in limited quantities, and Toshiba will gradually increase shipments from the third calendar quarter of 2018. The RM5 series will be exhibited at HPE (Hewlett Packard Enterprise) Discover in Las Vegas, U.S.A. until June 21, in the Toshiba Memory America booth #196. NOTES *All other company names, product names, and service names mentioned herein may be trademarks of their respective companies.  SAS unit shipments, IDC Worldwide Solid State Storage Quarterly Update: Summary CY 1Q1 May 2018  Definition of capacity: Toshiba Memory Corporation defines a gigabyte (GB) as 1,000,000,000 bytes and a terabyte (TB) as 1,000,000,000,000 bytes. A computer operating system, however, reports storage capacity using powers of 2 for the definition of 1GB = 230 bytes = 1,073,741,824 bytes, 1TB = 240 bytes = 1,099,511,627,776 bytes and therefore shows less storage capacity. Available storage capacity (including examples of various media files) will vary based on file size, formatting, settings, software and operating system, such as Microsoft Operating System and/or pre-installed software applications, or media content. Actual formatted capacity may vary.
Infineon and Fingerprint team up to drive mass deployment of biometric cards With biometric payment cards an integrated fingerprint sensor make contactless payments more convenient, more secure and hygienic; something that the current global situation has highlighted a need for.
Silicon Mitus starts mass-producing automotive OLED PMIC Power management IC (PMIC) specialist Silicon Mitus, has completed the development of an automotive OLED PMIC and says it will start supplying the new products in the global automotive market.
Farnell signs new distribution agreement with KOA Farnell says it has strengthen the depth and breadth of its passive component range with the addition of KOA Europe GmbH.
II-VI with domestic and foreign acquisitions Compound semiconductor specialist, II-VI Incorporated, has entered into a definitive agreement to acquire all outstanding shares in Swedish SiC epitaxial wafers specialist, Ascatron AB. At the same time, II-VI says it will acquire all the outstanding interests of the owners of the parent of INNOViON Corporation.
Microsoft invests in AI Chip company Syntiant, a deep learning tech company providing AI voice and sensor solutions, has completed a USD 35 million Series C funding round.
Meyer Burger sells its microwave and plasma maker Muegge Meyer Burger Technology is selling its microwave and plasma technology company Muegge GmbH, to investment company HQ Equita.
ON Semi looking to sell Japanese facility ON Semiconductor is exploring a sale of its manufacturing facility in Niigata, Japan. The intended sale of the facility is part of the company’s plan to optimise its manufacturing footprint and sharpen its focus on highly differentiated power, analog and sensor products.
New VP of business development at Smith The distributor of electronic components and semiconductors has appointed Renato Souza to the position of Vice President of Business Development. Renato previously served as Vice President, Latin America of Smith since 2017.
Bosch launches 5G tests at Reutlingen wafer fab The German company believes 5G will be a key building block of digitalization and connectivity in manufacturing and logistics. And for that reason, Bosch is now starting compatibility tests and channel measurements for setting up a 5G network in its wafer fab in Reutlingen.
ACM Research receives orders from two new analog/power IC customers The supplier of wafer cleaning technologies for advanced semiconductor devices, has received purchase orders and final stage bidding activities for a total of USD 36 million from two new China-based customers that manufacture analog and power IC devices.
ClassOne's Solstice plating system selected for advanced MicroLEDs Semiconductor equipment manufacturer ClassOne Technology announces the sale of its Solstice GoldPro electroplating system to an unnamed developer of microLED technology for advanced applications.
Jenoptik: order intake down on prior year; order backlog slightly up From January through early March business performance was in line with expectations, but clear impacts of the corona pandemic and increasing uncertainty within the automotive industry became apparent from late March on.
Smiths Detection completes acquisition of PathSensors Smiths Detection has completed the acquisition of PathSensors, a bio-technology solutions and environmental-testing company, based in Baltimore, MD, USA.
Saab divests Dutch-based QPS Saab has divested the Dutch-based company QPS (Quality Positioning Services), a provider of hydrographic software solutions within the global maritime industry. The decision is in line with Saab’s strategy to optimise its product portfolio and increase focus on five core areas.
Eyeing SiC and GaN potential – GlobalWafers team up with NCTU Advancements in 5G and electric vehicle technologies are bringing the mounting demands of power semiconductor. GlobalWafers is teaming up with the National Chiao Tung University (NCTU) to develop the third generation semiconductor material.
Phison expands with new R&D centre Taiwanese NAND Flash controller IC and storage solutions provider, Phison Electronics, broke ground on a new R&D center and inventory management in Guangyuan Science Park in Zhunan township, back in late march.
Infineon swings to loss as the pandemic continues impact target markets “Infineon has so far coped well with the challenging situation caused by the coronavirus pandemic. As a company, we reacted quickly to the new situation and established a framework that has enabled us to stabilize our business,” says CEO Dr. Reinhard Ploss.
Murata completes new production building The Japanese manufacturer’s subsidiary, Izumo Murata Manufacturing, has completed the construction of a new production facility which started back in August 2019.
Analog Devices team up with Intel to address 5G network design challenges The companies are collaborating to create a flexible radio platform that addresses 5G network design challenges and will enable customers to scale their 5G networks more quickly and economically.
Atlas Copco has acquired the technology and operating assets of iTrap The Swedish company has acquired a technology for process diagnostics and control in the semiconductor industry.Load more news